| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 12/20/2001 | US20010052930 Reduced area imaging device incorporated within wireless endoscopic devices |
| 12/20/2001 | US20010052641 Power semiconductor device |
| 12/20/2001 | US20010052600 Light irradiating device manufacturing method |
| 12/20/2001 | DE10029259A1 Stack module for chips has chips on top and bottom of stacked substrates enclosed by connections between substrates |
| 12/20/2001 | CA2411219A1 Led lamp |
| 12/19/2001 | EP1164644A2 Plastic substrates with improved barrier properties for devices sensitive to water and/or oxygen |
| 12/19/2001 | EP1164641A2 Light emitting module and method of driving the same, and optical sensor |
| 12/19/2001 | EP1164024A2 Ink tank and ink jet recording apparatus provided with the same |
| 12/19/2001 | EP1164023A2 Ink jet recording apparatus utilizing solid semiconductor element |
| 12/19/2001 | EP0766909B1 Vertical interconnect process for silicon segments |
| 12/19/2001 | EP0551382B1 Semiconductor chip assemblies, methods of making same and components for same |
| 12/19/2001 | CN1327263A Semiconductor device and its producing method, laminated semiconductor device and circuit base board |
| 12/18/2001 | US6331939 Stackable ball grid array package |
| 12/18/2001 | US6331466 Insulated gate semiconductor device and manufacturing method thereof |
| 12/18/2001 | US6331450 Method of manufacturing semiconductor device using group III nitride compound |
| 12/18/2001 | US6331063 LED luminaire with light control means |
| 12/18/2001 | CA2209660C Electrical circuit suspension system |
| 12/16/2001 | CA2453960A1 Ink jet recording apparatus utilizing solid semiconductor element |
| 12/16/2001 | CA2453883A1 Ink jet recording apparatus utilizing solid semiconductor element |
| 12/16/2001 | CA2453847A1 Ink tank and ink jet recording apparatus provided with the same |
| 12/16/2001 | CA2350392A1 Ink jet recording apparatus utilizing solid semiconductor element |
| 12/13/2001 | WO2001046716A3 Electro-optical transceiver system with controlled lateral leakage and method of making it |
| 12/13/2001 | US20010051391 Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methods |
| 12/13/2001 | US20010051029 Three-dimensional mounted assembly, method of manufacturing the same, and optical transmission device |
| 12/13/2001 | US20010050531 Light emitting device and optical device using the same |
| 12/13/2001 | US20010050431 Semiconductor device and liquid crystal module adopting the same |
| 12/13/2001 | US20010050428 Semiconductor device and a method of manufacturing the same |
| 12/13/2001 | US20010050421 Semiconductor apparatus |
| 12/13/2001 | US20010050370 Light irradiating device, manufacturing method thereof, and lighting apparatus using the light irradiating device |
| 12/13/2001 | DE10127381A1 Assembly clamp device for multilayer semiconducting component is rotated to position relative to mother substrate and removed after intermediate connections have been made |
| 12/12/2001 | EP1162719A2 Vehicle AC generator |
| 12/12/2001 | EP1162669A2 Light irradiating device, manufacturing method thereof, and lighting apparatus using the light irradiating device |
| 12/12/2001 | EP1162668A2 Light irradiating device manufacturing method |
| 12/12/2001 | EP1162662A2 Bus bar having embedded switching device |
| 12/12/2001 | EP1161772A1 Method of making a iii-nitride light-emitting device with increased light generating capability |
| 12/12/2001 | CN2465330Y CCD and CMOS image picking up modular |
| 12/12/2001 | CN2465329Y Iamge sensor |
| 12/12/2001 | CN2465328Y Double-chip package unit |
| 12/12/2001 | CN2465327Y Double-chip top package device |
| 12/12/2001 | CN2465321Y Integrated circuit with adhesive agent |
| 12/12/2001 | CN1326263A 电子电路组件 Electronic circuit assembly |
| 12/12/2001 | CN1326230A Luminous diode lamp |
| 12/12/2001 | CN1076137C Bridge rectifier configuration and mounting for supplying exciter current in ac generator |
| 12/11/2001 | US6330164 Interconnect assemblies and methods including ancillary electronic component connected in immediate proximity of semiconductor device |
| 12/11/2001 | US6329863 Input circuit having a fuse therein and semiconductor device having the same |
| 12/11/2001 | US6329714 Hybrid S.C. devices and method of manufacture thereof |
| 12/11/2001 | US6329713 Integrated circuit chip carrier assembly comprising a stiffener attached to a dielectric substrate |
| 12/11/2001 | US6329711 Semiconductor device and mounting structure |
| 12/11/2001 | US6329708 Micro ball grid array semiconductor device and semiconductor module |
| 12/11/2001 | US6329707 Twin transistor device with improved collector-base isolation |
| 12/11/2001 | US6329221 Method of forming a stack of packaged memory die and resulting apparatus |
| 12/06/2001 | WO2001093324A2 Substrate adapted to accommodate a circuit configuration and method for producing the same |
