| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 03/20/2002 | EP1189273A2 Semiconductor device and production process |
| 03/20/2002 | EP1189271A2 Wiring boards and mounting of semiconductor devices thereon |
| 03/20/2002 | EP1189270A2 Semiconductor device |
| 03/20/2002 | EP0870336B1 Surface mount led alphanumeric display |
| 03/20/2002 | CN1340857A Electronic device and method for manufacturing this device |
| 03/20/2002 | CN1340851A Electronic device and its manufacture method |
| 03/20/2002 | CN1340850A Assembling method for monolithic electronic member and monolithic electronic member |
| 03/19/2002 | US6359790 Multichip module having a silicon carrier substrate |
| 03/19/2002 | US6359785 Power diode and heat sink arrangement |
| 03/19/2002 | US6359536 High frequency multi-layer module with electronic component receiving aperture and conductive via |
| 03/19/2002 | US6359352 Vehicular AC generator |
| 03/19/2002 | US6359340 Multichip module having a stacked chip arrangement |
| 03/19/2002 | US6359333 Wafer-pair having deposited layer sealed chambers |
| 03/19/2002 | US6359331 High power switching module |
| 03/19/2002 | US6358772 Semiconductor package having semiconductor element mounting structure of semiconductor package mounted on circuit board and method of assembling semiconductor package |
| 03/19/2002 | US6357904 Linear illumination device |
| 03/19/2002 | US6357893 Lighting devices using a plurality of light sources |
| 03/14/2002 | WO2002021578A1 Semiconductor laser element |
| 03/14/2002 | US20020031904 Semiconductor device and method for manufacturing the same |
| 03/14/2002 | US20020031867 Semiconductor device and process of production of same |
| 03/14/2002 | US20020031864 Method of fabrication of stacked semiconductor devices |
| 03/14/2002 | US20020031859 Microwave semiconductor device and the manufacturing method thereof for improve heat discharge and electric property |
| 03/14/2002 | US20020031857 Vertically mountable semiconductor device and methods |
| 03/14/2002 | US20020031856 Repairable multi-chip package and high-density memory card having the package |
| 03/14/2002 | US20020031672 Sealed with silicon gel |
| 03/14/2002 | US20020030996 Method of manufacturing surface-emitting backlight, and surface-emitting backlight |
| 03/14/2002 | US20020030975 Packaged microelectronic die assemblies and methods of manufacture |
| 03/14/2002 | US20020030710 Ink tank and ink jet recording apparatus provided with the same |
| 03/14/2002 | US20020030532 Power module |
| 03/14/2002 | US20020030284 Method and apparatus for a semiconductor package for vertical surface mounting |
| 03/14/2002 | US20020030276 Dimple array interconnect technique for semiconductor device |
| 03/14/2002 | US20020030273 Semiconductor device and electron device |
| 03/14/2002 | US20020030270 Semiconductor device |
| 03/14/2002 | US20020030268 Hybrid integrated circuit device |
| 03/14/2002 | US20020030264 Integrated circuit device |
| 03/14/2002 | US20020030263 Multiple die stack apparatus employing T-shaped interposer elements |
| 03/14/2002 | US20020030262 Multiple die stack apparatus employing T-shaped interposer elements |
| 03/14/2002 | US20020030261 Multi-flip-chip semiconductor assembly |
| 03/14/2002 | US20020030258 Method and mold for manufacturing semiconductor device, semiconductor device, and method for mounting the device |
| 03/14/2002 | US20020030251 Resin-encapsulated semiconductor device |
| 03/14/2002 | US20020030250 Thick film millimeter wave transceiver module |
| 03/14/2002 | US20020030245 Semiconductor device, method of fabricating the same, stack-type semiconductor device, circuit board and electronic instrument |
| 03/14/2002 | US20020029799 Solar battery module |
| 03/14/2002 | US20020029798 Electronic apparatus with a solar battery |
| 03/14/2002 | DE10043660A1 Motor vehicle light has two LED matrices of different colors in common light body to form overall matrix; matrices are separately and independently controlled, distributed in same manner |
| 03/14/2002 | DE10043450A1 Improved method for mounting chips with protuberances in manufacturing process, for use in microelectronics |
| 03/14/2002 | DE10041686A1 Bauelement mit einer Vielzahl von Lumineszenzdiodenchips Device having a plurality of LED chips |
| 03/14/2002 | DE10041328A1 Verpackungseinheit für Halbleiterchips Package for semiconductor chips |
| 03/13/2002 | EP1187523A2 High-frequency module and manufacturing method of the same |
| 03/13/2002 | EP1187320A2 Method for manufacturing radio frequency module components with surface acoustic wave element |
| 03/13/2002 | EP1187211A2 Stacked Semiconductor Device |
| 03/13/2002 | EP1187210A2 Semiconductor device |
| 03/13/2002 | EP1187209A2 Electronic device incorporating stacked building blocks and process of manufacturing the same |
