| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 04/10/2002 | EP1195812A2 Semiconductor device, semiconductor module and hard disk |
| 04/10/2002 | EP1195808A1 Method of fabricating a thin, free-standing semiconductor device layer and of making a three-dimensionally integrated circuit |
| 04/10/2002 | EP1195746A2 Semiconductor device, semiconductor module and hard disk |
| 04/10/2002 | EP1195079A1 An arrangement for mounting chips in multilayer printed circuit boards |
| 04/10/2002 | EP1194956A1 Solar cell array |
| 04/10/2002 | EP1194955A1 High-density electronic package, and method for making same |
| 04/10/2002 | CN1344026A 多芯片组件 Multi-chip module |
| 04/10/2002 | CN1344014A Semiconductor device and semiconductor assembly |
| 04/09/2002 | US6370025 Electronic module |
| 04/09/2002 | US6370019 Sealing of large area display structures |
| 04/09/2002 | US6369448 Vertically integrated flip chip semiconductor package |
| 04/09/2002 | US6369447 Plastic-packaged semiconductor device including a plurality of chips |
| 04/09/2002 | US6369444 Packaging silicon on silicon multichip modules |
| 04/09/2002 | US6369443 Semiconductor device with stacked vias |
| 04/09/2002 | US6369411 Semiconductor device for controlling high-power electricity with improved heat dissipation |
| 04/09/2002 | US6369407 Semiconductor device |
| 04/09/2002 | US6368894 Multi-chip semiconductor module and manufacturing process thereof |
| 04/04/2002 | WO2002028148A2 Enhanced trim resolution voltage-controlled dimming led driver |
| 04/04/2002 | WO2002027874A2 High speed optical subassembly with ceramic carrier |
| 04/04/2002 | WO2002027363A2 Method of bonding wafers with controlled height and associated structures |
| 04/04/2002 | WO2001093324A3 Substrate adapted to accommodate a circuit configuration and method for producing the same |
| 04/04/2002 | WO2001088983A3 Power semiconductor module |
| 04/04/2002 | WO2001088982A3 Housing device and contact element used therein |
| 04/04/2002 | WO2001056079A3 A method for transferring and stacking of semiconductor devices |
| 04/04/2002 | US20020039464 Optical reflective structures and method for making |
| 04/04/2002 | US20020039282 Heat sink provided with coupling means, memory module attached with the heat sink and maunfacturing method thereof |
| 04/04/2002 | US20020039001 Light emitting device, display apparatus with an array of light emitting devices, and display apparatus method of manufacture |
| 04/04/2002 | US20020038918 Connecting electrodes pads with photopolymerization |
| 04/04/2002 | US20020038913 Integrated circuit chip carrier assembly |
| 04/04/2002 | US20020038912 Semiconductor wafer, semiconductor device and manufacturing method therefor |
| 04/04/2002 | US20020038907 Semiconductor device |
| 04/04/2002 | US20020038873 Semiconductor device including intermediate wiring element |
| 04/04/2002 | US20020038664 Sealing composition for sealing solar cell, and solar cell module and building material-integral type solar cell module using said composition |
| 04/04/2002 | DE10138982A1 Zuleitungsrahmen, unter Verwendung desselben hergestelltes Halbleiter-Bauelement und Verfahren zum Herstellen des Halbleiter-Bauelements Lead frame, manufactured using the same semiconductor device and method of manufacturing the semiconductor device |
| 04/04/2002 | DE10044455A1 Signal light has focusing element with individual reflectors, each associated with light body e.g. LED or light emitting semiconducting bodies in matrix layout with reflectors |
| 04/03/2002 | EP1193761A2 Semiconductor device including intermediate wiring element |
| 04/03/2002 | EP1193760A2 Semiconductor device with SOI structure and method of manufacturing the same |
| 04/03/2002 | EP1192841A1 Intelligent power module |
| 04/03/2002 | EP1192659A1 Multichip module and method for producing a multichip module |
| 04/03/2002 | EP1192658A1 Stackable flex circuit ic package and method of making the same |
| 04/03/2002 | EP1192657A1 Method of subdividing a wafer |
| 04/03/2002 | EP1192627A1 Methods to implement sealing and electrical connections to single cell and multi-cell regenerative photoelectrochemical devices |
| 04/03/2002 | EP1192590A1 Method for producing a contactless card |
| 04/03/2002 | EP0834242B1 Connection substrate |
| 04/03/2002 | CN1343086A 电路装置及其制造方法 Circuit device and manufacturing method thereof |
| 04/03/2002 | CN1343007A Semiconductor device, manufacturing method, thereof, circuit base plate and electronic equipment |
| 04/02/2002 | US6366468 Self-aligned common carrier |
| 04/02/2002 | US6365966 Stacked chip scale package |
