Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
03/2003
03/20/2003US20030051751 Protective sheet for solar battery module, method of fabricating the same and solar battery module
03/20/2003DE10159020C1 Power semiconductor circuit device incorporating function monitoring circuit within power semiconductor control circuit
03/20/2003CA2459967A1 Voltage dimmable led display producing multiple colors
03/20/2003CA2459763A1 Method of manufacturing optical devices and related improvements
03/19/2003EP1294023A2 Semiconductor integrated circuit modules, manufacturing methods and usage thereof
03/19/2003EP1192657B1 Method of subdividing a wafer
03/19/2003CN1404206A Power inverter
03/19/2003CN1404143A Semiconductor device
03/18/2003USRE38037 Modular semiconductor power device
03/18/2003US6535398 Multichip module substrates with buried discrete capacitors and components and methods for making
03/18/2003US6535396 Combination circuit board and segmented conductive bus substrate
03/18/2003US6535090 Compact high-frequency circuit device
03/18/2003US6534874 Semiconductor device and method of producing the same
03/18/2003US6534847 Semiconductor device
03/18/2003US6534784 Metal-oxide electron tunneling device for solar energy conversion
03/18/2003US6534703 Multi-position photovoltaic assembly
03/18/2003US6534330 Light irradiating device manufacturing method
03/13/2003WO2003021687A2 Irfpa roic with dual tdm reset integrators and sub-frame averaging functions per unit cell
03/13/2003WO2003021680A2 Power semiconductor module
03/13/2003WO2003021679A2 Integrated circuit structure and a method of making an integrated circuit structure
03/13/2003WO2003021678A1 Package for electronic components and method for forming a package for electronic components
03/13/2003WO2003021673A1 High-frequency chip packages
03/13/2003WO2003021667A2 Package with integrated inductor and/or capacitor
03/13/2003WO2002033752A3 Electronic module having canopy-type carriers
03/13/2003US20030049925 High-density inter-die interconnect structure
03/13/2003US20030049915 Semiconductor device, method of fabricating the same and semiconductor device fabricating apparatus
03/13/2003US20030049889 Method of manufacturing multilayer modules
03/13/2003US20030049882 Wire bonded microelectronic device assemblies and methods of manufacturing same
03/13/2003US20030049424 Stacking of multilayer modules
03/13/2003US20030048624 Low-height multi-component assemblies
03/13/2003US20030048616 Memory module
03/13/2003US20030048609 Stack of multilayer modules with heat-focussing metal layer
03/13/2003US20030048154 High-frequency composite switch module
03/13/2003US20030047813 Electronic component with at least two stacked semiconductor chips and method for fabricating the electronic component
03/13/2003US20030047804 Semiconductor device
03/13/2003US20030047800 Semiconductor integrated circuit modules, manufacturing methods and usage thereof
03/13/2003US20030047799 Wafer level interconnection
03/13/2003US20030047798 Integrated circuits
03/13/2003US20030047760 Electronic component with at least two semiconductor chips, and process for its production
03/13/2003US20030047758 Semiconductor device having a condenser chip for reducing a noise
03/13/2003US20030047742 Package structure of full color LED form by overlap cascaded die bonding
03/13/2003US20030047739 Method to GaAs based lasers and a GaAs based laser
03/13/2003US20030047736 Light emitting device and light emitting system
03/13/2003US20030047353 Multilayer modules with flexible substrates
03/13/2003US20030047304 Power feed and heat dissipating device for power semiconductor devices
03/13/2003US20030047207 Efficiency, durability
03/12/2003EP1291911A1 Method having resin package and method of producing the same
03/12/2003EP1290731A2 Semiconductor arrangement
03/12/2003EP1131784B1 Self-adhesive electronic circuit
03/12/2003EP0858578B1 Liquid cooled heat sink for cooling electronic components
03/12/2003CN1402880A Micro-LED arrays with enhanced light extraction
03/12/2003CN1402349A Semiconductor device and mfg. method thereof
03/12/2003CN1402348A Semiconductor device and mfg. method thereof
03/12/2003CN1402347A Semiconductor chip, semiconductor IC and method for selecting semiconductor chip
03/12/2003CN1402340A Semiconductor packaging element with heat sink structure
03/12/2003CN1103118C Method for fabricating self assembling microstructures
03/11/2003US6531861 Movement actuator/sensor systems
03/11/2003US6531807 Piezoelectric device
03/11/2003US6531784 Semiconductor package with spacer strips
03/11/2003US6531782 Method of placing die to minimize die-to-die routing complexity on a substrate
03/11/2003US6531775 High-frequency module
03/11/2003US6531773 Semiconductor device
03/11/2003US6531771 Dissipation of heat from a circuit board having bare silicon chips mounted thereon
03/11/2003US6531769 Semiconductor integrated circuit package, semiconductor apparatus provided with a plurality of semiconductor integrated circuit packages, method of inspecting semiconductor integrated circuit package and method of fabricating semiconductor integrated circuit
03/11/2003US6531764 Vertically mountable semiconductor device, assembly, and methods
03/11/2003US6531760 Semiconductor device
03/11/2003US6531341 Method of fabricating a microelectronic device package with an integral window
03/11/2003US6531338 Method of manufacturing a semiconductor structure having stacked semiconductor devices
03/11/2003US6531337 Method of manufacturing a semiconductor structure having stacked semiconductor devices
03/06/2003WO2003019940A2 Communication devices incorporating reduced area imaging devices
03/06/2003WO2003019679A1 Light emitting device using led
03/06/2003WO2003019674A1 Chain link metal interconnect structure
03/06/2003WO2003019660A2 Hand-held computers incorporating reduced area imaging devices
03/06/2003WO2003019658A2 Organic luminous diode, method for the production and uses thereof
03/06/2003WO2003019654A1 Stacked chip assembly with stiffening layer
03/06/2003WO2003019653A2 Method for producing contacts and printed circuit packages
03/06/2003WO2003019652A2 Method for fixing an electrical element and a module with an electrical element fixed thus
03/06/2003WO2003019651A2 Through-via vertical interconnects, through-via heat sinks and associated fabrication methods
03/06/2003WO2003019617A2 Method for producing electronic components
03/06/2003US20030045072 Methods of thinning microelectronic workpieces
03/06/2003US20030045047 Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methods
03/06/2003US20030045044 Package with integrated inductor and/or capacitor
03/06/2003US20030045029 Semiconductor device and method for manufacturing the same
03/06/2003US20030043650 Multilayered memory device
03/06/2003US20030043582 Delivery mechanism for a laser diode array
03/06/2003US20030043555 Electronic component with at least two stacked semiconductor chips and process for producing the electronic component
03/06/2003US20030043543 Multi-chip electronic package and cooling system
03/06/2003US20030042844 LED device and manufacturing method thereof
03/06/2003US20030042624 Power semiconductor device
03/06/2003US20030042623 Semiconductor memory chip and semiconductor memory device using the same
03/06/2003US20030042621 Wire stitch bond on an integrated circuit bond pad and method of making the same
03/06/2003US20030042616 Angled edge connections for multichip structures
03/06/2003US20030042615 Stacked microelectronic devices and methods of fabricating same
03/06/2003US20030042602 Multi-chip semiconductor device
03/06/2003US20030042601 Electronic module and communication module using the same
03/06/2003US20030042599 Angeled edge connections for multichip structures
03/06/2003US20030042596 Semiconductor package
03/06/2003US20030042592 Semiconductor device and converter device
03/06/2003US20030042591 Electronic component with at least two stacked semiconductor chips, and fabrication method
03/06/2003US20030042590 Electronic component and process for producing the electronic component
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