Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
07/2003
07/15/2003US6593647 Semiconductor device
07/15/2003US6593645 Three-dimensional system-on-chip structure
07/15/2003US6593644 System of a package fabricated on a semiconductor or dielectric wafer with wiring on one face, vias extending through the wafer, and external connections on the opposing face
07/15/2003US6593597 Group III-V element-based LED having ESD protection capacity
07/15/2003US6593184 Semiconductor device with stacked memory and logic substrates and method for fabricating the same
07/15/2003US6593169 Method of making hybrid integrated circuit device
07/15/2003US6591492 Angled edge connections for multichip structures
07/15/2003CA2195038C Integrated circuit packaging structure
07/10/2003WO2003056876A2 Uniform illumination system
07/10/2003WO2003056638A2 Method for the production of light-guiding led bodies in two chronologically separate stages
07/10/2003WO2003056633A1 Light receiving or emitting semiconductor apparatus
07/10/2003WO2003056380A1 Light beam switching/adjusting apparatus and manufacturing method thereof
07/10/2003WO2003019940A3 Communication devices incorporating reduced area imaging devices
07/10/2003US20030129829 Three-dimensional integrated semiconductor devices
07/10/2003US20030129822 Cylindrical bonding structure and method of manufacture
07/10/2003US20030129814 Method of manufacturing semiconductor device
07/10/2003US20030129775 Matched set of integrated circuit chips selected from a multi wafer interposer
07/10/2003US20030129271 Package stack via bottom-leaded plastic (BLP) packaging
07/10/2003US20030128919 Device integrated antenna for use in resonant and non-resonant modes and method
07/10/2003US20030128602 Semiconductor device and a method of manufacturing the same
07/10/2003US20030128523 Semiconductor stack; heat exchanging
07/10/2003US20030128522 Radio frequency module
07/10/2003US20030127749 Multiple chips bonded to packaging structure with low noise and multiple selectable functions
07/10/2003US20030127748 Semiconductor package
07/10/2003US20030127746 Panel stacking of BGA devices to form three-dimensional modules
07/10/2003US20030127736 Stacked semiconductor package
07/10/2003US20030127734 Electroconductivity chips; solder blocks; masking pattern
07/10/2003US20030127729 Stacked semiconductor device structure
07/10/2003US20030127724 Double side connected type semiconductor apparatus
07/10/2003US20030127723 TSOP memory chip housing configuration
07/10/2003US20030127722 Semiconductor device and method for fabricating the same
07/10/2003US20030127721 Semiconductor device
07/10/2003US20030127720 Multi-chip stack package and fabricating method thereof
07/10/2003US20030127719 Structure and process for packaging multi-chip
07/10/2003US20030127717 Multi-chip stacking package
07/10/2003US20030127712 Semiconductor device
07/10/2003US20030127704 Polyimide layer; coil; forming pattern
07/10/2003US20030127641 Method for fabricating a metal-oxide electron tunneling device for solar energy conversion
07/10/2003US20030127130 Gel electrolytes; dye sensitizer solar cells
07/10/2003US20030127125 Backup power supply apparatus
07/10/2003US20030127124 Connecting photoelectric cells; soldering into circuit; encapsulation; computer control
07/09/2003EP1326303A2 Stacked radio-frequency module
07/09/2003EP1326291A1 Multi color solid state led/laser
07/09/2003EP1326079A2 Probe card
07/09/2003EP1325521A1 Semiconductor light emitting element formed on a clear or translucent substrate
07/09/2003EP1192841B1 Intelligent power module
07/09/2003CN2559872Y LED emission light
07/09/2003CN2559871Y Light-emitting diode signal light
07/09/2003CN1428875A 热电模块 Thermoelectric Modules
07/09/2003CN1428868A Optical device and mfg. method, optical model, circuit board and electronic machine
07/09/2003CN1428852A Semiconductor device and its production method
07/09/2003CN1428850A Semiconductor module and mfg. method thereof
07/09/2003CN1428849A Module shell and power semiconductor module
07/08/2003US6590346 Double-metal background driven displays
07/08/2003US6590282 Stacked semiconductor package formed on a substrate and method for fabrication
07/08/2003US6590199 Optical information processing apparatus for use in Optical Computing, Optical image processing, and like
07/08/2003US6589859 Method of manufacturing an electronic power component, and an electronic power component obtained thereby
07/08/2003US6589817 Semiconductor device, method for manufacturing the same, and method for mounting the same
07/08/2003US6589813 Chip size stack package and method of fabricating the same
07/08/2003US6588647 Liquid cooled circuit device and a manufacturing method thereof
07/03/2003WO2003054967A1 Profiled photovoltaic roofing panel
07/03/2003WO2003054956A1 Chip and wafer integration process using vertical connections
07/03/2003WO2003024159B1 Fault tolerant led display
07/03/2003WO1999065062A3 Ic stack utilizing secondary leadframes
07/03/2003US20030124766 Method for manufacturing stacked chip package
07/03/2003US20030124762 Optical device and method of manufacturing the same, optical module, circuit board, and electronic instrument
07/03/2003US20030123240 Circuit package and method for making the same
07/03/2003US20030123239 Lower profile package with power supply in package
07/03/2003US20030122812 Power module and display device
07/03/2003US20030122638 Stacked radio-frequency module
07/03/2003US20030122261 Power semiconductor submodule, and a power semiconductor module
07/03/2003US20030122250 Thin high-frequency module having integrated circuit chip with little breakage
07/03/2003US20030122248 Semiconductor device having a primary chip with bumps in joined registration with bumps of a plurality of secondary chips
07/03/2003US20030122240 Multiple chips bonded to packaging structure with low noise and multiple selectable functions
07/03/2003US20030122239 Stack semiconductor chip package and lead frame
07/03/2003US20030122237 Semiconductor device
07/03/2003US20030122216 Memory device packaging including stacked passive devices and method for making the same
07/03/2003US20030122153 High frequency semiconductor device
07/03/2003US20030122139 Light emitting diode package structure having an electro-static protective diode
07/03/2003US20030121540 Positioning between insulation substrate; recesses in electroconductive pattern
07/03/2003US20030121145 Microelectronic device fabricating methods, and methods of forming a pair of field effect transistor gate lines of different base widths from a common deposited conductive layer
07/03/2003CA2470855A1 Profiled photovoltaic roofing panel
07/02/2003EP1324396A1 Receiving optics and photosemiconductor device having the same
07/02/2003EP1324391A1 Module housing and power semiconductor module
07/02/2003EP1324390A2 A high-frequency module
07/02/2003EP1324386A1 Semiconductor module and method of manufacturing a semiconductor module
07/02/2003EP1324303A2 Power module and display device
07/02/2003EP1323336A2 Enhanced trim resolution voltage-controlled dimming led driver
07/02/2003EP1151472B1 Method for vertically integrating active circuit planes
07/02/2003CN2559100Y Ceramic substrate of assembly module
07/02/2003CN1428006A Electronic module having 3-D array of carrier-mounted IC packages
07/01/2003US6587393 Semiconductor device including multi-chip
07/01/2003US6586882 Lighting system
07/01/2003US6586874 Image display device and light emission device
07/01/2003US6586845 Semiconductor device module and a part thereof
07/01/2003US6586836 Encapsulated die assembly; packaging
07/01/2003US6586835 Compact system module with built-in thermoelectric cooling
07/01/2003US6586834 Die-up tape ball grid array package
07/01/2003US6586826 Integrated circuit package having posts for connection to other packages and substrates
07/01/2003US6586825 Dual chip in package with a wire bonded die mounted to a substrate
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