Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
08/2003
08/21/2003US20030157741 Display apparatus and its manufacturing method
08/21/2003US20030156442 Semiconductor memory device and multi-chip module comprising the semiconductor memory device
08/21/2003US20030156441 Electronic circuit package
08/21/2003US20030156432 Matrix converter for transforming electrical energy
08/21/2003US20030156425 Light emitting assembly
08/21/2003US20030155660 Semiconductor device and method of manufacturing the same, circuit board, and electronic equipment
08/21/2003US20030155659 Memory module having interconnected and stacked integrated circuits
08/21/2003US20030155649 Double-packaged multi-chip semiconductor module
08/21/2003US20030155645 Semiconductor device and manufacturing the same
08/21/2003US20030155644 Semiconductor device with semiconductor chip formed by using wide gap semiconductor as base material
08/21/2003US20030155639 Multilayer; transparent substrate, light receiver chips, hermetic sealing with polymer, die bonding chips
08/21/2003US20030155635 Semiconductor device, method for designing the same and recording medium that can be read by computer in which program for designing semiconductor device is recorded
08/21/2003US20030155405 Semiconductor device and method of manufacturing the same, circuit board, and electronic equipment
08/21/2003DE20305899U1 Illumination body for motor vehicles has a pentagonal contour and incorporates light emitting diodes supplied from a 12 volt power source
08/21/2003CA2474070A1 High density 3-d integrated circuit package
08/20/2003EP1336990A1 Casing for high-voltage resistant power semconductor module
08/20/2003EP1336207A1 Electro-optical device
08/20/2003CN1437839A A printed circuit board assembly with improved bypass decoupling for BGA packages
08/20/2003CN1437233A Packaged semiconductor device and its forming method
08/19/2003US6608763 Stacking system and method
08/19/2003US6608725 Optical module
08/19/2003US6608371 Simple electrical connection of miniature, stacked chips
08/19/2003US6607938 Wafer level stack chip package and method for manufacturing same
08/19/2003US6607937 Stacked microelectronic dies and methods for stacking microelectronic dies
08/14/2003WO2003067940A2 Circuit carrier and production thereof
08/14/2003WO2003067669A2 Solar power devices for providing power to handheld devices
08/14/2003WO2003067656A1 Semiconductor chip mounting board, its manufacturing method, and semiconductor module
08/14/2003WO2003067648A2 Semiconductor device and method of manufacturing the same
08/14/2003WO2003067646A2 Semiconductor substrate comprising an electrically isolated region, in particular for vertical integration
08/14/2003WO2003026009A3 Power electronics component
08/14/2003WO2003019652A3 Method for fixing an electrical element and a module with an electrical element fixed thus
08/14/2003WO2002033751A3 Microelectronic substrate with integrated devices
08/14/2003WO2002027874A3 High speed optical subassembly with ceramic carrier
08/14/2003US20030153128 Semiconductor device and manufacturing the same
08/14/2003US20030153127 Method of manufacturing a semiconductor device
08/14/2003US20030153124 Semiconductor device and method for manufacturing the same, circuit substrate and electronic apparatus
08/14/2003US20030153123 Semiconductor package and method for fabricating the same
08/14/2003US20030153122 Methods and apparatus for a stacked-die interposer
08/14/2003US20030151477 High-frequency module and its manufacturing method
08/14/2003US20030151421 Method and apparatus for probing, testing, burn-in, repairing and programming of integrated circuits in a closed environment using a single apparatus
08/14/2003US20030151343 Method of producing a lamp
08/14/2003US20030151135 Circuit device and manufacturing method of circuit device
08/14/2003US20030151134 Semiconductor device
08/14/2003US20030151128 Semiconductor device
08/14/2003US20030151127 Semiconductor device
08/14/2003US20030151124 Integrated circuit device
08/14/2003US20030151114 Semiconductor package for multiple high power transistors
08/14/2003US20030151100 Semiconductor integrated circuit device
08/14/2003US20030151055 Semiconductor device and electro-optical device including the same
08/14/2003CA2475100A1 Solar power devices for providing power to handheld devices
08/13/2003EP1335426A2 Packaged semiconductor device and method of formation
