Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
07/2003
07/01/2003US6586823 Semiconductor device that can have a defective bit found during or after packaging process repaired
07/01/2003US6586676 Plastic chip-scale package having integrated passive components
07/01/2003US6586269 Photo-conductive relay and method of making same
07/01/2003US6586105 Sealed with silicon gel
07/01/2003US6585525 Memory modules having conductors at edges thereof and configured to conduct signals to or from the memory modules via the respective edges
07/01/2003US6584681 Using electricoconductive, flexible adhesive to join semi-conductor chips to track planes of substrates
06/2003
06/26/2003WO2003052825A1 Tiled flat panel display, method of manufacturing the same, and sub-display for use in such a display, and method of driving such a display
06/26/2003US20030119298 Semiconductor device, a method of manufacturing the same and an electronic device
06/26/2003US20030117828 Semiconductor chip
06/26/2003US20030117824 Power converter enclosure
06/26/2003US20030117369 Head-mounted display system
06/26/2003US20030117301 Methods, apparatus, and systems for reducing interference on nearby conductors
06/26/2003US20030116861 Multi-substrate microelectronic packages and methods for manufacture
06/26/2003US20030116859 Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board
06/26/2003US20030116846 Stacked structure of a ball grid array (BGA) integrated circuit package
06/26/2003US20030116841 Module housing and power semiconductor module
06/26/2003US20030116839 Multilayer; substrate, dielectric, metallized layer; corrosion resistant protective coating
06/26/2003US20030116835 Memory-module and a method of manufacturing the same
06/26/2003US20030116773 LED array and LED module
06/26/2003US20030116769 Light emission diode package
06/26/2003US20030116349 Semiconductor device and method of manufacture thereof, circuit board, and electronic instrument
06/26/2003US20030116185 Sealed thin film photovoltaic modules
06/25/2003EP1320890A2 Radiation source and method for producing a lens mould
06/25/2003CN2558082Y Stack type chip size package structure
06/25/2003CN2557805Y High power LED lamp
06/25/2003CN1426104A Semiconductor device and its producing method
06/25/2003CN1112663C True color flat panel display of light-emitting diode dot matrix and exciting method and device
06/24/2003US6584004 Electronic circuit package
06/24/2003US6583512 Semiconductor device and method for fabricating the same
06/24/2003US6583511 Semiconductor device and a method of producing the same
06/24/2003US6583503 Semiconductor package with stacked substrates and multiple semiconductor dice
06/24/2003US6583502 Apparatus for package reduction in stacked chip and board assemblies
06/24/2003US6583432 Conformal coating composed of matrix of densely packed parti-cles disbursed in binder; protecting integrated circuits or living beings
06/24/2003US6583418 X-ray detector
06/24/2003US6582992 Stackable semiconductor package and wafer level fabrication method
06/24/2003US6582991 Semiconductor device and method for fabricating the same
06/24/2003US6582979 Structure and method for fabrication of a leadless chip carrier with embedded antenna
06/24/2003US6581276 Fine-pitch flexible connector, and method for making same
06/19/2003WO2003051095A1 Power module and power module assembly
06/19/2003WO2003050909A1 Circuit board device and its manufacturing method
06/19/2003WO2003050851A2 A semiconductor device
06/19/2003WO2003050694A1 Reconfigurable processor module comprising hybrid stacked integrated circuit die elements
06/19/2003WO2003003797A3 Structure and method for fabrication of a leadless multi-die carrier
06/19/2003WO2002095817A3 Semiconductor component with at least one semiconductor chip on a base chip serving as substrate and method for production thereof
06/19/2003US20030113998 Flex tab for use in stacking packaged integrated circuit chips
06/19/2003US20030113979 Process for making contact with and housing integrated circuits
06/19/2003US20030112614 Ball grid array chip packages having improved testing and stacking characteristics
06/19/2003US20030112610 Method for producing an electronic component having a plurality of chips that are stacked one above the other and contact-connected to one another
