Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
06/2003
06/10/2003US6577508 Multilayer circuit board
06/10/2003US6577332 Optical apparatus and method of manufacturing optical apparatus
06/10/2003US6577073 Led lamp
06/10/2003US6577032 Rectifier unit of vehicle AC generator
06/10/2003US6577016 Semiconductor device having adhesive inflow preventing means
06/10/2003US6577013 Chip size semiconductor packages with stacked dies
06/10/2003US6576998 Thin semiconductor package with semiconductor chip and electronic discrete device
06/10/2003US6576997 Semiconductor device and method for fabricating the same
06/10/2003US6576992 Chip scale stacking system and method
06/10/2003US6576505 Method for transferring and stacking of semiconductor devices
06/10/2003US6576499 Electronic device assembly and a method of connecting electronic devices constituting the same
06/10/2003US6576498 Semiconductor device and a method of manufacturing the same
06/05/2003WO2003047325A1 High-frequency circuit block, its manufacturing method, high-frequency module device, and its manufacturing method
06/05/2003WO2003047306A2 Radial power megasonic transducer
06/05/2003WO2003046995A1 Matrix-addressable apparatus with one or more memory devices
06/05/2003WO2003046989A2 Multi-chip module semiconductor devices
06/05/2003WO2003046988A2 Electronic assembly
06/05/2003WO2003046987A1 Unit semiconductor device, its manufacturing method, and three-dimensional laminated type semiconductor device
06/05/2003WO2003024159A3 Fault tolerant led display
06/05/2003WO2003010830A3 Multichip led package with in-package quantitative and spectral sensing capability and digital signal output
06/05/2003WO2003007375A3 Single package containing multiple integrated circuit devices
06/05/2003US20030104655 Semiconductor integrated circuit package, semiconductor apparatus provided with a plurality of semiconductor integrated circuit packages, method of inspecting semiconductor integrated circuit package and method of fabricating semiconductor integrated circuit package
06/05/2003US20030104652 Semiconductor chip package and method of manufacturing same
06/05/2003US20030103312 Internal reactor thyristor stack
06/05/2003US20030102572 Integrated assembly protocol
06/05/2003US20030102570 Electronic device and a method of manufacturing the same
06/05/2003US20030102569 Method and apparatus for die stacking
06/05/2003US20030102567 Integrated circuit die having bond pads near adjacent sides to allow stacking of dice without regard to dice size
06/05/2003US20030102558 Vertical surface mount package utilizing a back-to-back semiconductor device module
06/05/2003US20030102547 Semiconductor device and production method thereof
06/05/2003US20030102546 Method and apparatus for package reduction in stacked chip and board assemblies
06/05/2003US20030102543 Resin-molded semiconductor device
06/05/2003US20030102506 Circuit configuration
06/05/2003US20030102495 Reconfigurable processor module comprising hybrid stacked integrated circuit die elements
06/05/2003US20030102494 Semiconductor device
06/05/2003US20030102489 Power device having multi-chip package structure
06/05/2003US20030102483 Method of manufacturing optical semiconductor device
06/05/2003US20030102358 Stacked chip connection using stand off stitch bonding
06/05/2003US20030102079 Method of joining components
06/05/2003US20030101583 Method for assembling die package
06/05/2003DE20302177U1 Micro-technological building block for electronic components has frame made of non-conducting material holding metal contacts for electronic circuit
06/05/2003CA2467189A1 Matrix-addressable apparatus with one or more memory devices
06/04/2003EP1317001A1 A semiconductor device
06/04/2003EP1316999A1 Method and device of contacting power electronic devices
06/04/2003EP1316998A2 Bumpless Chip Scale Device (CSP) and board assembly
06/04/2003EP1316997A2 Press contact converter
06/04/2003EP1135693B1 Probe card for probing wafers with raised contact elements
06/04/2003CN2554466Y High-photoeffect cold light source lamp
06/04/2003CN1421927A 半导体器件 Semiconductor devices
06/04/2003CN1421925A Semiconductor assembly
06/04/2003CN1110846C Production method of semiconductor apparatus
06/04/2003CN1110845C Chip assemblies, method and equipment for producing the same and producing method of micro-electronic element
06/03/2003US6573653 Chip semiconductor light-emitting device