| 03/13/2002 | EP1187198A2 Metal-ceramic circuit board and manufacturing method thereof |
| 03/13/2002 | EP1186066A1 An electroluminescent or photocell device having protective packaging |
| 03/13/2002 | EP1186065A1 Flexible organic electronic device with improved resistance to oxygen and moisture degradation |
| 03/13/2002 | EP1186041A2 Low-inductance semiconductor component |
| 03/13/2002 | EP1186039A1 Security method and device for a chip stack with a multidimensional structure |
| 03/13/2002 | CN1339664A Light-emitting equipment using the light of light-emitting diode as base |
| 03/13/2002 | CN1339359A Ink jet recorder by using solid semiconductor element |
| 03/13/2002 | CN1080937C Printed circuit board bearing plate for ball grid array integrated circuit component |
| 03/12/2002 | US6356144 LSI core including voltage generation circuit and system LSI including the LSI core |
| 03/12/2002 | US6355977 Semiconductor chip or device having a connecting member formed on a surface protective film |
| 03/12/2002 | US6355976 Three-dimensional packaging technology for multi-layered integrated circuits |
| 03/12/2002 | US6355501 Three-dimensional chip stacking assembly |
| 03/07/2002 | WO2002019428A1 Cluster globular semiconductor device |
| 03/07/2002 | US20020028595 Method for assembling integral type electronic component and integral type electronic component |
| 03/07/2002 | US20020028532 Method of manufacturing a multi-chip semiconductor device effective to improve alignment |
| 03/07/2002 | US20020028530 High-frequency module and manufacturing method of the same |
| 03/07/2002 | US20020028527 Composite light-emitting device, semicon ductor light-emitting unit and method for fabricating the unit |
| 03/07/2002 | US20020028045 Optical coupling structures and the fabrication processes |
| 03/07/2002 | US20020027773 Sub-package bypass capacitor mounting for an array packaged integrated circuit |
| 03/07/2002 | US20020027446 Multi-purpose transistor array |
| 03/07/2002 | US20020027295 Stacked semiconductor device and method of producing the same |
| 03/07/2002 | US20020027293 Three dimensional semiconductor integrated circuit device and method for making the same |
| 03/07/2002 | US20020027283 Hermetically sealed semiconductor power module and large scale module comprising the same |
| 03/07/2002 | US20020027281 Semiconductor device |
| 03/07/2002 | US20020027275 Semiconductor device |
| 03/07/2002 | US20020027274 Semiconductor device and fabrication method |
| 03/07/2002 | US20020027266 Semiconductor device and a method of manufacturing the same |
| 03/07/2002 | US20020027265 Semiconductor device, method for fabricating the semiconductor device, lead frame and method for producing the lead frame |
| 03/07/2002 | US20020027229 Light emitting module and method of driving the same, and optical sensor |
| 03/07/2002 | US20020027201 Method and apparatus for obtaining radiation image data |
| 03/07/2002 | US20020027019 Semiconductor device and method of manufacture thereof, circuit board, and electronic instrument |
| 03/07/2002 | US20020027011 Multi-chip module made of a low temperature co-fired ceramic and mounting method thereof |
| 03/07/2002 | DE10041695A1 Capsule construction for flip-chip connected to chip and base has chip stuck onto base using surface adhesive flat encapsulation method, auxiliary chip stuck on to form housing |
| 03/07/2002 | DE10038968A1 Schaltungsanordnung mit wenigstens zwei Halbleiterkörpern und einem Kühlkörper Circuit arrangement having at least two semiconductor bodies and a heat sink |
| 03/07/2002 | DE10038213A1 Strahlungsquelle und Verfahren zur Herstellung einer Linsensform Radiation source and method for producing a Linsensform |
| 03/06/2002 | EP1184967A2 RF oscillator apparatus and transceiver apparatus |
| 03/06/2002 | EP1184912A1 Sealing film for solar cell and method for manufacturing solar cell |
| 03/06/2002 | EP1184905A1 Power feed and heat dissipating device for power semiconductor devices |
| 03/06/2002 | EP1183916A1 Sandwich-structured intelligent power module |
| 03/06/2002 | EP1183740A1 Concentrically leaded power semiconductor device package |
| 03/06/2002 | EP1183723A1 Circuit suitable for vertical integration and method of producing same |
| 03/06/2002 | EP1015220A4 Injection molding encapsulation for an electronic device directly onto a substrate |
| 03/06/2002 | EP0902977B1 Surface mount package with heat transfer feature |
| 03/06/2002 | CN2480990Y Color changeable multi-color type back lingting board for LED |
| 03/06/2002 | CN1339176A Semiconductor device, method and device for producing same, circuit board and electronic equipment |
| 03/06/2002 | CN1339175A Multiple chip module with integrated RF capabilities |
| 03/06/2002 | CN1338775A Semiconductor device and manufacture thereof, substrate of electric circuits and electronic device |