| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 04/25/2002 | WO2002034021A2 Carrier-based electronic module |
| 04/25/2002 | WO2002033756A1 Led module |
| 04/25/2002 | WO2002033752A2 Electronic module having canopy-type carriers |
| 04/25/2002 | WO2002033751A2 Microelectronic substrate with integrated devices |
| 04/25/2002 | US20020049042 RF module |
| 04/25/2002 | US20020048955 Method for fabricating a thin, free-standing semiconductor device layer and for making a three-dimensionally integrated circuit |
| 04/25/2002 | US20020048916 Thinned, stackable semiconductor device having low profile |
| 04/25/2002 | US20020048849 Integrated circuits; sealed by conductive epoxy resin |
| 04/25/2002 | US20020048177 Apparatus and method for adjusting the color temperature of white semiconductor light emitters |
| 04/25/2002 | US20020048158 Semiconductor device and method of manufacture thereof, circuit board, and electronic instrument |
| 04/25/2002 | US20020047606 Power efficient LED driver quiescent current limiting circuit configuration |
| 04/25/2002 | US20020047605 Enhanced trim resolution voltage-controlled dimming LED driver |
| 04/25/2002 | US20020047596 Fault tolerant led display design |
| 04/25/2002 | US20020047593 Enhanced trim resolution voltage-controlled dimming led driver |
| 04/25/2002 | US20020047576 Voltage dimmable led display producing multiple colors |
| 04/25/2002 | US20020047359 Alternator for vehicle |
| 04/25/2002 | US20020047357 Support plinth for a power diode in a motor vehicle alternator |
| 04/25/2002 | US20020047214 Multi-chip package-type semiconductor device |
| 04/25/2002 | US20020047213 Multi-chip package type semiconductor device |
| 04/25/2002 | US20020047210 Semiconductor chip, wiring board and manufacturing process thereof as well as semiconductor device |
| 04/25/2002 | US20020047199 Semiconductor device, manufacturing method of semiconductor device, stack type semiconductor device, and manufacturing method of stack type semiconductor device |
| 04/25/2002 | US20020047198 Semiconductor device package and lead frame with die overhanging lead frame pad |
| 04/25/2002 | US20020047197 Semiconductor device module frame and group thereof |
| 04/25/2002 | US20020047196 Multi-chip module with extension |
| 04/25/2002 | US20020047132 Semiconductor device for controlling electricity |
| 04/25/2002 | US20020046873 Method for making a flexible circuit interposer having high-aspect ratio conductors |
| 04/25/2002 | US20020046854 Ball grid array semiconductor package with exposed base layer |
| 04/25/2002 | DE10047462A1 Leuchtdiode mit einem Leuchtkörper LED with a luminous body |
| 04/24/2002 | EP1199751A2 Chip arrangement |
| 04/24/2002 | EP1198835A1 Dual wafer attachment process |
| 04/24/2002 | EP1198797A1 Semiconductor memory chip module |
| 04/24/2002 | CN1346177A Method for making RF module element iwth sound wave surface wave unit |
| 04/24/2002 | CN1346132A Non-volatile semiconductor memory and system |
| 04/23/2002 | US6377464 Multiple chip module with integrated RF capabilities |
| 04/23/2002 | US6376921 Semiconductor device, method for fabricating the semiconductor device, lead frame and method for producing the lead frame |
| 04/23/2002 | US6376917 Semiconductor device |
| 04/23/2002 | US6376914 Dual-die integrated circuit package |
| 04/23/2002 | US6376909 Mixed-mode stacked integrated circuit with power supply circuit part of the stack |
| 04/23/2002 | US6376904 Redistributed bond pads in stacked integrated circuit die package |
| 04/23/2002 | US6376769 High-density electronic package, and method for making same |
| 04/23/2002 | US6376764 Solar cell battery replacement unit |
| 04/23/2002 | US6376280 Microcap wafer-level package |
| 04/23/2002 | US6375340 Led component group with heat dissipating support |
| 04/18/2002 | WO2002032002A1 High-frequency composite switch module |
| 04/18/2002 | WO2002032001A1 High-frequency composite switch module |
| 04/18/2002 | WO2002031868A1 Stacked wafer alignment method |
| 04/18/2002 | WO2002031763A1 Module having a lead frame equipped with components on both sides |
| 04/18/2002 | WO2001063664A3 Power conditioning substrate stiffener |
| 04/18/2002 | US20020045297 Membrane 3D IC fabrication |
| 04/18/2002 | US20020045292 Semiconductor device, method for manufacturing same and portable device |
| 04/18/2002 | US20020045290 Flip chip and conventional stack |
| 04/18/2002 | US20020044456 Luminaire based on the light emission of light-emitting diodes |
