H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices

Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
11/2002
11/06/2002	EP1255299A2 Power semiconductor device with pressure contact
11/06/2002	CN1378284A Semiconductor device having flat electrode and protruding electrode directly contact with it
11/05/2002	US6477286 Integrated optoelectronic device, and integrated circuit device
11/05/2002	US6476783 Contrast enhancement for an electronic display device by using a black matrix and lens array on outer surface of display
11/05/2002	US6476551 LED array head and minute reflection optical elements array for use in the LED array head
11/05/2002	US6476506 Packaged semiconductor with multiple rows of bond pads and method therefor
11/05/2002	US6476503 Semiconductor device having columnar electrode and method of manufacturing same
11/05/2002	US6476502 Semiconductor device and manufacturing method thereof
11/05/2002	US6476500 Semiconductor device
11/05/2002	US6476486 Ball grid array package with supplemental electronic component
11/05/2002	US6476476 Integrated circuit package including pin and barrel interconnects
11/05/2002	US6476475 Stacked SRAM die package
11/05/2002	US6476463 Microwave integrated circuit multi-chip-module
11/05/2002	US6476461 Arrangement of stacked, spherically-shaped semiconductors
11/05/2002	US6476333 Raised contact structures (solder columns)
11/05/2002	US6475831 Methods for a low profile multi-IC chip package connector
11/05/2002	US6475819 Method for formation and production of matrices of high density light emitting diodes
11/05/2002	US6474836 Light source and original reading device
10/2002
10/31/2002	WO2002086972A1 Illuminator
10/31/2002	WO2002086971A2 Multichip module fabricated on a semiconductor or dielectric wafer and method for manufacturing same
10/31/2002	WO2002086964A1 Wiring method and element arranging method using the same, and method of producing image display devices
10/31/2002	WO2002069405A3 Circuit arrangement
10/31/2002	US20020160598 Three dimensional IC package module
10/31/2002	US20020159237 Cooling arrangement for high density packaging of electronic components
10/31/2002	US20020158345 Electronic component with semiconductor chips, electronic assembly composed of stacked semiconductor chips, and methods for producing an electronic component and an electronic assembly
10/31/2002	US20020158344 Configuration with at least two stacked semiconductor chips and method for forming the configuration
10/31/2002	US20020158335 High performance, low cost microelectronic circuit package with interposer
10/31/2002	US20020158330 Circuit board having a heating means and a hermetically sealed multi-chip package
10/31/2002	US20020158329 Capacitor module and semiconductor device using the same
10/31/2002	US20020158327 Semiconductor device
10/31/2002	US20020158325 Semiconductor device and manufacturing method thereof
10/31/2002	US20020158324 Semiconductor device, method of manufacturing electronic device, electronic device, and portable infromation terminal
10/31/2002	US20020158319 Semiconductor device
10/31/2002	US20020158318 Multi-chip module
10/31/2002	US20020158261 Light emitting diode layout structure
10/31/2002	US20020158257 Light-emitting semiconductor device and surface-emitting device
10/31/2002	DE10120687A1 Encapsulated organic-electronic circuit has electronic components especially made of organic material and arranged between at least two layers forming barrier
10/31/2002	DE10120408A1 Elektronisches Bauteil mit Halbleiterchips und elektronische Baugruppe aus gestapelten Halbleiterchips Electronic component with semiconductor chips and electronic assembly of stacked semiconductor chips
10/31/2002	DE10119004A1 Electronic component with semiconductor chip has conductive wiring clips which engage side of chip and make contact with connection pads
10/30/2002	EP1253649A1 Light-emitting or light-receiving semiconductor device and method for fabricating the same
10/30/2002	EP1252654A2 A method for transferring and stacking of semiconductor devices
10/30/2002	EP1057258B1 Electronic component, especially a component working with acoustic surface waves
10/30/2002	EP0972344B1 Fpga repeatable interconnect structure
10/30/2002	CN2519417Y Multichip packaging structure with radiating member
10/30/2002	CN2519416Y Multichip packaging structure with radiation member
10/30/2002	CN2519415Y 堆叠式半导体元件 Stacked semiconductor element
10/30/2002	CN1377512A Dual water attachment process
10/30/2002	CN1377215A Manufacturing method for circuit device