06/19/2003US20030112604 Multi-chip package with embedded cooling element
06/19/2003US20030111737 Chip smaller in the ratio is mounted by the wire bonding, while the chip larger in the ratio is mounted by flip-chip method
06/19/2003US20030111736 Csp chip stack with flex circuit
06/19/2003US20030111733 Chip and wafer integration process using vertical connections
06/19/2003US20030111722 Semiconductor device and method of fabricating the same
06/19/2003US20030111720 Stacked die semiconductor device
06/19/2003US20030111718 Vertically mountable and alignable semiconductor device assembly
06/19/2003US20030111716 Wirebonded multichip module
06/19/2003US20030110627 Substrate for receiving a circuit configuration and method for producing the substrate
06/18/2003EP1320122A2 Electronic device
06/18/2003CN1425195A Method for adjusting structures on semiconductor substrate
06/18/2003CN1424872A Threatening device
06/18/2003CN1111910C Method for explosionproofing and extinguishing container having stored explosive liquid and automatic security device
06/17/2003US6580618 Low-profile multi-chip module
06/17/2003US6580613 Solder-free PCB assembly
06/17/2003US6580316 Power transistor module, power amplifier and methods in the fabrication thereof
06/17/2003US6580228 Flexible substrate mounted solid-state light sources for use in line current lamp sockets
06/17/2003US6580187 Rectifier assembly for an air-cooled generator
06/17/2003US6580169 Method for forming bumps, semiconductor device, and solder paste
06/17/2003US6580164 Semiconductor device and method of manufacturing same
06/17/2003US6580147 Semiconductor device having built-in capacitors
06/17/2003US6580092 Semiconductor chip, semiconductor device, and process for producing a semiconductor device
06/17/2003US6580031 Method for making a flexible circuit interposer having high-aspect ratio conductors
06/17/2003US6579745 Method for mounting chips on board using magnetic positioning
06/17/2003US6579743 Chip packaging system and method using deposited diamond film
06/17/2003US6578986 Modular mounting arrangement and method for light emitting diodes
06/12/2003WO2003049204A2 Optoelectronic component
06/12/2003WO2003049185A2 Semiconductor component circuit with a reduced oscillation tendency
06/12/2003WO2003049184A1 Semiconductor device and method for manufacturing the same
06/12/2003US20030109078 Semiconductor device, method for manufacturing the same, and method for mounting the same
06/12/2003US20030107908 Integrated circuit device and module with integrated circuits
06/12/2003US20030107887 Illuminating device with light emitting diodes (led), method of illumination and method for image recording with said led illumination device
06/12/2003US20030107875 Power semiconductor module
06/12/2003US20030107444 Oscillator and electronic apparatus using the same
06/12/2003US20030107130 Contact structure for semiconductor device
06/12/2003US20030107120 Intelligent motor drive module with injection molded package
06/12/2003US20030107119 Stacked semiconductor chips; dielectric overcoatings
06/12/2003US20030107118 Stacked packages
06/12/2003US20030106924 Electronic circuit device and method for manufacturing the same
06/12/2003US20030106579 Solar cell array having lattice or matrix structure and method of arranging solar cells and panels
06/12/2003US20030106209 Method and apparatus for manufacturing known good semiconductor die
06/12/2003US20030106208 Mounting and curing chips on a substrate so as to minimize gap
06/12/2003DE20303317U1 Illuminating module with at least one light emitting diode (LED)
06/11/2003EP1318547A1 Power semiconductor module
06/11/2003EP1318546A1 Semiconductor device
06/11/2003EP1318545A1 Power semiconductor submodule and power semiconductor module
06/11/2003EP1317801A2 Thick film millimeter wave transceiver module
06/11/2003EP1317769A2 Connection for conducting high frequency signal between a circuit and a discrete electrical component
06/11/2003CN2555454Y Hybrid integrated LED all color lamp with high efficiency
06/11/2003CN1423842A Enhanced light extration in LEDS through the use of internal and external optical elements
06/11/2003CN1423330A 功率半导体模块 Power Semiconductor Modules
06/11/2003CN1423329A Power semiconductor secondary assembly and power semiconductor assembly
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