Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
05/2003
05/06/2003US6560760 Automatic cell placement method
05/06/2003US6560117 Packaged microelectronic die assemblies and methods of manufacture
05/06/2003US6560109 Stack of multilayer modules with heat-focusing metal layer
05/06/2003US6559539 Stacked package structure of image sensor
05/06/2003US6559534 Thermal capacity for electronic component operating in long pulses
05/06/2003US6559531 Face to face chips
05/06/2003US6559528 Semiconductor device and method for the fabrication thereof
05/06/2003US6558978 Chip-over-chip integrated circuit package
05/06/2003US6558977 Semiconductor device and method for fabricating the same
05/06/2003US6558970 Light irradiating device, manufacturing method thereof, and lighting apparatus using the light irradiating device
05/06/2003US6558966 Apparatus and methods of packaging and testing die
05/02/2003EP1306902A1 High-frequency module and its manufacturing method
05/02/2003EP1306901A2 Systems and methods for electrically isolating portions of wafers
05/02/2003EP1306900A2 Chip-scale packages stacked on folded interconnector for vertical assembly on substrates
05/02/2003EP1306899A1 Wiring method and element arranging method using the same, and method of producing image display devices
05/02/2003EP1198797B1 Semiconductor memory chip module
05/01/2003WO2003037053A1 Chip scale stacking system and method
05/01/2003WO2003036731A1 Light emitting or light receiving semiconductor module and method for manufacturing the same
05/01/2003WO2003036720A2 Led chip package
05/01/2003WO2003036715A2 Adhesive wafers for die attach application
05/01/2003US20030082897 Method for forming bumps, semiconductor device, and solder paste
05/01/2003US20030082856 Method and apparatus for a semiconductor package for vertical surface mounting
05/01/2003US20030082846 Manufacturing method of a semiconductor device incorporating a passive element and a redistribution board
05/01/2003US20030082845 Package for multiple integrated circuits and method of making
05/01/2003US20030081638 Multi-wavelength semiconductor laser arrays and applications thereof
05/01/2003US20030081392 Integrated circuit stacking system and method
05/01/2003US20030081389 Silicon interposer-based hybrid voltage regulator system for VLSI devices
05/01/2003US20030081384 Method for increasing the dielectric strength of isolated base integrated circuits used with variable frequency drives
05/01/2003US20030080438 Semiconductor module
05/01/2003US20030080417 Semiconductor device, semiconductor package, electronic device, and method for establishing information processing environment
05/01/2003US20030080410 Semiconductor device and method for manufacturing same
05/01/2003US20030080408 Method for fabricating semiconductor components and interconnects with contacts on opposing sides
05/01/2003US20030080403 Apparatus and method for leadless packaging of semiconductor devices
05/01/2003US20030080401 Interconnection of active and passive components in substrate
05/01/2003US20030080400 Semiconductor system-in-package
05/01/2003US20030080398 Packaged integrated circuits and methods of producing thereof
05/01/2003US20030079909 Stacking multiple devices using direct soldering
05/01/2003US20030079895 Lead frame of optical coupling device and manufacturing method of same
04/2003
04/29/2003US6555918 Stacked semiconductor device including improved lead frame arrangement
04/29/2003US6555917 Semiconductor package having stacked semiconductor chips and method of making the same
04/29/2003US6555902 Multiple stacked-chip packaging structure
04/29/2003US6555760 Electronic circuit interconnection system using a virtual mirror cross over package
04/29/2003US6555399 Double-packaged multichip semiconductor module
04/29/2003US6553660 Electronic device and a method of manufacturing the same
04/29/2003US6553658 Assembling a stacked die package
04/24/2003WO2003034495A2 Method for packing electronic modules and multiple chip packaging
04/24/2003WO2003034494A1 Module component
04/24/2003WO2003034491A2 Semiconductor component
04/24/2003WO2003034467A2 Semiconductor power module
