Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
05/2003
05/22/2003US20030096520 Press-fit bus bar distributing power
05/22/2003US20030096454 Stackable semiconductor package and wafer level fabrication method
05/22/2003US20030094893 Illumination unit having at least one LED as light source
05/22/2003US20030094704 Method of fabricating known good dies from packaged integrated circuits
05/22/2003US20030094702 Multi-chip module
05/22/2003US20030094693 Multi-chip module packaging device
05/22/2003US20030094685 Semiconductor device and module of the same
05/22/2003US20030094684 Center pad type IC chip with jumpers, method of processing the same and multi chip package
05/22/2003US20030094683 Stackable semiconductor package and wafer level fabrication method
05/22/2003US20030094682 Semiconductor module and insulating substrate thereof
05/22/2003US20030094626 Light-emitting device with organic layer doped with photoluminescent material
05/22/2003DE10231219C1 Semiconductor relay has ceramic substrate carrying semiconductor elements, 2-part housing enclosing connection elements, heat sink base and control device
05/22/2003CA2465296A1 Multichip module
05/21/2003EP1313179A2 Press-fit bus bar for distributing power
05/21/2003EP1313163A1 Multichip module
05/21/2003EP1313142A2 Method of manufacturing a rerouting layer on a semiconductor device and corresponding semiconductor device
05/21/2003EP1312124A1 Optoelectronic component and method for the production thereof, module and device comprising a module of this type
05/21/2003EP1312117A1 Component comprising a large number of light-emitting-diode chips
05/21/2003EP1312116A1 Method for distributed shielding and/or bypass for electronic device with three-dimensional interconnection
05/21/2003EP1240808B1 Encapsulation for organic led device
05/21/2003CN2552168Y Improvement of LED lamp bulb structure for vehicle
05/21/2003CN1419798A Gate driver multi-chip module
05/21/2003CN1419285A Semiconductor device and making method thereof
05/20/2003US6566760 Semiconductor storage device having memory chips in a stacked structure
05/20/2003US6566750 Semiconductor module
05/20/2003US6566746 Panel stacking of BGA devices to form three-dimensional modules
05/20/2003US6566610 Stacking multiple devices using direct soldering
05/20/2003US6566232 Method of fabricating semiconductor device
05/20/2003US6564454 Method of making and stacking a semiconductor package
05/20/2003CA2363529A1 Press-fit bus bar for distributing power
05/15/2003WO2003041180A1 Photovoltaic assembly array with covered bases
05/15/2003WO2003041158A2 Semiconductor package device and method of formation and testing
05/15/2003WO2003041148A1 Gas for plasma reaction, process for producing the same, and use
05/15/2003WO2003039974A2 Package enclosing multiple packaged chips
05/15/2003WO2003001566A3 Extendible drain members for grounding rfi/emi shielding
05/15/2003US20030092256 Method of manufacturing semiconductor device and its device
05/15/2003US20030092208 Electro-optical transceiver system with controlled lateral leakage and method of making it
05/15/2003US20030090883 Component built-in module and method for producing the same
05/15/2003US20030090876 Module including one or more chips
05/15/2003US20030090873 Coolant cooled type semiconductor device
05/15/2003US20030090358 Power distributing box and power-device module
05/15/2003US20030090291 Electronic device
05/15/2003US20030089998 Direct interconnect multi-chip module, method for making the same and electronic package comprising same
05/15/2003US20030089995 Solid state power amplifying device
05/15/2003US20030089994 Soild state power amplifying device
05/15/2003US20030089980 Semiconductor component
05/15/2003US20030089978 Memory-module and a method of manufacturing the same
05/15/2003US20030089977 Package enclosing multiple packaged chips
05/15/2003US20030089974 Semiconductor device
05/15/2003US20030089972 Semiconductor device
05/15/2003US20030089868 Semiconductor device manufacturing method and semiconductor device
