H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices

Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
11/2002
11/27/2002	EP1260196A2 Illumination device
11/27/2002	EP1260121A1 A printed circuit board assembly with improved bypass decoupling for bga packages
11/27/2002	CN2523117Y L-band high-power PIN diode single-pole triple-throw switch module
11/27/2002	CN1381906A Luminous device
11/27/2002	CN1381892A Cross stack type dual-chip package and its preparing process
11/26/2002	US6487086 Circuit module
11/26/2002	US6487085 High-frequency module and method of manufacturing the same
11/26/2002	US6487078 Electronic module having a three dimensional array of carrier-mounted integrated circuit packages
11/26/2002	US6486929 Bonded layer semiconductor device
11/26/2002	US6486561 Semiconductor light emitting element formed on a clear or translucent substrate
11/26/2002	US6486549 Semiconductor module with encapsulant base
11/26/2002	US6486548 Semiconductor module and power converting apparatus using the module
11/26/2002	US6486546 Low profile multi-IC chip package connector
11/26/2002	US6486545 Pre-drilled ball grid array package
11/26/2002	US6486544 Semiconductor device and method manufacturing the same, circuit board, and electronic instrument
11/26/2002	US6486541 Semiconductor device and fabrication method
11/26/2002	US6486540 Three-dimensional semiconductor device and method of manufacturing the same
11/26/2002	US6486538 Chip carrier having ventilation channels
11/26/2002	US6486528 Silicon segment programming apparatus and three terminal fuse configuration
11/26/2002	US6486071 Spherical shaped semiconductor integrated circuit
11/26/2002	US6485995 Electro-optical transceiver system with controlled lateral leakage and method of making it
11/26/2002	US6484708 Resin sealed electronic device
11/23/2002	CA2381792A1 Lighting apparatus for guiding light onto a light polymerizable piece to effect hardening thereof
11/21/2002	WO2002025732A3 Power module with integrated capacitor
11/21/2002	US20020173215 Light-producing display having high aperture ratio pixels
11/21/2002	US20020173192 Power semiconductor module with pressure contact means
11/21/2002	US20020173076 Multilayer laminate; high capacitance; wire bonding pad; sealing
11/21/2002	US20020172245 Semiconductor laser array
11/21/2002	US20020172025 Structure and method for fabrication of a leadless chip carrier with embedded inductor
11/21/2002	US20020171140 Tape carrier package (TCP) on which semiconductor chips are mounted and method of manufacuturing the same
11/21/2002	US20020171137 Semiconductor package substrate, semiconductor package
11/21/2002	US20020171136 Semiconductor device with stack of semiconductor chips
11/21/2002	US20020171127 Apparatus for routing signals
11/21/2002	US20020171109 Semiconductor device with SOI structure and method of manufacturing the same
11/21/2002	US20020171094 Semiconductor laser element
11/21/2002	US20020171090 Display device and display unit using the same
11/21/2002	US20020171078 Metal-oxide electron tunneling device for solar energy conversion
11/21/2002	US20020170173 Method of production of circuit board, semiconductor device, and plating system
11/21/2002	DE10141114C1 Circuit device has AC terminal element of circuit substrate cooled via terminal pin of base body thermally connected to heat sink
11/21/2002	DE10123232A1 Semiconductor module used as a MOSFET, JFET or thyristor has a damping material having electromagnetically damping properties provided in a sealing composition arranged within a housing
11/21/2002	DE10121136A1 Lighting device on chip card principle has circuit board with micro-LED chip or deposited light conducting substances offset by 90 degrees to conducting track carrying surfaces
11/20/2002	EP1257990A2 Light-emitting diode display systems and methods with enhanced light intensity
11/20/2002	CN1380702A Luminescent device
11/19/2002	US6483718 Semiconductor device and method of manufacture thereof, circuit board, and electronic instrument
11/19/2002	US6483328 Probe card for probing wafers with raised contact elements
11/19/2002	US6483189 Semiconductor device
11/19/2002	US6483185 Power module substrate, method of producing the same, and semiconductor device including the substrate
11/19/2002	US6483128 Connecting device for power semiconductor modules with compensation for mechanical stresses
11/19/2002	US6483021 Stacked photovoltaic element
11/19/2002	US6482679 Electronic component with shield case and method for manufacturing the same
11/19/2002	US6482677 Chip component assembly manufacturing method
11/14/2002	WO2002091469A2 Three-dimensional electronic device and relative manufacture method
11/14/2002	WO2002091441A2 Semiconductor device and method of making same
11/14/2002	WO2002090825A1 Lighting device using light-emitting diode
11/14/2002	US20020167830 Semiconductor device and process for manufacturing the same
11/14/2002	US20020167828 Leadframe-based module DC bus design to reduce module inductance
11/14/2002	US20020167807 Light emitting diode display having heat sinking circuit rails
11/14/2002	US20020167084 Structure and method for fabrication of a leadless chip carrier with embedded antenna
11/14/2002	US20020167081 Semiconductor device
11/14/2002	US20020167080 Power distribution in multi-chip modules
11/14/2002	US20020167022 Semiconductor device and method of making same
11/14/2002	US20020167015 Semiconductor light emitting device
11/14/2002	DE10144207A1 Structure for rapid data transfer via glass fibers/optical waveguides has electronic semiconductor circuits to group single semiconductor circuits and a common carrier metallized to produce electrically conductive contacts.
