| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 06/19/2014 | US20140167269 Methods and Apparatus of Packaging with Interposers |
| 06/19/2014 | US20140167248 Power module package |
| 06/18/2014 | EP2742784A1 Method for manufacturing a component interconnect board |
| 06/18/2014 | EP2742584A1 Power semiconductor switch with a modular design with current balance monitoring for fault detection |
| 06/18/2014 | EP2742531A1 Semiconductor light emitting device and light emitting module |
| 06/18/2014 | EP2742529A1 Opto-electronic module and method for manufacturing the same |
| 06/18/2014 | DE102013216003A1 Halbleitervorrichtung und Herstellungsverfahren dafür A semiconductor device and manufacturing method thereof |
| 06/18/2014 | DE102012223287A1 Printed circuit board for accommodating electronic element i.e. LED, has electrically insulated layer comprising openings for guiding connection unit, where core and/or connection unit and/or conductors are partially made from copper |
| 06/18/2014 | DE102012222012A1 Power semiconductor device e.g. insulated gate bipolar transistor (IGBT) for use in power semiconductor module, has power semiconductor component whose lateral edges are arranged on conductor line, adjacent to non-conductive insulator |
| 06/18/2014 | DE102012112530A1 Verfahren zum Herstellen von optoelektronischen Halbleiterchips und optoelektronischer Halbleiterchip A method for manufacturing of optoelectronic semiconductor chip and optoelectronic semiconductor chip |
| 06/18/2014 | DE102012111564A1 Illumination device for lighting different materials e.g. newsprint, has white light comprising color rendering index and blue light portion, where peak wavelength of blue light portion is provided with specific nanometer |
| 06/18/2014 | CN203659882U 一种光耦有机硅胶封装结构 One kind of silicone encapsulation structure optocoupler |
| 06/18/2014 | CN203659857U 一种耐高压光电耦合器 One kind of high voltage optocouplers |
| 06/18/2014 | CN203659856U 一种贴片led A patch led |
| 06/18/2014 | CN203659855U Led制造模具 Led manufacture of molds |
| 06/18/2014 | CN203659854U 一种螺旋形led封装灯丝 Filament in a spiral shape led package |
| 06/18/2014 | CN203659853U 一种pcb支架插件型led指示灯 One kind of plug-type led light pcb brackets |
| 06/18/2014 | CN203659852U 二极管 Diode |
| 06/18/2014 | CN203659851U 一种超大功率晶闸管阀组 An ultra high-power thyristor valve |
| 06/18/2014 | CN203659850U 一种压接式绝缘型电力半导体模块 One kind of insulated crimp-type power semiconductor module |
| 06/18/2014 | CN203656627U 一种螺旋形led灯丝的灯泡 In a spiral-shaped led light bulb filament |
| 06/18/2014 | CN103875072A Integrated circuit, multicore processor apparatus, and method for manufacturing integrated circuit |
| 06/18/2014 | CN103875063A Semiconductor device, method for manufacturing same, and electronic component |
| 06/18/2014 | CN103872234A Light-emitting device, light-emitting device assembly, and electrode-bearing substrate |
| 06/18/2014 | CN103872224A Novel LED (Light Emitting Diode) illuminating element |
| 06/18/2014 | CN103872037A Systems and methods for integrating bootstrap circuit elements in power transistors and other devices |
| 06/18/2014 | CN103872036A Semiconductor module and method of manufacturing the same |
| 06/18/2014 | CN103872035A Satellite navigation three-dimensional chip and manufacture method thereof |
| 06/18/2014 | CN103872034A Total-angle light emitting LED light source based on light transmission substrate and packaging method of total-angle light emitting LED light source |
| 06/18/2014 | CN103872033A LED (light-emitting diode) lamp filament and illuminator |
| 06/18/2014 | CN103872032A Three-dimensional LED (light emitting diode) luminous body and processing method thereof |
| 06/18/2014 | CN103872031A Light-emitting device, light-emitting device assembly, and electrode-bearing substrate |
