Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
04/2003
04/17/2003US20030070798 Heat sink for a rectifier
04/17/2003US20030070708 Adjustable solar panel
04/17/2003US20030070704 Nonrotating pivotable solar panel
04/17/2003US20030070291 Method for making a heat sink for a rectifier
04/16/2003EP1301946A2 Power conditioning substrate stiffener
04/16/2003EP1301917A1 Passive radiation optical system module especially for use with light-emitting diodes
04/16/2003EP0932926B1 Low resistance current transfer device for a circuit of a brushless exciter
04/16/2003CN2545707Y Surface patch type multi-wafer combined device
04/16/2003CN2545706Y Sheet type miniature bridge stack
04/16/2003CN1411615A Electro-optical device
04/16/2003CN1411149A Semiconductor integrated circuit and its multi-board package
04/16/2003CN1411068A 半导体集成电路 The semiconductor integrated circuit
04/16/2003CN1411062A Stacked semiconductor device
04/16/2003CN1411061A Dynamic random access memory module package
04/16/2003CN1411043A Method for mounting semiconductor element
04/15/2003US6549421 Stackable ball grid array package
04/15/2003US6549420 Method and apparatus for increasing memory capacity
04/15/2003US6549179 LED display assembly
04/15/2003US6548911 Multimedia chip package
04/15/2003US6548891 Semiconductor device and production process thereof
04/15/2003US6548890 Press-contact type semiconductor device
04/15/2003US6548882 Power transistor cell
04/15/2003US6548832 Hybrid integrated circuit device
04/15/2003US6548391 Method of vertically integrating electric components by means of back contacting
04/15/2003US6548376 Methods of thinning microelectronic workpieces
04/15/2003US6548330 Semiconductor apparatus and method of fabricating semiconductor apparatus
04/15/2003US6548328 Circuit device and manufacturing method of circuit device
04/15/2003US6548326 Semiconductor device and process of producing same
04/15/2003US6548325 Wafer thickness compensation for interchip planarity
04/10/2003WO2003030525A1 Reduced area imaging devices utilizing selected charge integration periods
04/10/2003WO2003030274A1 Light-emitting device and its manufacturing method
04/10/2003WO2003030260A1 Semiconductor device and semiconductor device manufacturing method
04/10/2003WO2003030255A2 Multiple die interconnect system
04/10/2003WO2003030254A2 Process for assembling systems and structure thus obtained
04/10/2003WO2003030252A2 Process for producing interconnects
04/10/2003WO2003030247A2 Method for contacting electrical contact surfaces of a substrate and device consisting of a substrate having electrical contact surfaces
04/10/2003WO2003030245A2 Method for assembly of complementary-shaped receptacle site and device microstructures
04/10/2003WO2003030225A2 Semiconductor chip with multiple rows of bond pads
04/10/2003WO2002078055A3 Light extractor apparatus
04/10/2003WO2002041398A3 Microelectronic packages and packaging methods in which second microelectronic substrates are oriented relative to first microelectronic substrates at acute angles
04/10/2003US20030069654 Folded interposer
04/10/2003US20030068519 Method for assembly of complementary-shaped receptacle site and device microstructures
04/10/2003US20030067786 Vehicle headlamp and a vehicle
04/10/2003US20030067775 Light-emitting unit, light-emitting unit combination, and lighting apparatus assembled from a plurality of light-emitting units
04/10/2003US20030067773 LED/phosphor-LED hybrid lighting systems
04/10/2003US20030067749 Water cooled inverter
04/10/2003US20030067748 Water cooled inverter
04/10/2003US20030067083 Packaged stacked semiconductor die and method of preparing same
04/10/2003US20030067082 Apparatus and methods for stacking integrated circuit devices with interconnected stacking structure
04/10/2003US20030067065 Three-dimensional power semiconductor module and method of manufacturing the same
04/10/2003US20030067064 Stack package using flexible double wiring substrate
04/10/2003US20030066555 Maximum power tracking technique for solar panels
04/09/2003EP1301062A2 Semiconductor device, semiconductor package, electronic device, and method for establishing information processing environment
04/09/2003EP1300001A1 Communication devices incorporating reduced area imaging devices
04/09/2003EP1299910A1 Led module, method for producing the same and the use thereof
04/09/2003EP1299908A1 Method for producing an led light source
04/09/2003CN2544172Y Automatic color gradually changing multi-color lamp
04/09/2003CN2544171Y LED color-changeable bulb
04/09/2003CN2544169Y Solar energy courtyard lamp
04/09/2003CN2544168Y 太阳能草坪灯 Solar Lawn
04/09/2003CN2544167Y Bulb for solar energy
04/09/2003CN1409873A Power transistor module, power amplifier and method in fabrication thereof
04/09/2003CN1409435A High frequency module
04/09/2003CN1409415A Light-emitting unit, light-emitting unit assembly and light-emitting device composed of multiple light-emitting units
04/09/2003CN1105483C 半导体器件封装 The semiconductor device package
04/08/2003US6545868 Electronic module having canopy-type carriers
04/08/2003US6545367 Semiconductor package substrate, semiconductor package
04/08/2003US6545366 Multiple chip package semiconductor device
04/08/2003US6545365 Resin-sealed chip stack type semiconductor device
04/08/2003US6545228 Semiconductor device with a plurality of stacked boards and method of making
04/08/2003US6544866 Semiconductor device fabricated on multiple substrate
04/08/2003US6544815 Panel stacking of BGA devices to form three-dimensional modules
04/03/2003WO2003028418A1 Thin film circuit board device and its manufacturing method
04/03/2003WO2003028103A2 Multi-stack surface mount light emitting diodes
04/03/2003WO2003028102A2 Modification of the function of a chip using a multi-chip housing
04/03/2003WO2003028088A2 Methods of forming metallurgy structures for wire and solder bonding and related structures
04/03/2003WO2002084716A3 Stacked semiconductor device assembly with microelectronic spring contacts
04/03/2003US20030064548 Panel stacking of BGA devices to form three-dimensional modules
04/03/2003US20030064547 High density modularity for IC's
04/03/2003US20030064545 Low profile stacked multi-chip package and method of forming same
04/03/2003US20030063476 Replaceable LED lamp capsule
04/03/2003US20030063462 Illumination light source
04/03/2003US20030063450 Multiple die interconnect system
04/03/2003US20030063442 Power module
04/03/2003US20030062631 Semiconductor device and method of fabricating the same
04/03/2003US20030062628 Multi-chip package having spacer that is inserted between chips and manufacturing method thereof
04/03/2003US20030062620 Semiconductor device
04/03/2003US20030062614 Used to achieve a high density semiconductor package
04/03/2003US20030062613 Semiconductor device and manufacturing method thereof
04/03/2003US20030062612 Stacked type semiconductor device
04/03/2003US20030062611 Semiconductor device
04/03/2003US20030062541 High-frequency chip packages
04/03/2003US20030062518 Method for encapsulation of electronic devices
04/03/2003US20030062398 Method for manufacturing raised electrical contact pattern of controlled geometry
04/03/2003US20030062078 Photovoltaic module, photovoltaic module array, photovoltaic system, and method of detecting failure of photovoltaic module
04/03/2003DE10138278C1 Elektronisches Bauteil mit aufeinander gestapelten elektronischen Bauelementen und Verfahren zur Herstellung derselben An electronic part having stacked electronic components and methods for making same
04/02/2003EP1298383A2 Replaceable led lamp capsule
04/02/2003EP1297572A1 Led lamp
04/02/2003EP0796506B1 Arrays of optoelectronic devices and method of making same
04/02/2003CN2543206Y Internal storage chip stacking structure
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