| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 06/11/2002 | US6404044 Semiconductor package with stacked substrates and multiple semiconductor dice |
| 06/11/2002 | US6404043 Panel stacking of BGA devices to form three-dimensional modules |
| 06/11/2002 | US6404040 Semiconductor device with metal peripheral area |
| 06/11/2002 | US6403985 Method of making light emitting diode displays |
| 06/11/2002 | US6403984 Amorphous semiconductor photocoupler |
| 06/11/2002 | US6403881 Electronic component package assembly and method of manufacturing the same |
| 06/06/2002 | WO2002045168A1 Semiconductor device |
| 06/06/2002 | WO2002045151A1 Semiconductor package and its manufacturing method |
| 06/06/2002 | WO2002045009A2 Rectifying and charge storing element |
| 06/06/2002 | WO2002003464A3 Semiconductor chip |
| 06/06/2002 | WO2000067314A9 Stackable flex circuit ic package and method of making the same |
| 06/06/2002 | US20020068396 Silicon wafer with embedded optoelectronic material for monolithic OEIC |
| 06/06/2002 | US20020067554 Optical module |
| 06/06/2002 | US20020067408 Hand-held computers incorporating reduced area imaging devices |
| 06/06/2002 | US20020067181 Probe card assembly and kit, and methods of making same |
| 06/06/2002 | US20020067126 Electro-optical device |
| 06/06/2002 | US20020066956 Electronic circuit device and hybrid integrated circuit with an asic and an FPGA |
| 06/06/2002 | US20020066952 Semiconductor device having an interconnecting post formed on an interposer within a sealing resin |
| 06/06/2002 | US20020066947 Multimedia chip package |
| 06/06/2002 | US20020066899 Silicon wafer with embedded optoelectronic material for monolithic OEIC |
| 06/06/2002 | DE10109330C1 Circuit device with parallel semiconductor chips has reserve place for reception of replacement chip used for repair of circuit device |
| 06/06/2002 | DE10057665A1 Organic field effect transistor has at least two current channels and/or one vertical current channel transverse to surface of substrate formed by field effect when voltage applied |
| 06/06/2002 | CA2429997A1 Rectifying and charge storing element |
| 06/05/2002 | EP1211730A2 Stacked power amplifier module |
| 06/05/2002 | EP0741594B1 Photo-thermal therapeutic device |
| 06/05/2002 | CN1352869A Sandwich-structured intelligent power module |
| 06/05/2002 | CN1352804A High-density electronic package and method for making same |
| 06/05/2002 | CN1086059C Stacking type semiconductor chip package |
| 06/04/2002 | US6400576 Sub-package bypass capacitor mounting for an array packaged integrated circuit |
| 06/04/2002 | US6400575 Integrated circuits packaging system and method |
| 06/04/2002 | US6400573 Multi-chip integrated circuit module |
| 06/04/2002 | US6400172 Semiconductor components having lasered machined conductive vias |
| 06/04/2002 | US6400035 Microwave semiconductor device with improved heat discharge and electrical properties and manufacturing method thereof |
| 06/04/2002 | US6400019 Semiconductor device with wiring substrate |
| 06/04/2002 | US6400017 Semiconductor device and method for manufacturing same |
| 06/04/2002 | US6400008 Surface mount ic using silicon vias in an area array format or same size as die array |
| 06/04/2002 | US6400007 Stacked structure of semiconductor means and method for manufacturing the same |
| 06/04/2002 | US6399420 Ultra high density integrated circuit BLP stack and method for fabricating the same |
| 06/04/2002 | US6399416 Device and method for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice |
| 05/30/2002 | WO2002043134A1 Method and system for manufacturing electronic packaging units |
| 05/30/2002 | WO2002028148A3 Enhanced trim resolution voltage-controlled dimming led driver |
| 05/30/2002 | WO2001063646A3 Multi-layered multi-chip module |
| 05/30/2002 | WO2001043193B1 Dual-die integrated circuit package |
| 05/30/2002 | US20020064905 Wire bonding method and semiconductor package manufactured using the same |
| 05/30/2002 | US20020064900 Semiconductor device and method of fabricating the same |
| 05/30/2002 | US20020064032 Device mounting method |
| 05/30/2002 | US20020064029 Stacked power amplifier module |
| 05/30/2002 | US20020063521 High power led lamp |
| 05/30/2002 | US20020063515 Light-emitting display device |
| 05/30/2002 | US20020063311 Integrated circuits and methods for their fabrication |
| 05/30/2002 | US20020063262 Semiconductor apparatus having a large-size bus connection |
| 05/30/2002 | US20020062973 Power semiconductor module |
| 05/30/2002 | US20020062970 I/c chip assembly |
