Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
04/2003
04/02/2003CN1408125A Dual-die integrated circuit package
04/02/2003CN1407619A High-density inter connecting structure between small sheets of circuit
04/01/2003US6542376 High density packaging of electronic components
04/01/2003US6542365 Coolant cooled type semiconductor device
04/01/2003US6541871 Method for fabricating a stacked chip package
04/01/2003US6541870 Semiconductor package with stacked chips
04/01/2003US6541869 Scalable data processing apparatus
04/01/2003US6541861 Semiconductor device manufacturing method including forming step of SOI structure and semiconductor device having SOI structure
04/01/2003US6541856 Thermally enhanced high density semiconductor package
04/01/2003US6541851 Lead frame for a semiconductor device
04/01/2003US6541847 Packaging for multi-processor shared-memory system
04/01/2003US6541835 Integrated ΔE-E detector telescope
04/01/2003US6541800 High power LED
04/01/2003US6541314 Semiconductor device with SOI structure and method of manufacturing the same
04/01/2003US6541307 Multimedia chip package
04/01/2003US6540377 Full-color light source unit
03/2003
03/28/2003CA2396813A1 Replaceable led lamp capsule
03/27/2003WO2003026155A1 High-frequency wave composite switch module and mobile body communication device using the same
03/27/2003WO2003026030A1 White light led with multicolor light-emitting layers of macroscopic structure widths, arranged on a light-diffusing glass
03/27/2003WO2003026027A2 Solar array concentrator system and method for concentrating solar energy
03/27/2003WO2003026016A2 Image sensor with recessed planarizing layers and method for making same
03/27/2003WO2003026010A1 Thin electronic label and method for making same
03/27/2003WO2003026009A2 Power electronics component
03/27/2003WO2003026008A2 Power electronics component
03/27/2003WO2003025458A1 Variable optics spot module
03/27/2003WO2003025081A1 Die attached adhesives for semiconductor devices, an efficient process for producing such devices and the devices per se produced by the efficient processes
03/27/2003WO2003025080A1 Die attach adhesives for semiconductor applications, processes for producing semiconductor devices and semiconductor devices produced by such processes
03/27/2003WO2002069396A3 Vehicular modular design multiple application rectifier assembly having outer lead integument
03/27/2003WO2002023620A3 Connection for conducting high frequency signal between a circuit and a discrete electrical component
03/27/2003US20030060172 Radio frequency module
03/27/2003US20030060034 Method of transferring ultra-thin substrates and application of the method to the manufacture of a multi-layer thin film device
03/27/2003US20030060000 Wiring board and fabricating method thereof, semiconductor device and fabricating method thereof, circuit board and electronic instrument
03/27/2003US20030059976 Integrated package and methods for making same
03/27/2003US20030059721 Forming copper wire on heat resistant tape; overcoating with photoresist; imaging with light source; packaging using epoxy resin
03/27/2003US20030057829 Illumination device with at least one LED as light source
03/27/2003US20030057775 Semiconductor integrated circuit and multi-chip package
03/27/2003US20030057573 Semiconductor device
03/27/2003US20030057563 Integrated package and methods for making same
03/27/2003US20030057559 Methods of forming metallurgy structures for wire and solder bonding
03/27/2003US20030057544 Substrate for receipt of packaged components face down or face up in such manner as to allow interconnection of packaged components using photolithographic techniques or direct laser writing so as to provide a monolithic integrated structure
03/27/2003US20030057540 Combination-type 3D stacked IC package
03/27/2003US20030057539 Bumping technology in stacked die configurations
03/27/2003US20030057538 Die attach adhesives for semiconductor applications efficient processes for producing such devices and the devices per se produced by the efficient processes
03/27/2003US20030057533 Amorphous silicon sensor with micro-spring interconnects for achieving high uniformity in integrated light-emitting sources
03/27/2003US20030057513 Membrane IC fabrication
03/27/2003US20030057454 Semiconductor device comprising memories on the inside and outside of bonding pad