06/03/2003US6573611 Dual-lead type square semiconductor package and dual in-line memory module using the same
06/03/2003US6573608 Semiconductor device with layered semiconductor chips
06/03/2003US6573593 Integrated circuit with a housing accommodating the integrated circuit
06/03/2003US6573537 Highly reflective ohmic contacts to III-nitride flip-chip LEDs
06/03/2003US6573121 Semiconductor device, method for fabricating the semiconductor device, lead frame and method for producing the lead frame
06/03/2003US6572387 Flexible circuit connector for stacked chip module
05/2003
05/30/2003WO2003044859A1 Multi-chip circuit module and method for producing the same
05/30/2003WO2003003459A3 Arrangement of a semiconductor component on a substrate
05/29/2003US20030100154 Method for enhancing the electric connection between a power electronic device and its package
05/29/2003US20030100148 Semiconductor apparatus of a plurality of semiconductor devices enclosed in case and wiring method therefore
05/29/2003US20030100142 Semiconductor package and method for fabricating the same
05/29/2003US20030098506 Semiconductor device having a semiconductor chip and a lead substrate connected with each other through pads and patterned lead wires without short-circuiting the pads
05/29/2003US20030098505 Semiconductor module
05/29/2003US20030098504 Semiconductor memory module having double-sided stacked memory chip layout
05/29/2003US20030098502 Semiconductor package substrate, semiconductor package
05/29/2003US20030098474 Program-Controlled unit
05/29/2003US20030098472 High-frequency module
05/29/2003US20030098470 Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methods
05/29/2003US20030098468 Multi-chip module semiconductor devices
05/29/2003US20030098460 Semiconductor light-emitting device
05/29/2003US20030098056 Window structure with photovoltaic panel
05/28/2003EP1315207A2 Semiconductor module
05/28/2003EP1315206A2 Semiconductor apparatus of a plurality of semiconductor devices enclosed in a case and wiring method therefore
05/28/2003DE29624411U1 LED arrangement including LED chip for display - has surface contact metallisation on chip connected to electrical conductors on transparent conductor track carrier fixed to chip
05/28/2003DE10205026C1 Semiconductor substrate used for vertical integration of integrated circuits comprises a first conductor strip on its front side, and a region formed by insulating trenches and electrically insulated from the substrate
05/28/2003CN2553515Y Electricity-saving lamp bulb
05/28/2003CN1420589A Press fit bus for distribution
05/28/2003CN1420555A Semiconductor device and method for mfg. same
05/28/2003CN1420538A Method for mfg. semiconductor device, semiconductor device and assembling method trereof
05/28/2003CN1420537A Method and device for mfg. parts after installation of electronic element
05/28/2003CN1110097C Clock skew minimization system and method for IC
05/28/2003CN1110094C Method and apparatus for stress relieved electronic module
05/27/2003US6570324 Image display device with array of lens-lets
05/27/2003US6570271 Apparatus for routing signals
05/27/2003US6570250 Power conditioning substrate stiffener
05/27/2003US6570249 Semiconductor package
05/27/2003US6570248 Structure and method for a high-performance electronic packaging assembly
05/27/2003US6570246 Multi-die package
05/27/2003US6570158 Method and apparatus for infrared-spectrum imaging
05/27/2003US6569762 Three dimensional IC package module
05/27/2003US6569754 Method for making a module including a microplatform
05/27/2003US6569709 Assemblies including stacked semiconductor devices separated a distance defined by adhesive material interposed therebetween, packages including the assemblies, and methods
05/27/2003US6568863 Disposing an optical fiber, sealing the optical fiber and the interconnecting line with a molding material, and removing the interconnecting line, the molding material together with the optical fiber from the mold
05/22/2003WO2003043118A1 Multichip module
05/22/2003WO2003043085A2 Electronic device carrier adapted for transmitting high frequency signals
05/22/2003WO2003019651A3 Through-via vertical interconnects, through-via heat sinks and associated fabrication methods
05/22/2003WO2002069404A3 Circuit arrangement
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