| 05/29/2002 | EP1209742A1 Power Semiconductor Module and application of such a Power Semiconductor Module |
| 05/29/2002 | EP1209735A2 Semiconductor device and production process thereof |
| 05/29/2002 | EP1051748A4 A vertical connector based packaging solution for integrated circuits |
| 05/29/2002 | DE10159685A1 Verdrahtungssubstrat, Verdrahtungsplatte und Montagestruktur für ein Verdrahtungssubstrat Wiring substrate, the wiring board and mounting structure for the wiring substrate |
| 05/29/2002 | DE10155447A1 Gleichrichtereinheit für einen Fahrzeugwechselstromgenerator Rectifier unit for a vehicle AC generator |
| 05/29/2002 | DE10058658A1 Diode lighting arrangement has diodes arranged in diode field as illumination bodies on bearer in form of flexible conducting track via which diodes are supplied with electrical energy |
| 05/29/2002 | CN1351417A Electric inverter |
| 05/29/2002 | CN1351375A Modular assembly and electronic component |
| 05/28/2002 | US6396967 Optoelectronic integrated circuit device |
| 05/28/2002 | US6396154 Semiconductor device |
| 05/28/2002 | US6396137 Integrated voltage/current/power regulator/switch system and method |
| 05/28/2002 | US6396125 Semiconductor device |
| 05/28/2002 | US6395999 Electronic power module and a method of manufacturing such a module |
| 05/28/2002 | US6395630 Stacked integrated circuits |
| 05/28/2002 | US6395578 Semiconductor package and method for fabricating the same |
| 05/23/2002 | WO2002041398A2 Microelectronic packages and packaging methods in which second microelectronic substrates are oriented relative to first microelectronic substrates at acute angles |
| 05/23/2002 | WO2002041397A2 Low profile integrated module interconnects |
| 05/23/2002 | WO2002015281A3 Glass-to-metal hermetically sealed led array |
| 05/23/2002 | WO2001086722A3 Semiconductor component |
| 05/23/2002 | US20020061173 Platform and optical module, method of manufacture thereof, and optical transmission device |
| 05/23/2002 | US20020060526 Light tube and power supply circuit |
| 05/23/2002 | US20020060502 Rectifier unit of vehicle AC generator |
| 05/23/2002 | US20020060371 High-power semiconductor module, and use of such a high-power semiconductor module |
| 05/23/2002 | US20020060361 Semiconductor package for three-dimensional mounting, fabrication method thereof , and semiconductor device |
| 05/23/2002 | US20020060358 Package of an image sensor device |
| 05/23/2002 | US20020060356 Power semiconductor device |
| 05/23/2002 | DE10056281A1 Electronic component comprises a semiconductor chip having an active upper side with integrated circuits and a passive rear side without integrated circuits |
| 05/22/2002 | EP1207563A2 Direct bonding of flip-chip light-emitting diode and flip-chip ESD protection chip to electrodes in a package |
| 05/22/2002 | EP1206325A2 Vapor phase connection techniques |
| 05/22/2002 | CN1350704A LED module for signaling devices |
| 05/22/2002 | CN1350680A Method for producing a contactless card |
| 05/22/2002 | CN1085409C Bottom-lead semiconductor or package |
| 05/21/2002 | US6392950 Semiconductor device including multi-chip |
| 05/21/2002 | US6392306 Semiconductor chip assembly with anisotropic conductive adhesive connections |
| 05/21/2002 | US6392304 Multi-chip memory apparatus and associated method |
| 05/21/2002 | US6392296 Silicon interposer with optical connections |
| 05/21/2002 | US6392292 Multi-level stacked semiconductor bear chips with the same electrode pad patterns |
| 05/21/2002 | US6392237 Method and apparatus for obtaining radiation image data |
| 05/21/2002 | US6392143 Flexible package having very thin semiconductor chip, module and multi chip module (MCM) assembled by the package, and method for manufacturing the same |
| 05/21/2002 | US6391741 Fabrication process for microstructure protection systems related to hard disk reading unit |
| 05/21/2002 | US6391685 Method of forming through-holes in a wafer and then dicing to form stacked semiconductor devices |
| 05/21/2002 | US6391682 Method of performing flip-chip underfill in a wire-bonded chip-on-chip ball-grid array integrated circuit package module |
| 05/21/2002 | US6390854 Resin shield circuit device |
| 05/16/2002 | WO2002039799A1 Hybrid circuit for the control of electric motors that uses the cover of the reduction gear as heat dissipator |
| 05/16/2002 | WO2002039513A1 Electro-optical device |
| 05/16/2002 | US20020057883 High speed optical subassembly with ceramic carrier |
| 05/16/2002 | US20020057567 Light-emitting diode illuminated light-emitting |