| 06/18/2014 | CN103872030A Light-emitting diode and encapsulating structure thereof |
| 06/18/2014 | CN103872029A Light emitting diode module |
| 06/18/2014 | CN103872028A Semiconductor assemblies, stacked semiconductor devices, and methods of manufacturing semiconductor assemblies and stacked semiconductor devices |
| 06/18/2014 | CN103872027A Stacked type power device module |
| 06/18/2014 | CN103872012A Antenna Apparatus and Method |
| 06/18/2014 | CN103871993A Semiconductor device and manufacturing method of the same |
| 06/18/2014 | CN103871987A Power module package |
| 06/18/2014 | CN103871914A Method of Fabricating a Layer Stack |
| 06/18/2014 | CN103871874A Manufacturing method and structure of high-power silicon transient voltage suppressor diode |
| 06/18/2014 | CN102347320B Device and manufacturing method thereof |
| 06/18/2014 | CN102282672B A circuit for detecting tier-to-tier couplings in stacked integrated circuit devices |
| 06/18/2014 | CN102130261B Semiconductor light-emitting element with protection layer |
| 06/18/2014 | CN101996987B Light emitting module |
| 06/18/2014 | CN101772841B Packaged integrated circuit devices with through-body conductive vias, and methods of making same |
| 06/17/2014 | US8754704 Through-silicon via self-routing circuit and routing method thereof |
| 06/17/2014 | US8754515 Stacked packages having through hole vias |
| 06/17/2014 | US8754514 Multi-chip wafer level package |
| 06/17/2014 | US8754423 Light emitting device package |
| 06/17/2014 | US8754378 Silicon photomultiplier readout circuitry |
| 06/17/2014 | US8753915 Method and device for producing a solar panel using a carrier |
| 06/12/2014 | WO2014089259A1 Smart memory |
| 06/12/2014 | WO2014088071A1 Semiconductor device |
| 06/12/2014 | WO2014088025A1 Substrate for power modules, substrate with heat sink for power modules, power module, method for producing substrate for power modules, paste for copper plate bonding, and method for producing bonded body |
| 06/12/2014 | WO2014087397A1 An integrated electronic device including an interposer structure and a method for fabricating the same |
| 06/12/2014 | WO2014087047A1 A hermetically sealed optoelectronic component |
| 06/12/2014 | WO2014086427A1 Semiconductor assembly |
| 06/12/2014 | US20140160691 Semiconductor module and method of manufacturing the same |
| 06/12/2014 | US20140159591 Direct-Current Power Supply Device and Lighting Apparatus |
| 06/12/2014 | US20140159247 3D Semiconductor Interposer for Heterogeneous Integration of Standard Memory and Split-Architecture Processor |
| 06/12/2014 | US20140159212 Stacked type power device module |
| 06/12/2014 | US20140159130 Apparatus including a semiconductor device coupled to a decoupling device |
| 06/12/2014 | US20140159079 Cost-effective led lighting instrument with good light output uniformity |
| 06/12/2014 | US20140159075 Light-emitting device package and method of manufacturing the same |
| 06/12/2014 | US20140159072 Light-emitting device, light-emitting device assembly, and electrode-bearing substrate |
| 06/12/2014 | DE10218071B4 Kondensatormodul und dieses verwendende Halbleitereinrichtung Capacitor module and this semiconductor device used |
| 06/12/2014 | DE102013221155A1 Passive Komponente als Wärmekapazität und Wärmesenke Passive component as heat capacity and heat sink |
| 06/12/2014 | DE102013107244A1 Gestapelter Fan-Out-Halbleiterchip Stacked fan-out semiconductor chip |
| 06/12/2014 | DE102012222679A1 Verfahren zur Herstellung eines Schaltmoduls und eines zugehörigen Gittermoduls sowie ein zugehöriges Gittermodul und korrespondierende elektronische Baugruppe A process for producing a switching module and an associated grating module and an associated grating module and corresponding electronic assembly |