04/24/2003WO2002050907A3 Interconnection of active and passive components in substrate
04/24/2003WO2002050899A3 Semiconductor package
04/24/2003WO2001099188A3 Semiconductor package and method
04/24/2003US20030077940 Housing device and contact element to be used in the housing device
04/24/2003US20030077877 Systems and methods for electrically isolating portions of wafers
04/24/2003US20030076660 Electronic device and a circuit arrangement
04/24/2003US20030076034 Led chip package with four led chips and intergrated optics for collimating and mixing the light
04/24/2003US20030076033 Ventilated light emitting diode matrix panel
04/24/2003US20030075811 Spacer-connector stud for stacked surface laminated multi-chip modules and methods of manufacture
04/24/2003US20030075797 Semiconductor device and method of manufacturing the same
04/24/2003US20030075796 Semiconductor device
04/24/2003US20030075791 Semiconductor device
04/24/2003US20030075789 Semiconductor storage device having memory chips in a stacked structure
04/24/2003US20030075788 Stacked semiconductor package and fabricating method thereof
04/24/2003US20030075783 Semiconductor device
04/24/2003US20030075722 Integrated led/photodiode collimator array
04/24/2003US20030075356 Electronic device and method of manufacturing the same
04/23/2003EP1304909A1 High-frequency semiconductor device
04/23/2003EP1304742A2 Component built-in module and method for producing the same
04/23/2003CN2547006Y Electroinc luminotron
04/23/2003CN1412838A High frequency semiconductor device
04/23/2003CN1106691C Packaging for stacked semiconductor chip and its producing method
04/22/2003US6552910 Interface coupling; durable; low cost
04/22/2003US6552908 Vehicular modular design multiple application rectifier assembly having outer lead integument
04/22/2003US6552694 Semiconductor device and fabrication method thereof
04/22/2003US6552429 Power switching semiconductor device with suppressed oscillation
04/22/2003US6552426 Semiconductor device and method of manufacturing same
04/22/2003US6552424 Angled edge connections for multichip structures
04/22/2003US6552423 Higher-density memory card
04/22/2003US6552419 Semiconductor device and liquid crystal module using the same
04/22/2003US6552418 Resin-encapsulated semiconductor device
04/22/2003US6552416 Multiple die lead frame package with enhanced die-to-die interconnect routing using internal lead trace wiring
04/22/2003US6552409 Techniques for addressing cross-point diode memory arrays
04/22/2003US6552368 Light emission device
04/22/2003US6552257 Nonrotating pivotable solar panel
04/22/2003US6550953 Light emitting diode lamp device
04/22/2003US6550949 Systems and components for enhancing rear vision from a vehicle
04/17/2003WO2003032390A2 Device with power semiconductor components for controlling the power of high currents and use of said device
04/17/2003WO2003032389A1 Voltage conversion module
04/17/2003WO2003032370A2 Stacked packages
04/17/2003WO2002049107A3 Method for stacking semiconductor die within an implanted medical device
04/17/2003US20030073266 Semiconductor device and a method of manufacturing the same
04/17/2003US20030072153 Lighting apparatus with enhanced capability of heat dissipation
04/17/2003US20030071362 Assemblies including stacked semiconductor devices separated a distance defined by adhesive material interposed therebetween, packages including the assemblies, and methods
04/17/2003US20030071350 High-frequency semiconductor device
04/17/2003US20030071348 Semiconductor module and mounting method for same
04/17/2003US20030071341 Apparatus and method for leadless packaging of semiconductor devices
04/17/2003US20030071340 Assemblies including stacked semiconductor devices separated a distance defined by adhesive material interposed therebetween, packages including the assemblies, and methods
04/17/2003US20030071338 Apparatus and method for leadless packaging of semiconductor devices
04/17/2003US20030071335 Apparatus and method for leadless packaging of semiconductor devices
04/17/2003US20030071270 Semiconductor light emitting element formed on a clear or translucent substrate
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