10/30/2002	CN1377181A Image pick-up module and device
10/30/2002	CN1377077A 半导体器件 Semiconductor devices
10/29/2002	US6473310 Insulated power multichip package
10/29/2002	US6473308 Stackable chip package with flex carrier
10/29/2002	US6472758 Semiconductor package including stacked semiconductor dies and bond wires
10/29/2002	US6472747 Mixed analog and digital integrated circuits
10/29/2002	US6472746 Semiconductor device having bonding wires serving as external connection terminals
10/29/2002	US6472744 Semiconductor module including a plurality of semiconductor devices detachably
10/29/2002	US6472741 Thermally-enhanced stacked-die ball grid array semiconductor package and method of fabricating the same
10/29/2002	US6472736 Stacked structure for memory chips
10/29/2002	US6472735 Three-dimensional memory stacking using anisotropic epoxy interconnections
10/29/2002	US6472734 Stacked semiconductor device and method for manufacturing the same
10/29/2002	US6472732 BGA package and method for fabricating the same
10/29/2002	US6472688 Semiconductor light emitting device and display device using the same
10/24/2002	WO2002084750A1 Light source device using led, and method of producing same
10/24/2002	WO2002084716A2 Stacked semiconductor device assembly with microelectronic spring contacts
10/24/2002	WO2002084631A1 Element transfer method, element arrangmenet method using the same, and image display apparatus production method
10/24/2002	US20020155728 Incorporating flexible, sheet-like elements having terminals thereon overlying the front or rear face of the chip, which are movable to compensate for thermal expansion, to provide a compact unit.
10/24/2002	US20020155692 Three dimensional TC package module
10/24/2002	US20020155638 Method for fabricating semiconductor device
10/24/2002	US20020154482 Press - contact type semiconductor device
10/24/2002	US20020154366 Infrared data communication module and method of making the same
10/24/2002	US20020153832 Device transfer method and panel
10/24/2002	US20020153616 High-frequency semiconductor device
10/24/2002	US20020153615 Multi-chip package type semiconductor device
10/24/2002	US20020153604 Die support structure
10/24/2002	US20020153603 System of a package fabricated on a semiconductor or dielectric wafer
10/24/2002	US20020153602 Ball grid array chip packages having improved testing and stacking characteristics
10/24/2002	US20020153541 Cluster globular semiconductor device
10/24/2002	US20020153532 Power semiconductor module
10/24/2002	DE10216008A1 LED-Lampe LED lamp
10/24/2002	DE10161947A1 Halbleiterelement Semiconductor element
10/24/2002	DE10135812C1 Integrated semiconductor circuit for memory module has signal input points coupled via programmable switches to internal function elements
10/24/2002	DE10130592C1 Module component used for storage modules for data processing comprises a main module and sub-modules
10/24/2002	DE10120685C1 Encapsulated organic-electronic circuit has electronic components especially made of organic material and arranged between at least two layers forming barrier
10/24/2002	DE10118384A1 Anordnung zur Kühlung eines Leistungs-Halbleiterelementes Arrangement for cooling a power semiconductor element
10/23/2002	EP1251560A1 Cluster globular semiconductor device
10/23/2002	EP1251558A2 Semiconductor device
10/23/2002	EP1002452B1 Contact arrangement linking two substrates and method for the production of said contact arrangement
10/23/2002	CN1376314A Bulk lens, light emitting body, lighting device and optical information system
10/23/2002	CN1376015A Organic electro-illuminating apparatus and electronic machine
10/23/2002	CN1375873A High speed and high-capacity flash solid memory structure and manufacture process
10/23/2002	CN1375872A Memory module with laminated chips and its making process
10/23/2002	CN1375653A Lighting apparatus
10/23/2002	CN1093318C 半导体装置及其制造方法 Semiconductor device and manufacturing method thereof
10/22/2002	US6470133 Integrated circuit electronic equipment and method of assembly which uses said integrated circuit
10/22/2002	US6469395 Semiconductor device
10/22/2002	US6469384 Unmolded package for a semiconductor device
10/22/2002	US6469377 Semiconductor device
10/22/2002	US6469376 Die support structure
10/22/2002	US6469375 High bandwidth 3D memory packaging technique
10/22/2002	US6469374 Superposed printed substrates and insulating substrates having semiconductor elements inside

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