| 04/02/2002 | US6365965 Power semiconductor module with terminals having holes for better adhesion |
| 04/02/2002 | US6365963 Stacked-chip semiconductor device |
| 04/02/2002 | US6365962 Flip-chip on flex for high performance packaging applications |
| 04/02/2002 | US6365918 Method and device for interconnected radio frequency power SiC field effect transistors |
| 04/02/2002 | US6365436 Connecting multiple microelectronic elements with lead deformation |
| 04/02/2002 | US6365260 Arrangement for heat dissipation in chip modules on multilayered ceramic carriers, in particular multichip modules |
| 03/28/2002 | WO2002025777A2 Press (non-soldered) contacts for high current electrical connections in power modules |
| 03/28/2002 | WO2002025744A1 Light-emitting diode comprising a luminous element |
| 03/28/2002 | WO2002025732A2 Power module with integrated capacitor |
| 03/28/2002 | WO2002025704A2 Leadframe-based module dc bus design to reduce module inductance |
| 03/28/2002 | WO2002025703A2 Substrate-level dc bus design to reduce module inductance |
| 03/28/2002 | WO2001043193A3 Dual-die integrated circuit package |
| 03/28/2002 | US20020037435 Circuit substrate |
| 03/28/2002 | US20020036345 High frequency flip chip module and assembling method thereof |
| 03/28/2002 | US20020036339 Semiconductor device |
| 03/28/2002 | US20020036338 Stacked type semiconductor device |
| 03/28/2002 | US20020036330 Semiconductor device with SOI structure and method of manufacturing the same |
| 03/28/2002 | US20020036054 Printed circuit board and method manufacturing the same |
| 03/28/2002 | DE10121554A1 Halbleiterbauelement zum Steuern von Elektrizität Semiconductor device for controlling electricity |
| 03/27/2002 | EP1191590A2 Semiconductor device and semiconductor module |
| 03/27/2002 | EP1191587A2 Packaging structure and method for automotive components |
| 03/27/2002 | EP1191555A2 Formation of an embedded capacitor plane using a thin polyimide dielectric |
| 03/27/2002 | CN1342035A Circuit device and its manufacturing method |
| 03/27/2002 | CN1341966A Light-emitting device of high-power light-emitting diode |
| 03/27/2002 | CN1341965A Electronic part with laminated assembly and manufacturing method thereof |
| 03/26/2002 | US6362964 Flexible power assembly |
| 03/26/2002 | US6362529 Stacked semiconductor device |
| 03/26/2002 | US6362519 Low profile multi-IC chip package connector |
| 03/26/2002 | US6362516 Electronic apparatus |
| 03/26/2002 | US6360433 Universal package and method of forming the same |
| 03/26/2002 | CA2242802C Mounting structure for one or more semiconductor devices |
| 03/21/2002 | WO2002023674A2 Thick film millimeter wave transceiver module |
| 03/21/2002 | WO2002023637A1 Semiconductor light emitting element formed on a clear or translucent substrate |
| 03/21/2002 | WO2002023620A2 Connection for conducting high frequency signal between a circuit and a discrete electrical component |
| 03/21/2002 | WO2001069680A3 Electronic module having a three dimensional array of carrier-mounted integrated circuit packages |
| 03/21/2002 | US20020034089 Semiconductor electric power conversion device |
| 03/21/2002 | US20020034088 Leadframe-based module DC bus design to reduce module inductance |
| 03/21/2002 | US20020034069 Electronic device having stacked modules and method for producing it |
| 03/21/2002 | US20020034059 Mounting structure for capacitors |
| 03/21/2002 | US20020033541 Semiconductor device manufacturing method and semiconductor device manufactured thereby |
| 03/21/2002 | US20020033530 Semiconductor device and semiconductor module |
| 03/21/2002 | US20020033529 Power semiconductor module |
| 03/21/2002 | US20020033526 Multichip module |
| 03/21/2002 | DE10119813A1 Leistungsmodul Power module |
| 03/21/2002 | DE10101078A1 Semiconductor device for electrical power connection in electric vehicle has end of main current circuit connection provided on outside of resin housing |
| 03/21/2002 | DE10044148A1 Elektronisches Bauteil mit gestapelten Bausteinen und Verfahren zu seiner Herstellung Electronic component with stacked modules and process for its preparation |
| 03/20/2002 | EP1189345A2 High frequency module device and method for its preparation |
| 03/20/2002 | EP1189292A1 Light-emitting semiconductor device and surface-emitting device |
| 03/20/2002 | EP1189283A1 Stacking-type colour-mixing LED |
| 03/20/2002 | EP1189282A1 Semiconductor device, method of manufacturing electronic device, electronic device, and portable information terminal |
| 03/20/2002 | EP1189281A2 Chip-arrangement |
| 03/20/2002 | EP1189280A1 Semiconductor device |