H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices

Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
12/2002
12/12/2002	US20020185649 Light emitting device
12/12/2002	US20020185601 Microbolometer focal plane array with controlled bias
12/12/2002	US20020185171 Solar cell substrate with thin film polysilicon
12/12/2002	DE10124774A1 Halbleiterbauelement mit zumindest einem Halbleiterchip auf einem als Substrat dienenden Basischip und Verfahren zu dessen Herstellung A semiconductor device comprising at least a semiconductor chip on a substrate serving as a base chip and process for its preparation
12/11/2002	EP1265286A2 Integrated circuit structure
12/11/2002	EP1265282A2 Circuit Assembly
12/11/2002	EP1264347A2 Electronic module having a three dimensional array of carrier-mounted integrated circuit packages
12/11/2002	EP1264346A1 Power converter and method for producing the same
12/11/2002	CN2525680Y Semiconductor lamp bulb
12/11/2002	CN1384981A Semiconductor light-emitting device
12/11/2002	CN1384977A 半导体装置 Semiconductor device
12/11/2002	CN1384601A 压电器件 Piezoelectric devices
12/11/2002	CN1384309A Mixed integrated efficient full-colour LED lamp
12/10/2002	US6493234 Electronic components mounting structure
12/10/2002	US6493229 Heat sink chip package
12/10/2002	US6492737 Electronic device and a method of manufacturing the same
12/10/2002	US6492727 Semiconductor device
12/10/2002	US6492726 Chip scale packaging with multi-layer flip chip arrangement and ball grid array interconnection
12/10/2002	US6492725 Concentrically leaded power semiconductor device package
12/10/2002	US6492720 Flat-type semiconductor stack
12/10/2002	US6492719 Semiconductor device
12/10/2002	US6492718 Stacked semiconductor device and semiconductor system
12/10/2002	US6492714 Semiconductor device and semiconductor module
12/10/2002	US6492683 Semiconductor device with SOI structure and method of manufacturing the same
12/10/2002	CA2251077C Three-color sensor with a pin-layer sequence or a nip-layer sequence
12/05/2002	WO2002097885A1 Contact system
12/05/2002	WO2002097884A1 High power led module for spot illumination
12/05/2002	WO2002097883A1 High power semiconductor module
12/05/2002	WO2002097880A2 Power semiconductor module and method for the production of a power semiconductor module
12/05/2002	US20020182772 Low profile multi-IC chip package connector
12/05/2002	US20020181216 Electronic module having a three dimensional array of carrier-mounted integrated circuit packages
12/05/2002	US20020180867 Communication devices incorporating reduced area imaging devices
12/05/2002	US20020180345 Package structure containing two LEDs
12/05/2002	US20020180315 Piezoelectric device
12/05/2002	US20020180063 Semiconductor module
12/05/2002	US20020180060 Semiconductor device and a method of manufacturing the same
12/05/2002	US20020180058 Semiconductor device and method for fabricating the same
12/05/2002	US20020180057 Chip stack-type semiconductor package
12/05/2002	US20020180041 Semiconductor device and method for manufacturing the same
12/05/2002	US20020180037 Semiconductor device
12/05/2002	US20020180036 Semiconductor device
12/05/2002	US20020180030 Laminated-chip semiconductor device
12/05/2002	US20020180027 Semiconductor module and method of making the device
12/05/2002	US20020180025 Semiconductor device and method of stacking semiconductor chips
12/05/2002	US20020180023 Structure of a multi chip module having stacked chips
12/05/2002	US20020180021 Three-dimension multi-chip stack package technology
12/05/2002	US20020180020 Three-dimension multi-chip stack package technology
12/05/2002	US20020180015 Semiconductor module
12/05/2002	US20020180010 Semiconductor device and manufacturing method thereof
12/05/2002	US20020179945 Power semiconductor device
12/05/2002	US20020179914 Group III-V element-based LED having flip-chip structure and ESD protection capacity
12/05/2002	US20020179835 Article comprising IR-reflective multi-well plates
12/05/2002	US20020179834 Method and apparatus for infrared-spectrum imaging
12/05/2002	US20020179139 Sealing film for solar cell and method for manufacturing solar cell
12/05/2002	DE10157250C1 Semiconducting switch module has circuit for protection against overvoltages arranged in housing and on substrate and electrically connected and thermally coupled to semiconducting body
12/05/2002	DE10125697A1 Leistungshalbleitermodul und Verfahren zum Herstellen eines Leistungshalbleitermoduls The power semiconductor module and method for manufacturing a power semiconductor module
12/05/2002	DE10125696A1 Power semiconductor module for making an external electrical connection has active semiconductor components and external electrical connections.
