Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
03/2003
03/06/2003US20030042589 Stack chip module
03/06/2003US20030042587 IC packaging and manufacturing methods
03/06/2003US20030042575 Insulated gate bipolar transistor, semiconductor device, method of manufacturing insulated-gate bipolar transistor, and method of manufacturing semiconductor device
03/06/2003US20030042564 Semiconductor device having an interconnecting post formed on an interposer within a sealing resin
03/06/2003US20030042153 Multiple chip stack structure and cooling system
03/05/2003EP1289014A1 Power semiconductor device
03/05/2003EP1287560A1 Vertical electrical interconnections in a stack
03/05/2003CN1400661A Constructed integrated circuit with balance structure
03/05/2003CN1400660A Semiconductor module and its manufacture
03/04/2003US6529062 Power module
03/04/2003US6528911 Rectifier assembly for automotive alternators
03/04/2003US6528879 Semiconductor device and semiconductor module
03/04/2003US6528871 Structure and method for mounting semiconductor devices
03/04/2003US6528870 Semiconductor device having a plurality of stacked wiring boards
03/04/2003US6528866 High-frequency module
03/04/2003US6528722 Ball grid array semiconductor package with exposed base layer
03/04/2003US6528718 Solar battery module
03/04/2003US6528353 Chip stack-type semiconductor package and method for fabricating the same
03/04/2003US6528351 Integrated package and methods for making same
03/04/2003US6528348 Semiconductor device having protruding electrodes higher than a sealed portion
03/04/2003US6528347 Manufacturing method for making a microwave semiconductor device with improved heat discharge and electric properties
02/2003
02/27/2003WO2003017387A1 Multicolor light-emitting lamp and light source
02/27/2003WO2003017383A1 Semiconductor device and method of its manufacture
02/27/2003WO2003017382A1 Light-emitting or light-receiving semiconductor module and method of its manufacture
02/27/2003WO2003017380A1 Multi-position photovoltaic assembly
02/27/2003WO2003017375A1 Improved solar cell
02/27/2003WO2003017372A1 Photodiode arrangement with two photodiodes
02/27/2003WO2003017368A1 Power electronic component module and method for assembling same
02/27/2003WO2003017328A2 Encapsulated integrated circuit package and method of manufacturing an integrated circuit package
02/27/2003WO2003017327A2 A method and apparatus for die stacking
02/27/2003WO2003017324A2 Structure and method for fabrication of a leadless chip carrier with embedded inductor
02/27/2003WO2003017320A1 Lamp utilizing a light emitted diode
02/27/2003WO2003017290A1 Production method for conductive paste and production method for printed circuit board
02/27/2003WO2003016782A1 Led illuminator and card type led illuminating light source
02/27/2003WO2003015619A1 Reduced area imaging device incorporated within wireless endoscopic devices
02/27/2003WO2002086971A3 Multichip module fabricated on a semiconductor or dielectric wafer and method for manufacturing same
02/27/2003WO2002003465A3 Semiconductor package with stacked flip chip and wire bonded upper die
02/27/2003US20030041275 Semiconductor integrated circuit device
02/27/2003US20030040200 Method for making a semiconductor light source
02/27/2003US20030040166 Apparatus and method for stacking integrated circuits
02/27/2003US20030040145 Method for transferring and stacking of semiconductor devices
02/27/2003US20030040140 Semiconductor memory device and method of manufacturing semiconductor device with chip on chip structure
02/27/2003US20030040131 Semiconductor chip, semiconductor integrated circuit device using the same, and method of selecting semiconductor chip
02/27/2003US20030039281 Laser arrays for high power fiber amplifier pumps
02/27/2003US20030039122 Light source using semiconductor devices mounted on a heat sink
02/27/2003US20030039120 Semiconductor light source using a primary and secondary heat sink combination
02/27/2003US20030039119 Semiconductor light source for providing visible light to illuminate a physical space
02/27/2003US20030038647 Probe card for probing wafers with raised contact elements
02/27/2003US20030038374 Multi-chip package (MCP) with spacer
02/27/2003US20030038373 Spacer - connector stud for stacked surface laminated multichip modules and methods of manufacture
