Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
08/2003
08/06/2003CN1434504A Semiconductor device and making method, and printing mask
08/06/2003CN1434244A Diode light-focusing integrated type single head lamp
08/06/2003CN1434243A Diode light-focusing integrated type double-head illumination lamp
08/06/2003CN1434242A Energy-saving type LED lamp set
08/06/2003CN1117396C Semiconductor package body and semiconductor module using same
08/05/2003US6604231 Three-dimensional MCM, method for manufacturing the same, and storage medium storing data for the method
08/05/2003US6603198 Semiconductor structure having stacked semiconductor devices
08/05/2003US6603197 Semiconductor unit
08/05/2003US6603193 Semiconductor package
08/05/2003US6603072 Making leadframe semiconductor packages with stacked dies and interconnecting interposer
08/05/2003US6602735 Method of fabricating a semiconductor chip package with a lead frame and multiple integrated circuit chips
08/05/2003US6601982 Vehicle headlamp and a vehicle
08/05/2003CA2109522C High power ac traction inverter cooling
07/2003
07/31/2003WO2003063242A1 Space-saving packaging of electronic circuits
07/31/2003WO2003063236A1 Semiconductor device with co-packaged die
07/31/2003WO2003063232A1 Module device
07/31/2003WO2003026027A3 Solar array concentrator system and method for concentrating solar energy
07/31/2003US20030143971 Radio transmitting/receiving device
07/31/2003US20030143781 Encapsulated integrated circuit package and method of manufacturing an integrated circuit package
07/31/2003US20030143297 Mold tool for an optoelectronic element
07/31/2003US20030142500 LED module and methods for producing and using the module
07/31/2003US20030142480 Power converter and method for producing the same
07/31/2003US20030141813 Double-face LED device for an electronic instrument
07/31/2003US20030141596 Wiring board, semiconductor device, and method of manufacturing wiring board
07/31/2003US20030141595 System and method for providing mechanical planarization of a sequential build up substrate for an integrated circuit package
07/31/2003US20030141588 Semiconductor device
07/31/2003US20030141587 Split-gate power module and method for suppressing oscillation therein
07/31/2003US20030141583 Stacked package
07/31/2003US20030141582 Stack type flip-chip package
07/31/2003US20030141581 Integrated circuit package stacking structure
07/31/2003US20030141105 Circuit component built-in module, radio device having the same, and method for producing the same
07/31/2003US20030141042 High thermal capability positive heat sink for rectifier assembly
07/31/2003US20030140958 Solar photoelectric module
07/31/2003DE19549647C2 High-density packaging multi-chip semiconductor module
07/30/2003CN2563420Y Multicolor power saving bulb
07/30/2003CN1433252A Semiconductor equipment and its making process
07/30/2003CN1433129A Matrix converter for converting electric energy
07/30/2003CN1116613C Method and apparatus for probing, testing, burning, repairing and programming of integrated circuits in closed environment using single apparatus
07/29/2003US6600335 Method for ball grid array chip packages having improved testing and stacking characteristics
07/29/2003US6600227 System and method for providing mechanical planarization of a sequential build up substrate for an integrated circuit package
07/29/2003US6600221 Semiconductor device with stacked semiconductor chips
07/29/2003US6600220 Power distribution in multi-chip modules
07/29/2003US6599778 Chip and wafer integration process using vertical connections
07/29/2003US6599774 Technique for underfilling stacked chips on a cavity MLC module
07/29/2003US6599769 Process for mounting device and optical transmission apparatus
07/24/2003WO2003061027A1 Multi substrate organic light emitting devices
07/24/2003WO2003061006A2 Stacked die in die bga package
07/24/2003WO2003061005A2 Lower profile package for an integrated circuit with power supply in package
07/24/2003WO2003059570A1 Solar cell stringing machine
07/24/2003WO2003015167A3 Semiconductor module
07/24/2003WO2002051217A3 Packaged integrated circuits and methods of producing thereof
07/24/2003US20030138993 Method and apparatus for manufacturing semiconductor device
07/24/2003US20030138992 Multilayered circuit substrate, semiconductor device and method of producing same
07/24/2003US20030138989 Opto-electric mounting apparatus
07/24/2003US20030137812 Surface mount typed electronic circuit of small size capable of obtaining a high-Q
07/24/2003US20030137808 Electronic module having canopy-type carriers
07/24/2003US20030137059 High density 3-D integrated circuit package
07/24/2003US20030137048 Stacking system and method
07/24/2003US20030137046 Semiconductor device, method of fabricating the same, and printing mask
07/24/2003US20030137045 Circuit component built-in module and method of manufacturing the same
07/24/2003US20030137042 Stacked mass storage flash memory package
07/24/2003US20030137041 Vertically stacked memory chips in FBGA packages
07/24/2003US20030137040 Semiconductor device with co-packaged die
07/24/2003US20030135996 Electronic device and a method of manufacturing the same
07/23/2003EP1329954A1 Matrixconverter for transforming electrical energy
07/23/2003EP1329143A2 Carrier-based electronic module
07/23/2003EP1328976A1 Led module
07/23/2003CN2562040Y LED lamps
07/23/2003CN2562039Y Composite illuminating device structure
07/23/2003CN1431709A 电子器件 Electronic devices
07/22/2003US6597585 Power semiconductor module
07/22/2003US6597582 Semiconductor device incorporating module structure
07/22/2003US6597018 Electrical and electronic apparatus comprising substrate supports, electrodes, printed circuit patterns and radiation transparent casings for light emitting diodes, used as illumination in portable telephones
07/22/2003US6596640 Method of forming a raised contact for a substrate
07/22/2003US6596634 Wiring board and fabricating method thereof, semiconductor device and fabricating method thereof, circuit board and electronic instrument
07/17/2003WO2003058728A1 Electroluminescent device
07/17/2003WO2003058719A1 Monolithic interconnection interface for the stacking of electronic components and the production method thereof
07/17/2003WO2003058718A1 Memory device packaging including stacked passive devices and method for making the same
07/17/2003WO2003058104A1 Circuit package and method for making the same
07/17/2003US20030134451 Structure and process for packaging back-to-back chips
07/17/2003US20030134450 Elimination of RDL using tape base flip chip on flex for die stacking
07/17/2003US20030132527 Method and system to manufacture stacked chip devices
07/17/2003US20030132519 Array structure of solder balls able to control collapse
07/17/2003US20030132516 Semiconductor device and manufacturing method thereof
07/17/2003US20030132495 Method of providing an optoelectronic element with a non-protruding lens
07/17/2003US20030132446 Multi substrate organic light emitting devices
07/16/2003EP1327265A2 Electronic module having canopy-type carriers
07/16/2003EP1327226A1 Module having a lead frame equipped with components on both sides
07/16/2003CN2560827Y Microcomputer programme-controlled LED colour lamp
07/16/2003CN1430278A Double-side connection type semiconductor device
07/16/2003CN1430277A Semiconductor device and its manufacturing method, circuit base plate and electronic machine
07/16/2003CN1430276A Thin high-frequency module of less damaged IC chip
07/16/2003CN1430251A Manufacturing method of stack chip package
07/16/2003CN1430197A Power module and display device
07/15/2003US6594167 Semiconductor integrated circuit having a structure for equalizing interconnection lengths and memory module provided with the semiconductor integrated circuit
07/15/2003US6594149 Liquid cooled circuit device
07/15/2003US6593978 Method for manufacturing active matrix liquid crystal displays
07/15/2003US6593663 Electronic device including stacked microchips
07/15/2003US6593662 Stacked-die package structure
07/15/2003US6593651 Terminals for multi-layer devices
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