Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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01/14/2003 | US6506627 Semiconductor device, tab tape for semiconductor device, method of manufacturing the tab tape and method of manufacturing the semiconductor device |
01/14/2003 | US6505954 Safe light emitting device |
01/09/2003 | WO2003003797A2 Structure and method for fabrication of a leadless multi-die carrier |
01/09/2003 | WO2003003459A2 Arrangement of a semiconductor component on a substrate |
01/09/2003 | WO2003003448A2 High temperature electrostatic chuck |
01/09/2003 | WO2003003427A1 Opto-electronic device integration |
01/09/2003 | WO2003003426A1 Opto-electronic device integration |
01/09/2003 | WO2003003425A1 Opto-electronic device integration |
01/09/2003 | WO2003003424A1 Multi-wavelength semiconductor laser arrays and applications thereof |
01/09/2003 | WO2003003421A2 Optical chip packaging via through hole |
01/09/2003 | WO2003003420A1 Opto-electronic device integration |
01/09/2003 | WO2003002000A1 Medical x-ray device and power module therefor |
01/09/2003 | US20030008432 Method and device for securing a multi-dimensionally constructed chip stack and chip configuration |
01/09/2003 | US20030008424 Multichip module and method for testing connection of the module |
01/09/2003 | US20030006508 Electronic device including stacked microchips |
01/09/2003 | US20030006503 Device having resin package and method of producing the same |
01/09/2003 | US20030006496 Semiconductor/printed circuit board assembly, and computer system |
01/09/2003 | US20030006495 Die stacking scheme |
01/09/2003 | US20030006494 Thin profile stackable semiconductor package and method for manufacturing |
01/09/2003 | US20030006493 Semiconductor device and manufacturing method thereof |
01/09/2003 | US20030006491 Single package containing multiple integrated circuit devices |
01/09/2003 | US20030006490 Semiconductor integrated circuit device |
01/09/2003 | US20030006434 Inverter module |
01/09/2003 | US20030006423 Semiconductor light emitting device package |
01/09/2003 | US20030006416 Opto-electronic device integration |
01/09/2003 | CA2447369A1 Opto-electronic device integration |
01/09/2003 | CA2447368A1 Opto-electronic device integration |
01/09/2003 | CA2447365A1 Opto-electronic device integration |
01/09/2003 | CA2447348A1 Optical chip packaging via through hole |
01/09/2003 | CA2447345A1 Opto-electronic device integration |
01/08/2003 | EP1274292A1 Casing for a power converter |
01/08/2003 | EP1274129A2 Electronic arrangement and associated process |
01/08/2003 | CN1389919A Cross-point diode storage array addressing mfg. technology |
01/08/2003 | CN1389914A Semiconductor package with stack chip |
01/08/2003 | CN1389913A Parallel semi-conductor piling-up device |
01/08/2003 | CN1098617C Method for mounting electronic component and device with binder on circuit substrate |
01/07/2003 | US6504742 3-D memory device for large storage capacity |
01/07/2003 | US6504301 Non-incandescent lightbulb package using light emitting diodes |
01/07/2003 | US6504253 Structure for electrically connecting a first body of semiconductor material overlaid by a second body of semiconductor material composite structure using electric connection structure |
01/07/2003 | US6504244 Semiconductor device and semiconductor module using the same |
01/07/2003 | US6504241 Stackable semiconductor device and method for manufacturing the same |
01/07/2003 | US6504110 Insulating circuit board and power semiconductor apparatus employing the same |
01/07/2003 | US6503821 Integrated circuit chip carrier assembly |
01/07/2003 | US6503778 Thin film device and method of manufacturing the same |
01/07/2003 | US6503776 Method for fabricating stacked chip package |
01/07/2003 | US6502956 Light emitting diode lamp with individual LED lenses |
01/07/2003 | US6502952 Light emitting diode assembly for flashlights |
01/06/2003 | CA2393069A1 Power converter enclosure |
01/03/2003 | WO2003001611A1 Substrate for an electroluminescent display device and method of manufacturing said substrate |
01/03/2003 | WO2003001597A2 Vertically contacted stacked chips |
01/03/2003 | WO2003001596A1 Electronic device and method for manufacturing the same |