12/05/2002	DE10125695A1 Power semiconductor structure for causing a coolant to pass through to cool a power semiconductor element has a cooling element and a push-contact casing containing the power semiconductor element.
12/05/2002	DE10125341A1 Beleuchtungsvorrichtung Lighting device
12/04/2002	EP1263046A1 Contact Arrangement
12/04/2002	EP1263045A1 High power semiconductor module
12/04/2002	EP1263041A2 Semiconductor Module
12/04/2002	EP1262782A2 Mounting spring elements on semiconductor devices, and wafer-level testing methodology
12/04/2002	EP1113945A4 Systems and components for enhancing rear vision from a vehicle
12/04/2002	CN2524375Y Spherical grid array metal ball integrated circuit package assembly
12/04/2002	CN1383219A LED luminous device
12/04/2002	CN1383206A 半导体器件 Semiconductor devices
12/04/2002	CN1383167A Capacitor modular, and semiconductor device using same
12/03/2002	US6490402 Flexible flat color display
12/03/2002	US6490187 Semiconductor electric power conversion device
12/03/2002	US6489728 Power efficient LED driver quiescent current limiting circuit configuration
12/03/2002	US6489687 Semiconductor device and method of manufacturing the same, manufacturing device, circuit board, and electronic equipment
12/03/2002	US6489686 Multi-cavity substrate structure for discrete devices
12/03/2002	US6489676 Semiconductor device having an interconnecting post formed on an interposer within a sealing resin
12/03/2002	US6489670 Sealed symmetric multilayered microelectronic device package with integral windows
12/03/2002	US6489669 Integrated circuit device
12/03/2002	US6489637 Hybrid integrated circuit device
12/03/2002	US6489181 Method of manufacturing a semiconductor device
12/03/2002	US6488392 LED diffusion assembly
11/2002
11/28/2002	WO2002095920A1 Electron tunneling device
11/28/2002	WO2002095879A1 A high frequency, low cost package for semiconductor devices
11/28/2002	WO2002095817A2 Semiconductor component with at least one semiconductor chip on a base chip serving as substrate and method for production thereof
11/28/2002	WO2002049108A8 Semiconductor device package and lead frame with die overhanging lead frame pad
11/28/2002	US20020176251 Lighting apparatus for guiding light onto a light polymerizable piece to effect hardening thereof
11/28/2002	US20020176250 High power led power pack for spot module illumination
11/28/2002	US20020176238 Multi-chip module having interconnect dies
11/28/2002	US20020176233 Stackable module
11/28/2002	US20020175621 Light emitting diode, light emitting device using the same, and fabrication processes therefor
11/28/2002	US20020175421 Semiconductor device
11/28/2002	US20020175401 Semiconductor package with stacked chips
11/28/2002	US20020175400 Semiconductor device and method of formation
11/28/2002	DE10221504A1 Multi-chip light emitting diode assembly for color display, lighting system, has several LEDs positioned on shared submount and connected to metal traces provided on submount
11/28/2002	DE10218071A1 Kondensatormodul und dieses verwendende Halbleitereinrichtung Capacitor module and this semiconductor device used
11/28/2002	DE10200268A1 Halbleitervorrichtung Semiconductor device
11/28/2002	DE10144462C1 Electronic component used as a semiconductor component comprises a passive component, and a semiconductor chip electrically connected to a wiring structure
11/28/2002	DE10128271C1 Diode manufacturing method uses shaker with reception openings for alignment of diode chips before adhering to lower conductor layers provided by base plate
11/28/2002	DE10121970A1 Leistungshalbleitermodul in Druckkontaktierung Power semiconductor module in pressure contact
11/28/2002	DE10120917C1 Anordnung mit wenigstens zwei zentrierten gestapelten Halbleiterchips Arrangement with at least two centered stacked semiconductor chips
11/27/2002	EP1261026A1 Device having resin package and method of producing the same
11/27/2002	EP1261021A2 Method of production of circuit board, semiconductor device, and plating system

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