05/15/2003DE20219869U1 Rapidly cooled light emitting diode has gas tight thermally conductive cover and cooling fins on the substrate
05/14/2003EP1311072A1 Transmitter and receiver module
05/14/2003EP1310996A2 Direct interconnect multi-chip module, method for making the same and electronic package comprising same
05/14/2003EP1310993A2 Method for enhancing the electric connection between a power electronic device and its package
05/14/2003EP1310934A1 Image display unit and production method for image display unit
05/14/2003EP1310090A1 Hand-held computers incorporating reduced area imaging devices
05/14/2003EP1309998A1 Method for electrically connecting a semiconductor component to an electrical subassembly
05/14/2003EP1309994A2 Encapsulated organic-electronic component, method for producing the same and use thereof
05/14/2003CN2550905Y Serial structure of light emitting diode wafer
05/14/2003CN1418374A Vertical electrical interconnestions in stack
05/14/2003CN1418048A Built-in module in element and its making process
05/14/2003CN1417868A Multiple-chip package structure of LED chip
05/14/2003CN1417861A 3D memory equipment with great memory capacity
05/14/2003CN1108634C Method of wire bonding IC to ultraflexible substrate
05/13/2003US6563712 Heak sink chip package
05/13/2003US6563691 Mounting structure for capacitors
05/13/2003US6563340 Architecture for implementing two chips in a package
05/13/2003US6563217 Module assembly for stacked BGA packages
05/13/2003US6563211 Semiconductor device for controlling electricity
05/13/2003US6563206 Semiconductor device and semiconductor device structure
05/13/2003US6563205 Angularly offset and recessed stacked die multichip device and method of manufacture
05/13/2003US6563196 Semiconductor wafer, semiconductor device and manufacturing method therefor
05/13/2003US6563139 Reflective metal and transparent conductive layers overlap and bond red, blue and green dice; computer boards
05/13/2003US6563117 Article comprising IR-reflective multi-well plates
05/13/2003US6562653 Silicon interposer and multi-chip-module (MCM) with through substrate vias
05/13/2003US6561690 Luminaire based on the light emission of light-emitting diodes
05/08/2003WO2003038867A1 Method of manufacturing modules with an organic integrated circuit
05/08/2003WO2003038865A2 Stacking multiple devices using direct soldering
05/08/2003WO2003003448A3 High temperature electrostatic chuck
05/08/2003US20030087479 Adhesive wafers for die attach application
05/08/2003US20030087474 Method of manufacturing modules with an integrated circuit
05/08/2003US20030085790 Inductive micro-sensor formed flat on an integrated circuit
05/08/2003US20030085463 Semiconductor package device for use with multiple integrated circuits in a stacked configuration and method fo formation and testing
05/08/2003US20030085461 Multi-chip module, semiconductor chip, and interchip connection test method for multi-chip module
05/08/2003US20030085460 Integrated circuits and methods for their fabrication
05/08/2003US20030085458 Semiconductor device
05/08/2003US20030085457 Semiconductor device
05/08/2003US20030085456 Semiconductor power package module
05/08/2003US20030085455 Thermal ring used in 3-D stacking
05/08/2003US20030085423 Power semiconductor module
05/08/2003US20030085256 Semiconductor manufacturing apparatus and method, semiconductor device and electronic device
05/07/2003EP1309004A1 Semiconductor device
05/07/2003EP1308969A1 Inductive microsensor flat formed on a substrate
05/07/2003EP1308958A2 Three dimensional large storage random access memory device
05/07/2003EP0713609B1 Stack of ic chips as substitute for single ic chip
05/07/2003EP0683968B1 Module comprising ic memory stack dedicated to and structurally combined with an ic microprocessor
05/07/2003CN1416595A Wiring beard, semiconductor device, and method of mfg. wiring board
05/07/2003CN1416594A Method of forming stacked-die intrgrated circuit chip package on wafer level
05/07/2003CN1416171A Illuminator capable of changing color freely
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