| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 02/07/2002 | US20020015292 Plastic chip-scale package having integrated passive components |
| 02/07/2002 | US20020014689 Multiple stacked-chip packaging structure |
| 02/07/2002 | US20020014673 Method of making membrane integrated circuits |
| 02/07/2002 | US20020014004 High density integrated circuit apparatus, test probe and methods of use thereof |
| 02/07/2002 | DE10034886A1 Optisches Mehrfachbauteil, insbesondere zur Verwendung mit Leuchtdioden Multiple optical component, in particular for use with light-emitting diodes |
| 02/06/2002 | EP1178595A2 Arrangement with a low inductance for circuit |
| 02/06/2002 | EP1178593A1 Semiconductor press stack |
| 02/06/2002 | EP1178584A2 Vehicle power distributor and method of producing the same |
| 02/06/2002 | EP1178530A2 Three-dimensional processor using transferred thin film circuits |
| 02/06/2002 | EP1177605A2 Laser diode device and method for producing the same |
| 02/06/2002 | EP1177580A1 Compact detection device for a gamma camera |
| 02/06/2002 | EP1097467A4 Ic stack utilizing secondary leadframes |
| 02/06/2002 | EP0953186B1 Chip card module |
| 02/06/2002 | CN2476103Y Electric power semiconductor integrated support |
| 02/06/2002 | CN1334963A Scalable data processing apparatus |
| 02/06/2002 | CN1334602A Semiconductor device and packaging method |
| 02/05/2002 | USRE37539 Sealed stacked arrangement of semiconductor devices |
| 02/05/2002 | US6344973 Power module with a circuit arrangement comprising active semiconductor components and passive components, and method for producing same |
| 02/05/2002 | US6344683 Stacked semiconductor package with flexible tape |
| 02/05/2002 | US6344682 Semiconductor device comprising a semiconductor element mounted on a substrate and covered by a wiring board |
| 02/05/2002 | US6344664 Electro-optical transceiver system with controlled lateral leakage and method of making it |
| 02/05/2002 | US6344401 Method of forming a stacked-die integrated circuit chip package on a water level |
| 01/31/2002 | WO2002009182A1 Method for distributed shielding and/or bypass for electronic device with three-dimensional interconnection |
| 01/31/2002 | WO2002009181A1 Vertically integrated chip on chip circuit stack |
| 01/31/2002 | US20020013061 Thinning and dicing of semiconductor wafers using dry etch, and obtaining semiconductor chips with rounded bottom edges and corners |
| 01/31/2002 | US20020013048 Solid state power amplifying device |
| 01/31/2002 | US20020013015 Method of manufacturing a semiconductor device |
| 01/31/2002 | US20020013008 Method of mounting chips |
| 01/31/2002 | US20020011676 Semiconductor structure having stacked semiconductor devices |
| 01/31/2002 | US20020011670 Semiconductor device manufacturing method including forming step of SOI structure and semiconductor device having SOI structure |
| 01/31/2002 | US20020011667 Semiconductor device and method for manufacturing same |
| 01/31/2002 | US20020011665 Spherical semiconductor device and method for fabricating the same |
| 01/31/2002 | US20020011663 Face-up semiconductor chip assemblies |
| 01/31/2002 | US20020011662 Packaging substrate and semiconductor device |
| 01/31/2002 | US20020011654 Semiconductor device |
| 01/31/2002 | US20020011652 Wafer thickness compensation for interchip planarity |
| 01/31/2002 | US20020011651 Semiconductor device and packaging method thereof |
| 01/31/2002 | US20020011650 Semiconductor Device |
| 01/31/2002 | US20020011350 Semiconductor apparatus |
| 01/31/2002 | US20020011264 Stacked photovoltaic element |
| 01/31/2002 | US20020011263 Multi-junction solar cell |
| 01/31/2002 | DE10064580C1 Optoelectronic unit for receiving optical signals for optical communications has two stacked detectors one with optically active surface of one of these detectors being screened |
| 01/31/2002 | DE10037533C1 Induktivitätsarme Schaltungsanordnung Inductance circuit |
| 01/31/2002 | DE10037420A1 High precision SMD light emitting diode has parallel resistance for reducing brightness of LED |
| 01/31/2002 | DE10033502A1 Optoelektronisches Modul, Verfahren zu dessen Herstellung und dessen Verwendung An optoelectronic module, process for its preparation and its use |
| 01/30/2002 | EP1176638A2 Semiconductor device and packaging method thereof |
| 01/30/2002 | EP1175693A1 Sub-package bypass capacitor mounting for an array packaged integrated circuit |
| 01/30/2002 | CN2475142Y Tier semiconductor |
