| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 01/30/2003 | US20030020081 Light emitting device package and method of fabrication |
| 01/29/2003 | EP1280391A1 Programmable controller with stacked elements |
| 01/29/2003 | EP1280203A2 3D-Semiconductor Package |
| 01/29/2003 | EP1280103A1 Non-contact type IC card and flat coil used therein |
| 01/29/2003 | CN1394372A Semiconductor laser element |
| 01/29/2003 | CN1394360A Semiconductor device fabrication method and device thereof |
| 01/29/2003 | CN1393653A Device and method for modularization mounting of LED |
| 01/29/2003 | CN1100347C Method for producing semiconductor device |
| 01/28/2003 | US6512302 Apparatus and methods of packaging and testing die |
| 01/28/2003 | US6512300 Water level interconnection |
| 01/28/2003 | US6512293 Mechanically interlocking ball grid array packages and method of making |
| 01/28/2003 | US6512290 Vertically mountable and alignable semiconductor device, assembly, and methods |
| 01/28/2003 | US6511863 Method and apparatus for a semiconductor package for vertical surface mounting |
| 01/23/2003 | WO2003007663A1 Micro-lens arrays for display intensity enhancement |
| 01/23/2003 | WO2003007389A2 Led-module for illuminating devices |
| 01/23/2003 | WO2003007375A2 Single package containing multiple integrated circuit devices |
| 01/23/2003 | WO2003007374A1 Hybrid module |
| 01/23/2003 | WO2003006875A1 A high intensity light source with variable colours |
| 01/23/2003 | US20030017663 Semiconductor device manufacturing method for reinforcing chip by use of seal member at pickup time |
| 01/23/2003 | US20030017647 Wafer level stack chip package and method for manufacturing same |
| 01/23/2003 | US20030016511 Semiconductor device having a chip, reinforcing plate, and sealing material sharing a common rear surface |
| 01/23/2003 | US20030016506 Non-contact type IC card and flat coil used for the same |
| 01/23/2003 | US20030016505 Gate driver multi-chip module |
| 01/23/2003 | US20030016503 Solder-free PCB assembly |
| 01/23/2003 | US20030016502 Semiconductor device |
| 01/23/2003 | US20030015959 Display unit |
| 01/23/2003 | US20030015928 Alternator |
| 01/23/2003 | US20030015803 High-density multichip module and method for manufacturing the same |
| 01/23/2003 | US20030015792 Memory chip and semiconductor device using the memory chip and manufacturing method of those |
| 01/23/2003 | US20030015782 Double-sided circuit board and multi-chip package including such a circuit board and method for manufacture |
| 01/23/2003 | US20030015781 Method of using foamed insulators in three dimensional multichip structures |
| 01/23/2003 | US20030015777 Connection of packaged integrated memory chips to a printed circuit board |
| 01/23/2003 | US20030015774 Semiconductor component with contacts situated at the underside, and fabrication method |
| 01/23/2003 | US20030015761 Mixed technology microcircuits |
| 01/23/2003 | US20030015734 Integrated semiconductor circuit having contact points and configuration having at least two such circuits |
| 01/23/2003 | US20030015733 Multichip semiconductor device |
| 01/22/2003 | EP1278296A1 Power comversion apparatus and mobile object incorporating thereof |
| 01/22/2003 | EP1278250A2 Illumination device with at least one LED as the light source |
| 01/22/2003 | EP1278243A2 Multichip Module assembled in COB structure, especially Compact Flash Card with high memory capacity and Method of Manufacturing the same |
| 01/22/2003 | EP1277234A2 Circuit |
| 01/22/2003 | CN1392611A Semiconductor device and its producing method |
| 01/22/2003 | CN1392610A Semiconductor device and its producing method |
| 01/22/2003 | CN1392609A Semiconductor packaging piece and its producing method |
| 01/22/2003 | CN1392608A Semiconductor laminated unit |
| 01/22/2003 | CN1099711C 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof |
| 01/21/2003 | US6509941 Light-producing display having high aperture ratio pixels |
| 01/21/2003 | US6509832 Systems and components for enhancing rear vision from a vehicle |
| 01/21/2003 | US6509645 Spherical semiconductor device and method for fabricating the same |
| 01/21/2003 | US6509639 Three-dimensional stacked semiconductor package |