03/27/2003US20030057446 Electronic device having a trimming possibility and at least one semiconductor chip and method for producing the electronic device
03/27/2003US20030057430 Comprises package including circuit board housing attached to a printed circuit board for supporting diode
03/27/2003US20030057425 Active matrix display device
03/27/2003US20030057423 Three-dimensional device
03/27/2003US20030057330 Solar array concentrator system and method
03/27/2003US20030056981 Ceramic circuit board and method for manufacturing the same
03/26/2003EP1296383A2 Radiation unit with at least one LED
03/26/2003EP1296376A2 Illumination device with at least one LED as the light source
03/26/2003EP1295340A2 Semiconductor chip
03/26/2003EP0792519B1 Interconnection elements for microelectronic components
03/26/2003CN2541711Y Track inspection lamp
03/26/2003CN1405885A 半导体器件 Semiconductor devices
03/26/2003CN1405882A 半导体器件 Semiconductor devices
03/25/2003US6538895 TSOP memory chip housing configuration
03/25/2003US6538878 Bus bar assembly
03/25/2003US6538333 Three dimensional IC package module
03/25/2003US6538332 Semiconductor device and method of production of same
03/25/2003US6538331 Semiconductor device and a method of manufacturing the same
03/25/2003US6538312 Multilayered microelectronic device package with an integral window
03/25/2003US6538250 Microbolometer focal plane array with controlled bias
03/25/2003US6538214 Method for manufacturing raised electrical contact pattern of controlled geometry
03/25/2003US6538210 Circuit component built-in module, radio device having the same, and method for producing the same
03/25/2003US6537852 Spacer - connector stud for stacked surface laminated multichip modules and methods of manufacture
03/25/2003US6537831 Method for selecting components for a matched set using a multi wafer interposer
03/25/2003US6537051 Encapsulation mold with a castellated inner surface
03/25/2003CA2273222C Three-dimensional component stacking using high density multichip interconnect decals
03/20/2003WO2003024169A1 A stacked multi-layer module and methods of side connection thereto and of manufacturing
03/20/2003WO2003024159A2 Fault tolerant led display
03/20/2003WO2003024158A1 Power efficient led driver quiescent current limiting circuit configuration
03/20/2003WO2003024157A2 Voltage dimmable led display producing multiple colors
03/20/2003WO2003023867A1 Three-dimensional array of photovoltaic cells
03/20/2003WO2003023857A2 Led-luminous panel and carrier plate
03/20/2003WO2003023856A2 Semiconductor structures with cavities, and methods of fabrication
03/20/2003WO2003023850A1 Semiconductor package
03/20/2003WO2003023843A1 Semiconductor device, its manufacturing method, and radio communication device
03/20/2003WO2003023834A2 Method of manufacturing optical devices and related improvements
03/20/2003WO2003023823A2 Stacking of multilayer modules
03/20/2003WO2002078083A3 In-street integrated circuit wafer via
03/20/2003US20030054618 Angled edge connections for multichip structures
03/20/2003US20030054590 Semiconductor device and method of production of same
03/20/2003US20030054162 Adhesive for joining surface of semiconductor
03/20/2003US20030053789 Tuning a band-gap by intermixing an impurity with one Quantum Well in the at least two areas to different values; copper or a copper alloy impurity; high-speed diffusion; dopes
03/20/2003US20030053310 Variable optics spot module
03/20/2003US20030053298 Liquid cooled circuit device and a manufacturing method thereof
03/20/2003US20030053294 Liquid cooled circuit device and a manufacturing method thereof
03/20/2003US20030052595 Illumination unit having at least one LED as light source
03/20/2003US20030052594 Lighting apparatus whose light emitting elements are hard to be taken off
03/20/2003US20030052584 Lighting apparatus with enhanced capability of removing heat
03/20/2003US20030052413 Semiconductor device
03/20/2003US20030052409 Semiconductor device and method of manufacturing the same
03/20/2003US20030052399 Semiconductor device having semiconductor element packaged on interposer
03/20/2003US20030052393 Semiconductor device
03/20/2003US20030052380 Optical device carrier
03/20/2003US20030051908 Dram module package
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