| 04/18/2002 | US20020044423 Method and apparatus for mounting and packaging electronic components |
| 04/18/2002 | US20020044215 Solid-state imaging apparatus and camera using the same |
| 04/18/2002 | US20020043986 Ball grid array chip packages having improved testing and stacking characteristics |
| 04/18/2002 | US20020043923 Image display unit and production method thereof |
| 04/18/2002 | US20020043719 Semiconductor device |
| 04/18/2002 | US20020043717 Semiconductor device |
| 04/18/2002 | US20020043709 Stackable integrated circuit |
| 04/18/2002 | US20020043708 Semiconductor module |
| 04/18/2002 | US20020043664 Semiconductor device |
| 04/18/2002 | US20020043658 Apparatus and methods of packaging and testing die |
| 04/18/2002 | US20020043400 Semiconductor device |
| 04/18/2002 | DE10146936A1 Herstellverfahren für eine Chipkomponenten-Baugruppe Manufacturing method of a chip component assembly |
| 04/18/2002 | DE10138711A1 Electrical sub-assembly includes components coupled to different regions of casing for thermal dissipation, which are thermally-isolated from each other |
| 04/18/2002 | DE10051338A1 Liquid-cooling device for high-power semiconductor module, has housing with cooling surface and enclosing a liquid-flowed space |
| 04/18/2002 | DE10048436A1 Electronic switch for heavy currents at high voltage and low temperatures comprises parallel FET power semiconductors between pressure plates |
| 04/17/2002 | EP1198005A1 Semiconductor module and method of mounting |
| 04/17/2002 | EP1198000A1 Semiconductor device and assembly board |
| 04/17/2002 | EP1196951A1 Tsop memory chip housing arrangement |
| 04/17/2002 | EP1196800A1 Optomodule |
| 04/17/2002 | EP1050078B1 Microsystem and method for the production thereof |
| 04/17/2002 | CN1345083A Semiconductor device and its manufacture |
| 04/16/2002 | US6373455 Electroluminescence device, electroluminescence apparatus, and production methods thereof |
| 04/16/2002 | US6373348 High speed differential attenuator using a low temperature co-fired ceramic substrate |
| 04/16/2002 | US6373133 Multi-chip module and heat-sink cap combination |
| 04/16/2002 | US6373129 Semiconductor apparatus with pressure contact semiconductor chips |
| 04/16/2002 | US6373063 Method and apparatus for reading and recording image information |
| 04/16/2002 | US6372977 Electronic apparatus with a solar battery |
| 04/16/2002 | US6372623 Semiconductor device and method of fabrication |
| 04/16/2002 | US6372527 Methods of making semiconductor chip assemblies |
| 04/16/2002 | CA2276023C Compact flexible circuit configuration |
| 04/11/2002 | WO2002029904A1 Receiving optics and photosemiconductor device having the same |
| 04/11/2002 | WO2002029890A2 Semiconductor stacked die devices and methods of forming semiconductor stacked die devices |
| 04/11/2002 | US20020042218 Automotive bridge rectifier assembly with thermal protection |
| 04/11/2002 | US20020042187 Electro-optical transceiver system with controlled lateral leakage and method of making it |
| 04/11/2002 | US20020042164 Electronic device assembly and a method of connecting electronic devices constituting the same |
| 04/11/2002 | US20020042163 Stacked semiconductor package and fabricating method thereof |
| 04/11/2002 | US20020042161 Chip component assembly manufacturing method |
| 04/11/2002 | US20020041476 Automotive bridge rectifier assembly with thermal protection |
| 04/11/2002 | US20020041037 Semiconductor device and process of producing same |
| 04/11/2002 | US20020041033 Semiconductor device and method of production of same |
| 04/11/2002 | US20020041027 Semiconductor device |
| 04/11/2002 | US20020041021 Semiconductor device, semiconductor module and hard disk |
| 04/11/2002 | US20020041020 Memory system and connecting member |
| 04/11/2002 | US20020041015 Semiconductor chip, semiconductor device, methods of fabricating thereof, circuit board and electronic device |
| 04/11/2002 | US20020040990 Nonvolatile semiconductor memory device and nonvolatile semiconductor memory system |
| 04/11/2002 | US20020040983 Silicon wafer with embedded optoelectronic material for monolithic OEIC |
| 04/11/2002 | DE10049723A1 Arrangement of active semiconductors for controlling an electric energy flux with heat dispersion |
| 04/11/2002 | DE10046881A1 Light body has control unit with flip-flop assembly that produces clock signal for switch-through unit such as field effect transistor, relay, transistor or similar |