| 01/30/2002 | CN2475141Y Multi-chip encapsulating device |
| 01/30/2002 | CN1333566A Semiconductor device |
| 01/30/2002 | CN1333133A Ink container and ink jet recorder installed with same |
| 01/29/2002 | US6343171 Systems based on opto-electronic substrates with electrical and optical interconnections and methods for making |
| 01/29/2002 | US6343030 Semiconductor device and pin arrangement |
| 01/29/2002 | US6343019 Apparatus and method of stacking die on a substrate |
| 01/29/2002 | US6342731 Vertically mountable semiconductor device, assembly, and methods |
| 01/24/2002 | WO2002007220A1 Semiconductor device |
| 01/24/2002 | WO2002007219A1 Semiconductor device and its manufacturing method |
| 01/24/2002 | WO2002007132A1 Image display unit and production method for image display unit |
| 01/24/2002 | WO2002007131A1 Passive radiation optical system module especially for use with light-emitting diodes |
| 01/24/2002 | US20020009860 Methods for manufacturing resistors using a sacrificial layer |
| 01/24/2002 | US20020009828 Process for the formation of a spatial chip arrangement and spatial chip arrangement |
| 01/24/2002 | US20020008967 Power module with a circuit arrangement comprising active semiconductor components and passive components, and method for producing same |
| 01/24/2002 | US20020008722 Ink jet recording apparatus utilizing solid semiconductor element |
| 01/24/2002 | US20020008541 Interconnect structure for a programmable logic device |
| 01/24/2002 | US20020008463 Display device and module therefor |
| 01/24/2002 | US20020008322 Enhanced barrier liner formation for via |
| 01/24/2002 | US20020008319 Commonly housed diverse semiconductor |
| 01/24/2002 | US20020008318 Semiconductor device |
| 01/24/2002 | US20020008312 Semiconductor device |
| 01/24/2002 | US20020008310 Vertically mountable semiconductor device, assembly, and methods |
| 01/24/2002 | US20020008309 Stacked subtrate and semiconductor device |
| 01/24/2002 | US20020008238 Electronic circuit unit suitable for miniaturization |
| 01/24/2002 | DE10132024A1 Halbleiter-Bauteil und Verfahren zu dessen Herstellung Semiconductor device and process for its preparation |
| 01/24/2002 | DE10034152A1 Vertical arrangement for connecting memory chips uses pair of circuit boards for high data rate |
| 01/24/2002 | DE10019812A1 Schaltungsanordnung Circuitry |
| 01/23/2002 | EP1174931A2 Light emitting device, display apparatus with an array of light emitting devices, and display apparatus method of manufacture |
| 01/23/2002 | EP1174921A2 Semiconductor device |
| 01/23/2002 | CN1332888A Vertically integrated semiconductor system |
| 01/22/2002 | US6340846 Making semiconductor packages with stacked dies and reinforced wire bonds |
| 01/22/2002 | US6340845 Memory package implementing two-fold memory capacity and two different memory functions |
| 01/22/2002 | US6340839 Hybrid integrated circuit |
| 01/22/2002 | CA2199796C An electronic-circuit assembly and its manufacturing method |
| 01/17/2002 | WO2002005546A1 Communication devices incorporating reduced area imaging devices |
| 01/17/2002 | WO2002005357A1 Led module, method for producing the same and the use thereof |
| 01/17/2002 | WO2002005356A1 Lamp with an led light source |
| 01/17/2002 | WO2002005351A1 Led light source |
| 01/17/2002 | WO2002005350A1 Method for producing an led light source |
| 01/17/2002 | WO2002005342A1 A solid state power amplifying device |
| 01/17/2002 | US20020006778 RF oscillator apparatus and transceiver apparatus |
| 01/17/2002 | US20020006749 Resin shield circuit device |
| 01/17/2002 | US20020006686 Die to die connection method and assemblies and packages including dice so connected |
| 01/17/2002 | US20020006685 Method of manufacturing an electronic power component, and an electronic power component obtained thereby |
| 01/17/2002 | US20020006040 Led luminaire with light control means |
| 01/17/2002 | US20020005729 Method and system for probing, testing, burn-in, repairing and programming of integrated circuits in a closed environment using a single apparatus |
| 01/17/2002 | US20020005698 Vehicular ac generator |
| 01/17/2002 | US20020005577 Semiconductor device |
| 01/17/2002 | US20020005576 Semiconductor device and method of manufacturing the same |
| 01/17/2002 | DE10030994A1 Halbleiter-Chip Semiconductor chip |
| 01/17/2002 | DE10023869A1 Anordnung einer Mehrzahl von Schaltungsmodulen Arrangement of a plurality of circuit modules |
| 01/16/2002 | EP1172864A1 Solar cell module |