01/03/2003 | WO2003001566A2 Extendible drain members for grounding rfi/emi shielding |
01/03/2003 | WO2002069476A3 Vehicular modular design multiple application rectifier assembly |
01/03/2003 | CA2451207A1 Extendible drain members for grounding rfi/emi shielding |
01/02/2003 | US20030003749 High temperature electrostatic chuck |
01/02/2003 | US20030003630 Hybrid integrated circuit device |
01/02/2003 | US20030003622 Semiconductor device fabrication method and semiconductor device fabrication device |
01/02/2003 | US20030002282 Modular mounting arrangement and method for light emitting diodes |
01/02/2003 | US20030002281 Shielded reflective light-emitting diode |
01/02/2003 | US20030002267 I/O interface structure |
01/02/2003 | US20030001288 Ball grid array chip packages having improved testing and stacking characteristics |
01/02/2003 | US20030001285 Semiconductor package and method for manufacturing the same |
01/02/2003 | US20030001281 Stacked chip package having upper chip provided with trenches and method of manufacturing the same |
01/02/2003 | US20030001260 Semiconductor devices having different package sizes made by using common parts |
01/02/2003 | US20030001257 Semiconductor device and semiconductor assembly apparatus for semiconductor device |
01/02/2003 | US20030001252 Semiconductor package including stacked chips |
01/02/2003 | US20030001251 Wafer level interconnection |
01/02/2003 | US20030001232 Composite integrated circuit and its fabrication method |
01/02/2003 | EP1271653A1 Insulated-gate bipolar transistor, semiconductor device, method of manufacturing insulated-gate bipolar transistor, and method of manufacturing semiconductor device |
01/02/2003 | EP1271649A2 Multi-die module and method thereof |
01/02/2003 | EP1271644A1 Wiring board, semiconductor device, and method of manufacturing wiring board |
01/02/2003 | EP1271640A2 Mold for manufacturing semiconductor device |
01/02/2003 | EP1271047A2 Lamp for vehicles and method of making |
01/02/2003 | EP1270842A1 Solar cell module and roof equipped with power generating function using it |
01/02/2003 | EP1269539A1 Semiconductor component with contacts provided on the lower side thereof, and method for producing the same |
01/02/2003 | EP1269538A2 Method of forming a stacked-die integrated circuit chip package on a wafer level |
01/02/2003 | EP1257990A4 Light-emitting diode display systems and methods with enhanced light intensity |
01/02/2003 | EP0855090B1 Multichip module |
01/01/2003 | CN1388584A Semiconductor device |
12/31/2002 | US6501663 Three-dimensional interconnect system |
12/31/2002 | US6501184 Semiconductor package and method for manufacturing the same |
12/31/2002 | US6501173 Semiconductor device |
12/31/2002 | US6501172 Power module |
12/31/2002 | US6501167 Low inductance power wiring structure and semiconductor device |
12/31/2002 | US6501165 Stackable semiconductor package having conductive layer and insulating layers and method of fabrication |
12/31/2002 | US6501164 Multi-chip semiconductor package with heat dissipating structure |
12/31/2002 | US6501084 Lamp unit using short-wave light emitting device |
12/31/2002 | US6501013 Photovoltaic assembly array with covered bases |
12/31/2002 | US6500746 Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methods |
12/31/2002 | US6500698 Method for fabricating a stacked semiconductor chip package |
12/31/2002 | US6500696 Face to face chip |
12/31/2002 | US6499213 Assembling a stacked die package |
12/27/2002 | WO2002103795A2 Semiconductor module having multiple semiconductor chips |
12/27/2002 | WO2002103794A1 A method of producing a lamp |
12/27/2002 | WO2002103793A1 Semiconductor device and manufacturing method thereof |
12/27/2002 | WO2002103792A2 Method of manufacturing a semiconductor device and semiconductor device |
12/27/2002 | WO2002103784A1 Method for producing miniature amplifier and signal processing unit |
12/27/2002 | WO2002074024A3 A method and apparatus for fabricating a circuit board with a three dimensional surface mounted array of semiconductor chips |
12/27/2002 | WO2002050907A9 Interconnection of active and passive components in substrate |
12/27/2002 | CA2450156A1 A method of producing a lamp |