08/13/2003EP0929935A4 Coplanar waveguide amplifier
08/13/2003CN2566105Y Integrated diode lighting spot
08/13/2003CN1436374A Light source device using LED, and method of producing same
08/13/2003CN1435939A Rectifier of AC generator for vehicle
08/13/2003CN1118224C Heat spreader system for cooling heat-generating components
08/13/2003CN1118099C Method for mounting intermediate connecting element to terminal of electronic module
08/12/2003US6605875 Integrated circuit die having bond pads near adjacent sides to allow stacking of dice without regard to dice size
08/12/2003US6605870 Pressure-contact type semiconductor device
08/12/2003US6605869 Semiconductor device with improved cooling efficiency and reduced electric resistance
08/12/2003US6605866 Protruding leads allow for electrical connection of a second semiconductor package placed on top of the first semiconductor; protruding parts of leads form space between the stacked packages for improved heat dissipation
08/12/2003US6605779 Electronic control unit
08/12/2003US6605489 Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice
08/07/2003WO2003065778A1 Method for embedding a component in a base and forming a contact
08/07/2003WO2003065630A2 Apparatus and method for preventing digital media piracy
08/07/2003WO2003065472A2 Structures and materials for dye sensitized solar cells
08/07/2003WO2003065469A2 Power module
08/07/2003WO2003065454A2 Split-gate power module and method for suppressing oscillation therein
08/07/2003WO2003065453A1 Receptacle for a programmable, electronic processing device
08/07/2003WO2003065450A2 Integrated circuits with backside contacts and methods for their fabrication
08/07/2003WO2003065449A2 Power semiconductor, and method for producing the same
08/07/2003WO2003065440A1 Method to arrange silicon structures on top of each other and arrangement herefor
08/07/2003WO2003064317A2 Terminals for multi-layer devices
08/07/2003WO2002047162A3 Microelectronic package having an integrated heat sink and build-up layers
08/07/2003WO2002029890A3 Semiconductor stacked die devices and methods of forming semiconductor stacked die devices
08/07/2003WO2002027363A3 Method of bonding wafers with controlled height and associated structures
08/07/2003WO2002013342A3 Silicon wafer with embedded optoelectronic material for monolithic oeic
08/07/2003US20030148597 Stacked die in die BGA package
08/07/2003US20030148596 Wafer bonding for three-dimensional (3D) integration
08/07/2003US20030148590 Barrier structure against corrosion and contamination in three-dimensional (3-D) wafer-to-wafer vertical stack
08/07/2003US20030148557 BOC BGA package for die with I-shaped bond pad layout
08/07/2003US20030148554 Packaged semiconductor device and method of formation
08/07/2003US20030148553 Methods for dicing wafer stacks to provide access to interior structures
08/07/2003US20030148552 Semiconductor structures with cavities, and methods of fabrication
08/07/2003US20030148070 Carrier plate for micro-hybrid circuits
08/07/2003US20030147580 Packaging optically coupled integrated circuits using flip-chip methods
08/07/2003US20030147212 Rectifying apparatus for a.c. dynamo for vehicle
08/07/2003US20030146519 Flip-chip ball grid array semiconductor package with heat-dissipating device and method for fabricating the same
08/07/2003US20030146518 Semiconductor device of chip-on-chip structure, assembling process therefor, and semiconductor chip to be bonded to solid surface
08/07/2003US20030146517 Wires on electroconductive substrate; supplying voltage
08/07/2003US20030146501 Power converter
08/07/2003US20030146384 Surface-mount package for an optical sensing device and method of manufacture
08/07/2003US20030146268 Packaging for multi-processor shared-memory system
08/07/2003US20030146012 Semiconductor chip, chip stack package and manufacturing method
08/07/2003CA2474491A1 Structures and materials for dye sensitized solar cells
08/06/2003EP1333502A2 Surface-mount package for an optical sensing device and method of manufacture
08/06/2003EP1333485A2 Methods for dicing wafer stacks to provide access to interior structures
08/06/2003EP1332487A2 Display tile structure using organic light emitting materials
08/06/2003CN2564852Y Crystal lighting electronic illuminator
08/06/2003CN1434512A Semiconductor device and photoelectric device including same
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