| 01/21/2003 | US6509638 Semiconductor device having a plurality of stacked semiconductor chips on a wiring board |
| 01/21/2003 | US6509631 Semiconductor device and liquid crystal module |
| 01/21/2003 | US6509629 Power module |
| 01/21/2003 | US6509626 Conductive device components of different base widths formed from a common conductive layer |
| 01/16/2003 | WO2003005782A2 Stackable microcircuit and method of making the same |
| 01/16/2003 | WO2003005569A1 Auxiliary circuitry for monolithic microwave integrated circuit |
| 01/16/2003 | WO2003005445A1 Semiconductor device and semiconductor module |
| 01/16/2003 | WO2003005429A1 Method for preparing low dielectric films |
| 01/16/2003 | WO2003004930A1 Display and illumination device and display and illumination system |
| 01/16/2003 | US20030013231 Three dimensionals interconnection method and electronic device obtained by same |
| 01/16/2003 | US20030013230 Opto-electronic device integration |
| 01/16/2003 | US20030013225 6753198 not granted per o.g. errata of 7-27-04 |
| 01/16/2003 | US20030013217 Opto-electronic device integration |
| 01/16/2003 | US20030012002 TSOP memory chip housing configuration |
| 01/16/2003 | US20030012001 Module unit for memory modules and method for its production |
| 01/16/2003 | US20030011889 Wafer level creation of multiple optical elements |
| 01/16/2003 | US20030011303 Providing optical elements over emissive displays |
| 01/16/2003 | US20030011302 Facilitating the spread of encapsulant between surfaces of elecronic devices |
| 01/16/2003 | US20030011068 Semiconductor chip having bond pads and multi-chip package |
| 01/16/2003 | US20030011067 Stacked chip-size package type semiconductor device capable of being decreased in size |
| 01/16/2003 | US20030011057 Semiconductor device |
| 01/16/2003 | US20030011005 Unmolded package for a semiconductor device |
| 01/16/2003 | US20030010917 Acoustic absorption electromagnetic radiation sensing with single crystal SiC |
| 01/16/2003 | US20030010431 Method of mass producing and packaging integrated subsystems |
| 01/16/2003 | US20030010377 Photovoltaic module |
| 01/16/2003 | US20030010374 Photovoltaic assembly array with covered bases |
| 01/16/2003 | US20030010372 Multi-position photovoltaic assembly |
| 01/16/2003 | DE10163117C1 Transparent LED body manufacturing method uses 2-stage moulding process for preventing damage to light-emitting chip and its current leads |
| 01/15/2003 | EP1276157A2 Shielded reflective light-emitting device |
| 01/15/2003 | EP1276149A2 Encapsulated electronic component including a power electronic device and method of making the same |
| 01/15/2003 | EP1275300A1 Threatening device |
| 01/15/2003 | EP1275153A1 Carrier substrate for electronic components |
| 01/15/2003 | EP1275146A1 Method of joining components |
| 01/15/2003 | CN2531234Y LED array illuminant energy-saving lamp |
| 01/15/2003 | CN1391704A Surface mount IC stacking method and device |
| 01/15/2003 | CN1391427A Flexible substrate, semiconductor device, camera device and X-ray camera system |
| 01/15/2003 | CN1391281A Multi-layer integrated circuit for join of substrates with wide gaps |
| 01/15/2003 | CN1391280A Electronic device and manufacture thereof |
| 01/15/2003 | CN1391279A Circuit layout |
| 01/15/2003 | CN1391278A Semiconductor device and manufacture thereof |
| 01/15/2003 | CN1391061A Collective diode as light source |
| 01/14/2003 | US6507121 Array structure of solder balls able to control collapse |
| 01/14/2003 | US6507115 Multi-chip integrated circuit module |
| 01/14/2003 | US6507109 Vertical surface mount package utilizing a back-to-back semiconductor device module |
| 01/14/2003 | US6507108 Power semiconductor module |
| 01/14/2003 | US6507107 Semiconductor/printed circuit board assembly |
| 01/14/2003 | US6507106 Semiconductor module with a number of semiconductor chips and a conductive connection between the semiconductor chips by flexible tapes |
| 01/14/2003 | US6507104 Semiconductor package with embedded heat-dissipating device |
| 01/14/2003 | US6507098 Multi-chip packaging structure |
| 01/14/2003 | US6506664 Method of transferring ultra-thin substrates and application of the method to the manufacture of a multi-layer thin film device |
| 01/14/2003 | US6506633 Method of fabricating a multi-chip module package |