| 12/06/2001 | WO2001027997A3 Power semiconductor module |
| 12/06/2001 | US20010049157 Method of forming a stack of packaged memory die and resulting apparatus |
| 12/06/2001 | US20010049155 Semiconductor device using substrate having cubic structure and method of manufacturing the same |
| 12/06/2001 | US20010048616 Semiconductor device including multi-chip |
| 12/06/2001 | US20010048152 Stackable ceramic fbga for high thermal applications |
| 12/06/2001 | US20010048151 Stackable ball grid array semiconductor package and fabrication method thereof |
| 12/06/2001 | US20010048148 Semiconductor device and a method of manufacturing the same |
| 12/06/2001 | US20010048138 Integrated circuitry |
| 12/06/2001 | US20010047882 Multi-chip land grid array carrier |
| 12/06/2001 | US20010047820 Solar powered IC mounted display |
| 12/06/2001 | US20010047588 Electronic interconnection medium having offset electrical mesh plane |
| 12/06/2001 | EP1145316A3 Power semiconductor module |
| 12/06/2001 | DE10103106A1 Power semiconductor module has smoothing capacitor whose main surface lies against main and side surfaces of package |
| 12/06/2001 | DE10100620A1 Power semiconductor module has capacitor and power semiconductor device disposed directly on heat sink having cooling medium channels |
| 12/06/2001 | DE10026661A1 Universal LED illumination module for internal, external mains-powered lights has LEDs supplied with electrical power, driven via capacitor supply part directly connected to mains |
| 12/06/2001 | DE10025563A1 Module for arranging electrical light emitting elements has metal grid with conducting tracks enclosed by mechanical stabilizing material and bound into material in flat manner. |
| 12/06/2001 | DE10023823A1 Multi-chip housing device has carrier supporting stacked chip components with lowermost chip component having contact coupled to terminal surface of carrier |
| 12/05/2001 | EP1160883A2 LED lamp |
| 12/05/2001 | EP1160868A2 Electronic circuit unit suitable for miniaturization |
| 12/05/2001 | EP1160866A2 Power wiring structure and semiconductor device |
| 12/04/2001 | US6327128 Automotive bridge rectifier assembly with thermal protection |
| 12/04/2001 | US6326686 Vertical semiconductor device package having printed circuit board and heat spreader, and module having the packages |
| 12/04/2001 | US6326681 Semiconductor device |
| 12/04/2001 | US6326232 Method of fabricating semiconductor device |
| 12/04/2001 | US6325914 Method and device for transferring spin-polarized charge carriers |
| 12/04/2001 | US6325524 Solid state based illumination source for a projection display |
| 11/29/2001 | WO2001091173A1 Stackable flex circuit chip package and method of making same |
| 11/29/2001 | US20010046167 Semiconductor device including multi-chip |
| 11/29/2001 | US20010045645 Multichip semiconductor device and memory card |
| 11/29/2001 | US20010045639 Power wiring structure and semiconductor device |
| 11/29/2001 | US20010045636 Semiconductor integrated circuit package, semiconductor apparatus provided with a plurality of semiconductor integrated circuit packages, method of inspecting semiconductor integrated circuit package and method of fabricating semiconductor integrated circuit |
| 11/29/2001 | DE10026460A1 Connector device for light emitting diodes or LEDs has bearer layer with insulating material for accommodating LEDs and connecting lines; connecting lines are embedded in bearer layer |
| 11/29/2001 | DE10024516A1 Leistungshalbleitermodul The power semiconductor module |
| 11/29/2001 | DE10024377A1 Gehäuseeinrichtung und darin zu verwendendes Kontaktelement Housing means and to be used in contact element |
| 11/29/2001 | DE10024371A1 Power semiconductor module with geometric connection compatibility has connection bores that can be brought into identical positions relative to attachment bores for various housing sizes |
| 11/29/2001 | DE10022268A1 Halbleiterbauelement Semiconductor device |
| 11/29/2001 | DE10022267A1 Semiconducting component has lead frame to which first semiconducting body is attached and raised part on lead frame to which second semiconducting body is attached |
| 11/28/2001 | EP1158656A1 Electronic power device |
| 11/28/2001 | EP1158570A1 Vertical interconnect process for silicon segments |
| 11/28/2001 | EP1157420A1 Light extractor apparatus |
| 11/28/2001 | CN2462546Y Light-emitting diode pixel bulb |
| 11/28/2001 | CN2462225Y LED bulb with reflecting chamber |
| 11/28/2001 | CN1324110A IC packing stacked module |
| 11/27/2001 | US6324073 Clamping arrangement for compression-mounted power electronic devices |
| 11/27/2001 | US6324072 Microelectronic component of sandwich construction |
| 11/27/2001 | US6323598 Enhanced trim resolution voltage-controlled dimming led driver |
| 11/27/2001 | US6323546 Direct contact through hole type wafer structure |
| 11/27/2001 | US6323508 Insulated gate semiconductor device and manufacturing method thereof |