| 06/12/2014 | DE102012222459A1 Circuit device for producing renewable energy, has metal reservoir that is adapted in circuit device portion, if any overflow of circuit elements occurs to cool in order to delay formation of arc |
| 06/12/2014 | DE102012109211A1 Optoelektronische Bauelementevorrichtung, Verfahren zum Herstellen einer optoelektronischen Bauelementevorrichtung und Verfahren zum Betreiben einer optoelektronischen Bauelementevorrichtung Optoelectronic Devices device, method of manufacturing an opto-electronic device components and methods of operating an opto-electronic device components |
| 06/12/2014 | DE102012024062A1 Magnetfeldsensor Magnetic field sensor |
| 06/12/2014 | DE102012023932A1 Method for manufacturing starlight and night sky ambience integrated headliner for passenger motor car, involves making source to be in contact with contacts with plus and minus regions, and manufacturing regions as vaporized film |
| 06/11/2014 | EP2741340A1 Light-emitting device, light-emitting device assembly, and electrode-bearing substrate |
| 06/11/2014 | EP2741338A1 Electrode structure for light-emitting diode array |
| 06/11/2014 | EP2741329A1 Light-emitting device, light-emitting device assembly, and electrode-bearing substrate |
| 06/11/2014 | EP2741328A1 Light-emitting device and luminaire |
| 06/11/2014 | EP2741327A1 Power converter package including top-drain configured power FET |
| 06/11/2014 | CN203644776U 一种低反压bed集成功率三极管 A low backpressure bed integrated power transistor |
| 06/11/2014 | CN203644775U Led灯丝及照明器具 Led filament and Lighting |
| 06/11/2014 | CN203644774U Led灯泡 Led Bulb |
| 06/11/2014 | CN203644773U 一种新型的cob光源 A new source of cob |
| 06/11/2014 | CN203644772U 一种容量为4G×40bit的立体封装NAND FLASH存储器 One kind of capacity for 4G × 40bit stereo package NAND FLASH memory |
| 06/11/2014 | CN203644771U 一种容量为512K×40bit的立体封装SRAM存储器 Single capacity of 512K × 40bit stereo package SRAM memory |
| 06/11/2014 | CN203644770U 容量为8G×8bit的立体封装NAND FLASH存储器 Capacity 8G × 8bit stereo package NAND FLASH memory |
| 06/11/2014 | CN203644769U 一种容量为1M×8bit的立体封装EEPROM存储器 One kind of capacity for three-dimensional packaging 1M × 8bit EEPROM memory |
| 06/11/2014 | CN203644768U 一种容量为8G×8bit的立体封装NAND FLASH存储器 Capacity 8G × 8bit one kind of three-dimensional packaging NAND FLASH memory |
| 06/11/2014 | CN203644767U 一种容量为16G×8bit的立体封装NAND FLASH存储器 Capacity of 16G × 8bit one kind of three-dimensional packaging NAND FLASH memory |
| 06/11/2014 | CN203644766U 一种容量为128K×40bit的立体封装EEPROM存储器 Single capacity of 128K × 40bit stereo package EEPROM memory |
| 06/11/2014 | CN203644765U 一种容量为256K×32bit的立体封装EEPROM存储器 Single capacity of 256K × 32bit stereo package EEPROM memory |
| 06/11/2014 | CN203644764U 一种容量为512K×8bit的立体封装EEPROM存储器 Capacity of 512K × 8bit one kind of three-dimensional package EEPROM memory |
| 06/11/2014 | CN203644763U 一种容量为512M×8bit的立体封装NAND FLASH存储器 Capacity of 512M × 8bit one kind of three-dimensional packaging NAND FLASH memory |
| 06/11/2014 | CN203644762U 一种容量为4G×8bit的立体封装NAND FLASH存储器 One kind of capacity for three-dimensional packaging 4G × 8bit NAND FLASH memory |
| 06/11/2014 | CN203644761U 一种d系列、gbu系列整流桥 One kind of d series, gbu series rectifier bridge |
| 06/11/2014 | CN103858230A Opto-electronic module and method for manufacturing the same |
| 06/11/2014 | CN103858229A PCB attachment structure and semiconductor device using structure |
| 06/11/2014 | CN103858228A Semiconductor device and method of manufacture thereof |
| 06/11/2014 | CN103855914A Power supply system, power module in power supply system and manufacturing method for power module |
| 06/11/2014 | CN103855287A Light emitting component and light emitting device with light emitting component |