02/27/2003US20030038362 Semiconductor device having semiconductor element housed in package with heat sink
02/27/2003US20030038359 Forming a thin semiconductor device of high packaging density type, resin-encapsulated type, and smaller in size
02/27/2003US20030038357 Stacking assembly of semiconductor devices, forming spacing between first and second semiconductor devices apart from one another
02/27/2003US20030038356 Semiconductor devices including stacking spacers thereon, assemblies including the semiconductor devices, and methods
02/27/2003US20030038355 Semiconductor devices and semiconductor device assemblies including a nonconfluent spacer layer
02/27/2003US20030038354 Assemblies including stacked semiconductor devices separated by discrete conductive elements therebetween, packages including the assemblies, and methods
02/27/2003US20030038353 Assemblies including stacked semiconductor devices separated by discrete conductive elements therebetween, packages including the assemblies, and methods
02/27/2003US20030038350 Semiconductor device
02/27/2003US20030038348 Dual die package
02/27/2003US20030038347 Stackable-type semiconductor package
02/27/2003US20030038344 Through-via vertical interconnects, through-via heat sinks and associated fabrication methods
02/27/2003US20030038291 Semiconductor light source
02/27/2003US20030038290 Light emitting and receiving device structure
02/27/2003US20030037434 Method of manufacturing a metal-ceramic circuit board
02/27/2003CA2452816A1 Improved solar cell
02/26/2003EP0862788B1 Method of producing a vertically integrated semiconductor component
02/26/2003CN1399338A Semiconductor device of laminated chips
02/25/2003US6525986 Stackable microelectronic components with self-addressing scheme
02/25/2003US6525950 Semiconductor device and electric power conversion device
02/25/2003US6525943 Heat sink with alignment and retaining features
02/25/2003US6525464 Stacked light-mixing LED
02/25/2003US6525438 Alternator
02/25/2003US6525415 Three-dimensional semiconductor integrated circuit apparatus and manufacturing method therefor
02/25/2003US6525414 Semiconductor device including a wiring board and semiconductor elements mounted thereon
02/25/2003US6525413 Die to die connection method and assemblies and packages including dice so connected
02/25/2003US6525386 Non-protruding optoelectronic lens
02/25/2003US6525385 Semiconductor device with inductance element
02/25/2003US6523976 Led assembly
02/20/2003WO2003015185A1 A method to gaas based lasers and a gaas based laser
02/20/2003WO2003015167A2 Semiconductor module
02/20/2003WO2003015153A2 Process to allow electrical and mechanical connection of an electrical device with a face equipped with contact pads
02/20/2003US20030036218 Three-dimensional multichip module
02/20/2003US20030035457 Photodiode configuration having two photodiodes, a laser diode configuration having the photodiode configuration, and method for connecting the photodiode configuration to a substrate
02/20/2003US20030034563 Method and apparatus for die stacking
02/20/2003US20030034064 Solar cell module and roof equipped with power generating function using the same
02/20/2003CA2456142A1 A method to gaas based lasers and a gaas based laser
02/19/2003EP1284502A1 Device having resin package and method of producing the same
02/19/2003EP1284501A1 Device having resin package and method of producing the same
02/19/2003EP1005095B1 Method of manufacturing a photovoltaic element
02/19/2003CN1398431A Semiconductor device
02/19/2003CN1102017C Mounted base board
02/18/2003US6522544 Power module
02/18/2003US6522173 Electronic device
02/18/2003US6522022 Mounting structure for semiconductor devices
02/18/2003US6522019 Ball grid array chip packages having improved testing and stacking characteristics
02/18/2003US6522018 Ball grid array chip packages having improved testing and stacking characteristics
02/18/2003US6521997 Chip carrier for accommodating passive component
02/18/2003US6521994 Multi-chip module having content addressable memory
02/18/2003US6521993 Semiconductor memory module having double-sided stacked memory chip layout
02/18/2003US6521992 Semiconductor apparatus
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