11/14/2002	DE10142116A1 Electronic component used as logical unit comprises first semiconductor chip and second semiconductor chip each having contact surfaces on their active surfaces, substrate with contact connection surfaces and external contact surfaces
11/14/2002	DE10122837A1 Power semiconductor module terminal elements, protruding from surface of housing
11/14/2002	DE10122724A1 Compact assembly forming component of image sensor, stacks and interconnects image sensor chip, integrated circuit and substrate on PCB
11/14/2002	DE10122722A1 Stacked structure for an image sensor has substrates forming an enclosed space in which sensor is located
11/14/2002	DE10122721A1 Stacked structure for an image sensor has substrates forming an enclosed space in which sensor is located
11/14/2002	DE10122720A1 Stack arrangement for an image sensor chip for electrically connecting to a circuit board
11/13/2002	EP1257055A2 Piezoelectric device
11/13/2002	EP1256132A1 Three-dimensional interconnection method and electronic device obtained by same
11/13/2002	EP1256131A1 Leadframe interposer
11/13/2002	EP0891648B1 Gas-insulated high-voltage semiconductor valve means
11/13/2002	EP0626099B1 Method of manufacturing a high density electronic circuit module
11/13/2002	CN2520568Y Power insulated gate bipolar and field-effect transistor grid isolation driving module
11/13/2002	CN1379617A 半导体器件 Semiconductor devices
11/13/2002	CN1094266C 配线器具用板 Appliances wiring board
11/12/2002	US6479890 Semiconductor microsystem embedded in flexible foil
11/12/2002	US6479757 Method of mounting a plurality of electronic parts on a circuit board
11/12/2002	US6479321 One-step semiconductor stack packaging method
11/12/2002	US6478627 Method and apparatus for forming modular sockets using flexible interconnects and resulting structures
11/07/2002	WO2002089540A1 Printed circuit board, its manufacturing method, and csp manufacturing methdo
11/07/2002	WO2002089222A1 Light source coupler, illuminant device, patterned conductor, and method for manufcturing light source coupler
11/07/2002	WO2002089209A1 High-frequency module and its manufacturing method
11/07/2002	WO2002089208A2 Arrangement comprising at least two different electronic semiconductor circuits
11/07/2002	WO2002089207A2 High performance, low cost microelectronic circuit package with interposer
11/07/2002	WO2002089197A1 Method for bonding wafers to produce stacked integrated circuits
11/07/2002	WO2001041207A9 Packaging of integrated circuits and vertical integration
11/07/2002	US20020166003 Method and apparatus for a failure-free synchronizer
11/07/2002	US20020164838 High density integrated circuits; multilayer semiconductor dies, dielectrics
11/07/2002	US20020164488 Ceramic substrate board and a metal alloy layer consisting mainly of aluminum formed on a surface portion of the ceramic substrate board, wherein the Vickers hardness of the metal alloy layer is not less than 25 and not more than 40.
11/07/2002	US20020163786 Chip stacks and methods of making same
11/07/2002	US20020163578 Hand-held computers incorporating reduced area imaging devices
11/07/2002	US20020163077 Semiconductor device with layered semiconductor chips
11/07/2002	US20020163075 Semiconductor package with embedded heat-dissipating device
11/07/2002	US20020163072 Method for bonding wafers to produce stacked integrated circuits
11/07/2002	US20020163067 Three-dimensionally embodied circuit with electrically connected semiconductor chips
11/07/2002	US20020162215 Method and apparatus for fabricating a circuit board with a three dimensional surface mounted array of semiconductor chips
11/06/2002	EP1255304A2 Photovoltaic element and method of producing same
11/06/2002	EP1255303A1 Light-emitting or light-detecting semiconductor module and method of manufacture thereof

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