Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
02/2003
02/18/2003US6521984 Semiconductor module with semiconductor devices attached to upper and lower surface of a semiconductor substrate
02/18/2003US6521983 Semiconductor device for electric power
02/18/2003US6521978 Shielding device and electrical structural part having a shielding device
02/18/2003US6521940 High density electronic circuit modules
02/18/2003US6521881 Stacked structure of an image sensor and method for manufacturing the same
02/18/2003US6521512 Method for fabricating a thin, free-standing semiconductor device layer and for making a three-dimensionally integrated circuit
02/18/2003US6521483 Semiconductor device, method of manufacture thereof, circuit board, and electronic device
02/13/2003WO2003013200A1 Circuit module
02/13/2003WO2003012884A1 Display system
02/13/2003WO2003012868A1 Semiconductor device and its manufacturing method
02/13/2003WO2003012863A1 Semiconductor device and its manufacturing method
02/13/2003WO2003012802A1 Method for producing nanocomposite magnet using atomizing method
02/13/2003US20030032297 Method to GaAs based lasers and a GaAs based laser
02/13/2003US20030032246 Semiconductor device arrangement and method of fabricating the same
02/13/2003US20030032218 Method of manufacturing a semiconductor device
02/13/2003US20030032216 Semiconductor device and manufacturing method thereof
02/13/2003US20030031429 Package structure for a hybrid optical module and method of producing the same
02/13/2003US20030031015 LED bulb
02/13/2003US20030030481 Power module
02/13/2003US20030030368 Illumination unit having at least one LED as light source
02/13/2003US20030030152 Thermally enhanced high density semiconductor package
02/13/2003US20030030151 Semiconductor device and method for manufacturing the same
02/13/2003US20030030143 Electronic component with stacked electronic elements and method for fabricating an electronic component
02/13/2003US20030030137 Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument
02/13/2003US20030030135 Semiconductor device that can have a defective bit found during or after packaging process repaired
02/13/2003US20030030065 Package for semiconductor photoelectric device
02/13/2003US20030030063 Mixed color leds for auto vanity mirrors and other applications where color differentiation is critical
02/13/2003US20030029556 Adhesive-coated electronic parts on a connection sheet
02/13/2003DE10142114C1 Electronic component has intermediate carrier supporting rear surface of one semiconductor chip facing towards passive or active surface of second chip
02/12/2003EP1283589A2 Power converter module
02/12/2003EP0909462B1 Arrangement for heat dissipation in chip modules on multilayered ceramic carriers, in particular multichip modules
02/12/2003CN1396657A Assembly semiconductor device with a bigger chip on an other chip
02/12/2003CN1396552A Light emission and receiving equipment structure
02/11/2003US6518679 Capacitive alignment structure and method for chip stacking
02/11/2003US6518672 Multi-layer wiring board substrate and semiconductor device using the multi-layer wiring substrate
02/11/2003US6518666 Circuit board reducing a warp and a method of mounting an integrated circuit chip
02/11/2003US6518659 Stackable package having a cavity and a lid for an electronic device
02/11/2003US6518655 Multi-chip package-type semiconductor device
02/11/2003US6518575 Solid-state radiation detectors
02/11/2003US6518163 Method for forming bumps, semiconductor device, and solder paste
02/11/2003US6518161 Method for manufacturing a dual chip in package with a flip chip die mounted on a wire bonded die
02/11/2003US6518090 Semiconductor device and manufacturing method thereof
02/06/2003WO2003010830A2 Multichip led package with in-package quantitative and spectral sensing capability and digital signal output
02/06/2003WO2003010816A1 Chip stack with differing chip package types
02/06/2003WO2003010796A2 Structure and method for fabrication of a leadless chip carrier with embedded antenna
02/06/2003WO2002049107A9 Method for stacking semiconductor die within an implanted medical device
02/06/2003WO2002045009A3 Rectifying and charge storing element
02/06/2003US20030027437 Leadframe interposer
02/06/2003US20030026553 Optical chip packaging via through hole
02/06/2003US20030026096 LED-based planar light source
02/06/2003US20030026077 Covering element for subassemblies
