Patents
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
01/2003
01/14/2003US6506627 Semiconductor device, tab tape for semiconductor device, method of manufacturing the tab tape and method of manufacturing the semiconductor device
01/14/2003US6505954 Safe light emitting device
01/09/2003WO2003003797A2 Structure and method for fabrication of a leadless multi-die carrier
01/09/2003WO2003003459A2 Arrangement of a semiconductor component on a substrate
01/09/2003WO2003003448A2 High temperature electrostatic chuck
01/09/2003WO2003003427A1 Opto-electronic device integration
01/09/2003WO2003003426A1 Opto-electronic device integration
01/09/2003WO2003003425A1 Opto-electronic device integration
01/09/2003WO2003003424A1 Multi-wavelength semiconductor laser arrays and applications thereof
01/09/2003WO2003003421A2 Optical chip packaging via through hole
01/09/2003WO2003003420A1 Opto-electronic device integration
01/09/2003WO2003002000A1 Medical x-ray device and power module therefor
01/09/2003US20030008432 Method and device for securing a multi-dimensionally constructed chip stack and chip configuration
01/09/2003US20030008424 Multichip module and method for testing connection of the module
01/09/2003US20030006508 Electronic device including stacked microchips
01/09/2003US20030006503 Device having resin package and method of producing the same
01/09/2003US20030006496 Semiconductor/printed circuit board assembly, and computer system
01/09/2003US20030006495 Die stacking scheme
01/09/2003US20030006494 Thin profile stackable semiconductor package and method for manufacturing
01/09/2003US20030006493 Semiconductor device and manufacturing method thereof
01/09/2003US20030006491 Single package containing multiple integrated circuit devices
01/09/2003US20030006490 Semiconductor integrated circuit device
01/09/2003US20030006434 Inverter module
01/09/2003US20030006423 Semiconductor light emitting device package
01/09/2003US20030006416 Opto-electronic device integration
01/09/2003CA2447369A1 Opto-electronic device integration
01/09/2003CA2447368A1 Opto-electronic device integration
01/09/2003CA2447365A1 Opto-electronic device integration
01/09/2003CA2447348A1 Optical chip packaging via through hole
01/09/2003CA2447345A1 Opto-electronic device integration
01/08/2003EP1274292A1 Casing for a power converter
01/08/2003EP1274129A2 Electronic arrangement and associated process
01/08/2003CN1389919A Cross-point diode storage array addressing mfg. technology
01/08/2003CN1389914A Semiconductor package with stack chip
01/08/2003CN1389913A Parallel semi-conductor piling-up device
01/08/2003CN1098617C Method for mounting electronic component and device with binder on circuit substrate
01/07/2003US6504742 3-D memory device for large storage capacity
01/07/2003US6504301 Non-incandescent lightbulb package using light emitting diodes
01/07/2003US6504253 Structure for electrically connecting a first body of semiconductor material overlaid by a second body of semiconductor material composite structure using electric connection structure
01/07/2003US6504244 Semiconductor device and semiconductor module using the same
01/07/2003US6504241 Stackable semiconductor device and method for manufacturing the same
01/07/2003US6504110 Insulating circuit board and power semiconductor apparatus employing the same
01/07/2003US6503821 Integrated circuit chip carrier assembly
01/07/2003US6503778 Thin film device and method of manufacturing the same
01/07/2003US6503776 Method for fabricating stacked chip package
01/07/2003US6502956 Light emitting diode lamp with individual LED lenses
01/07/2003US6502952 Light emitting diode assembly for flashlights
01/06/2003CA2393069A1 Power converter enclosure
01/03/2003WO2003001611A1 Substrate for an electroluminescent display device and method of manufacturing said substrate
01/03/2003WO2003001597A2 Vertically contacted stacked chips
01/03/2003WO2003001596A1 Electronic device and method for manufacturing the same
01/03/2003WO2003001566A2 Extendible drain members for grounding rfi/emi shielding
01/03/2003WO2002069476A3 Vehicular modular design multiple application rectifier assembly
01/03/2003CA2451207A1 Extendible drain members for grounding rfi/emi shielding
01/02/2003US20030003749 High temperature electrostatic chuck
01/02/2003US20030003630 Hybrid integrated circuit device
01/02/2003US20030003622 Semiconductor device fabrication method and semiconductor device fabrication device
01/02/2003US20030002282 Modular mounting arrangement and method for light emitting diodes
01/02/2003US20030002281 Shielded reflective light-emitting diode
01/02/2003US20030002267 I/O interface structure
01/02/2003US20030001288 Ball grid array chip packages having improved testing and stacking characteristics
01/02/2003US20030001285 Semiconductor package and method for manufacturing the same
01/02/2003US20030001281 Stacked chip package having upper chip provided with trenches and method of manufacturing the same
01/02/2003US20030001260 Semiconductor devices having different package sizes made by using common parts
01/02/2003US20030001257 Semiconductor device and semiconductor assembly apparatus for semiconductor device
01/02/2003US20030001252 Semiconductor package including stacked chips
01/02/2003US20030001251 Wafer level interconnection
01/02/2003US20030001232 Composite integrated circuit and its fabrication method
01/02/2003EP1271653A1 Insulated-gate bipolar transistor, semiconductor device, method of manufacturing insulated-gate bipolar transistor, and method of manufacturing semiconductor device
01/02/2003EP1271649A2 Multi-die module and method thereof
01/02/2003EP1271644A1 Wiring board, semiconductor device, and method of manufacturing wiring board
01/02/2003EP1271640A2 Mold for manufacturing semiconductor device
01/02/2003EP1271047A2 Lamp for vehicles and method of making
01/02/2003EP1270842A1 Solar cell module and roof equipped with power generating function using it
01/02/2003EP1269539A1 Semiconductor component with contacts provided on the lower side thereof, and method for producing the same
01/02/2003EP1269538A2 Method of forming a stacked-die integrated circuit chip package on a wafer level
01/02/2003EP1257990A4 Light-emitting diode display systems and methods with enhanced light intensity
01/02/2003EP0855090B1 Multichip module
01/01/2003CN1388584A Semiconductor device
12/2002
12/31/2002US6501663 Three-dimensional interconnect system
12/31/2002US6501184 Semiconductor package and method for manufacturing the same
12/31/2002US6501173 Semiconductor device
12/31/2002US6501172 Power module
12/31/2002US6501167 Low inductance power wiring structure and semiconductor device
12/31/2002US6501165 Stackable semiconductor package having conductive layer and insulating layers and method of fabrication
12/31/2002US6501164 Multi-chip semiconductor package with heat dissipating structure
12/31/2002US6501084 Lamp unit using short-wave light emitting device
12/31/2002US6501013 Photovoltaic assembly array with covered bases
12/31/2002US6500746 Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methods
12/31/2002US6500698 Method for fabricating a stacked semiconductor chip package
12/31/2002US6500696 Face to face chip
12/31/2002US6499213 Assembling a stacked die package
12/27/2002WO2002103795A2 Semiconductor module having multiple semiconductor chips
12/27/2002WO2002103794A1 A method of producing a lamp
12/27/2002WO2002103793A1 Semiconductor device and manufacturing method thereof
12/27/2002WO2002103792A2 Method of manufacturing a semiconductor device and semiconductor device
12/27/2002WO2002103784A1 Method for producing miniature amplifier and signal processing unit
12/27/2002WO2002074024A3 A method and apparatus for fabricating a circuit board with a three dimensional surface mounted array of semiconductor chips
12/27/2002WO2002050907A9 Interconnection of active and passive components in substrate
12/27/2002CA2450156A1 A method of producing a lamp