02/06/2003US20030025962 Wavelength division multiplexed optical interconnection device
02/06/2003US20030025926 Image processing apparatus and image processing method
02/06/2003US20030025657 Light emitting unit
02/06/2003US20030025450 LED lamp and LED lamp manufacturing method
02/06/2003US20030025211 Chip stack with differing chip package types
02/06/2003US20030025199 Super low profile package with stacked dies
02/06/2003US20030025197 Cooling structure for multichip module
02/06/2003US20030025196 Heat transfer structure and a semi-conductor device
02/06/2003US20030025195 Heat transfer structure and a semi-conductor device
02/06/2003US20030025190 Tape ball grid array semiconductor chip package having ball land pad isolated from adhesive, a method of manufacturing the same and a multi-chip package
02/06/2003US20030025188 Stackable semiconductor package having conductive layer and insulating layers and method of fabrication
02/06/2003US20030025187 Protective device for subassemblies
02/06/2003US20030025184 Semiconductor device and method for manufacturing the same
02/06/2003US20030025089 Methods and compositions for ionizing radiation shielding
02/06/2003US20030024731 Vertical electrical interconnections in a stack
02/05/2003EP1282171A2 LED-based planar light-source
02/05/2003EP1281203A2 Semiconductor component
02/05/2003CN2534679Y Light emitting diode module with improved radiating effect
02/05/2003CN1395461A Integrated module board with embedded IC chip and passive element and its production method
02/05/2003CN1395301A Method for manufacturing mixed integrated circuit device
02/04/2003US6515370 Electronic component and semiconductor device, method for manufacturing the same, circuit board have the same mounted thereon, and electronic equipment having the circuit board
02/04/2003US6515356 Semiconductor package and method for fabricating the same
02/04/2003US6515314 Light-emitting device with organic layer doped with photoluminescent material
02/04/2003US6515285 Method and apparatus for compensating a radiation sensor for ambient temperature variations
02/04/2003US6515217 A solar collector (100) is provide having increased efficiency and operating life, and reduced size and cost over conventional collectors. Generally, the collector (100) includes a three- dimensional array (110) of cells (104),
02/04/2003US6515215 Photovoltaic module, photovoltaic module array, photovoltaic system, and method of detecting failure of photovoltaic module
02/04/2003US6514795 Packaged stacked semiconductor die and method of preparing same
02/04/2003US6514794 Redistributed bond pads in stacked integrated circuit die package
02/04/2003US6514793 Stackable flex circuit IC package and method of making same
02/04/2003US6514787 Opto-electric mounting apparatus
02/04/2003US6514782 Method of making a III-nitride light-emitting device with increased light generating capability
02/04/2003US6513949 LED/phosphor-LED hybrid lighting systems
01/2003
01/31/2003CA2396019A1 Led-based planar light source
01/30/2003WO2003009393A1 ELECTROMAGNETIC RADIATION SENSING WITH SINGLE CRYSTAL SiC
01/30/2003WO2003009378A1 Solder-free pcb assembly
01/30/2003WO2002055431A3 Wafer level interconnection
01/30/2003US20030022479 Semiconductor device, a method of manufacturing the same and an electronic device
01/30/2003US20030022417 Micro eletro-mechanical component and system architecture
01/30/2003US20030021117 High intensity light source capable of emitting various colored lights
01/30/2003US20030021096 Decoupling capacitor closely coupled with integrated circuit
01/30/2003US20030020415 Multichip LED package with in-package quantitative and spectral sensing capability and digital signal output
01/30/2003US20030020399 Micro-lens arrays for display intensity enhancement
01/30/2003US20030020177 Method of manufacturing a semiconductor device having a die pad without a downset
01/30/2003US20030020171 Semiconductor package
01/30/2003US20030020164 Spherical semiconductor device and method for fabricating the same
01/30/2003US20030020154 Semiconductor device and method of manufacture thereof, circuit board, and electronic instrument
01/30/2003US20030020153 Chip stack with differing chip package types
01/30/2003US20030020151 Thermally-enhanced stacked-die ball grid array semiconductor package and method of fabricating the same
01/30/2003US20030020084 Method of making light emitting diode displays
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