Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
09/2003
09/09/2003US6617667 Optical device carrier
09/09/2003US6617615 Semiconductor light-emitting device
09/09/2003US6617613 Array of light emitting devices with extended lifetime and high luminescence
09/09/2003US6617198 Semiconductor assembly without adhesive fillets
09/09/2003US6617196 Semiconductor device
09/09/2003US6615485 Probe card assembly and kit, and methods of making same
09/04/2003WO2003073506A2 A modular integrated circuit chip carrier
09/04/2003WO2003073505A1 Integrated circuit device and method of manufacturing thereof
09/04/2003WO2003073053A1 Dual wavelength detector
09/04/2003WO2003073040A2 Measurement method for determining a surface profile
09/04/2003WO2002058152A3 Electronic circuit device and method for manufacturing the same
09/04/2003WO2002049104A3 Power module having improved transient thermal impedance
09/04/2003US20030166356 Method and apparatus for forming modular sockets using flexible interconnects and resulting structures
09/04/2003US20030166313 Semiconductor element mounting method
09/04/2003US20030165303 Ceramic optical sub-assembly for opto-electronic module utilizing LTCC ( low-temperature co-fired ceramic ) technology
09/04/2003US20030165052 Semiconductor device and manufacturing the same
09/04/2003US20030165051 Modular integrated circuit chip carrier
09/04/2003US20030164662 Piezoelectric ignition mechanism
09/04/2003US20030164550 Apparatus for package reduction in stacked chip and board assemblies
09/04/2003US20030164544 Semiconductor module including a plurality of semiconductor devices detachably
09/04/2003US20030164543 Interposer configured to reduce the profiles of semiconductor device assemblies and packages including the same and methods
09/04/2003US20030164542 Decreased thickness; electric characteristics
09/04/2003US20030164540 Semiconductor die packages with recessed interconnecting structures and methods for assembling the same
09/04/2003US20030164539 Method for stacking semiconductor package units and stacked package
09/04/2003US20030164538 Semiconductor device
09/04/2003US20030164497 Flexible organic electronic device with improved resistance to oxygen and moisture degradation
09/04/2003US20030164247 Stacking multiple devices using direct soldering
09/04/2003CA2477263A1 Determining a surface profile of an object
09/03/2003EP1341232A2 Semiconductor device and method for fabricating the same
09/03/2003EP1341231A2 System and method for providing mechanical planarization of a sequential build up substrate for an integrated circuit package
09/03/2003EP1088470A4 Ic stack utilizing flexible circuits with bga contacts
09/03/2003CN1440077A Semiconductor device, design method and recording medium with same device design program
09/03/2003CN1440074A Semiconductor device and manufacture thereof, circuit board and electronic device
09/03/2003CN1440064A Semiconductor device and manufacture thereof, circuit board and electronic machine
09/03/2003CN1440063A Semiconductor device and manufacture thereof, circuit board and electronic machine
09/02/2003US6614267 Electronic circuit device and hybrid integrated circuit with an ASIC and an FPGA
09/02/2003US6614121 Vertical cache configuration
09/02/2003US6614104 Stackable semiconductor package having conductive layer and insulating layers
09/02/2003US6614057 Sealed organic optoelectronic structures
09/02/2003US6613979 Electrical circuit suspension system
09/02/2003US6613978 Radiation shielding of three dimensional multi-chip modules
09/02/2003US6613610 Image display unit and method of producing image display unit
09/02/2003US6613606 Structure of high performance combo chip and processing method
09/02/2003US6613597 Optical chip packaging via through hole
09/02/2003US6612890 Method and system for manufacturing electronic packaging units
09/02/2003US6612872 Apparatus for forming modular sockets using flexible interconnects and resulting structures
08/2003
08/28/2003WO2003071604A1 Semiconductor bonding method and multilayer semiconductor produced by the method
08/28/2003WO2003071603A1 Module part
08/28/2003WO2003071601A2 Circuit module and method for the production thereof
08/28/2003WO2003071596A2 Electronic component with an adhesive layer and method for the production thereof
08/28/2003WO2003005782A3 Stackable microcircuit and method of making the same
08/28/2003WO2002091441A3 Semiconductor device and method of making same
08/28/2003US20030162463 Element transfer method, element arrangmenet method using the same, and image display
08/28/2003US20030162326 Semiconductor device and manufactuiring method thereof
08/28/2003US20030162325 Stacked die in die BGA package
08/28/2003US20030162320 Semiconductor device and method for fabricating the same
08/28/2003US20030161154 Free mapping colored illuminator and a luminaire of said illuminator
08/28/2003US20030161106 Heat sink with integrated electronics
08/28/2003US20030160321 Die to die connection method and assemblies and packages including dice so connected
08/28/2003US20030160317 Forming channel in electroconductive foil; overcoating with dielectric
08/28/2003US20030160316 Open-type multichips stack packaging
08/28/2003US20030160312 Stacked die semiconductor device
08/28/2003US20030160311 Stacked die semiconductor device
08/28/2003US20030160258 Electronic part and method of producing the same
08/28/2003US20030160231 Dual wavelength detector
08/28/2003US20030159852 Multilayer wiring board, manufacturing method therefor and test apparatus thereof
08/28/2003DE20309446U1 Flip-chip structure for light emitting diode (LED) with silicon substrate, has conductors defined as plus and minus poles by chip
08/28/2003DE20308235U1 Releasable connector for vertical stack of microtechnical components in mm range
08/27/2003EP1337968A2 Rectifying and charge storing element
08/27/2003EP1230711B1 Arrangement for electrically connecting chips in a circuit that is embodied in a three-dimensional manner
08/27/2003EP1192659B1 Multichip module and method for producing a multichip module
08/27/2003EP1192590B1 Method for producing a contactless card
08/27/2003CN2569346Y Integrated module plate for mebedded with IC chip and passive element
08/27/2003CN2568944Y LED high efficiency energy saving lamp set using solar cell
08/27/2003CN1438703A 半导体集成电路器件 The semiconductor integrated circuit device
08/27/2003CN1438687A Semiconductor device and its making method
08/27/2003CN1438684A Semiconductor chip package method and its package structure
08/26/2003US6611635 Opto-electronic substrates with electrical and optical interconnections and methods for making
08/26/2003US6611434 Stacked multi-chip package structure with on-chip integration of passive component
08/26/2003US6611057 Semiconductor device attaining both high speed processing and sufficient cooling capacity
08/26/2003US6611056 Composite material, and manufacturing method and uses of same
08/26/2003US6611055 Leadless flip chip carrier design and structure
08/26/2003US6611052 Wafer level stackable semiconductor package
08/26/2003US6611051 Semiconductor device and communication terminal using thereof
08/26/2003US6611050 Chip edge interconnect apparatus and method
08/26/2003US6611012 Semiconductor device
08/26/2003US6611000 Lighting device
08/26/2003US6610934 Semiconductor module and method of making the device
08/26/2003US6610923 Multi-chip module utilizing leadframe
08/26/2003US6610166 Method for replicating optical elements, particularly on a wafer level, and replicas formed thereby
08/21/2003WO2003069969A2 High density 3-d integrated circuit package
08/21/2003WO2003069968A2 Housing for a power semiconductor module which is resistant to high voltages
08/21/2003WO2003069288A1 Optical sensor
08/21/2003WO2003046988A3 Electronic assembly
08/21/2003WO2003026008A3 Power electronics component
08/21/2003WO2002099845A3 Electronic chip and electronic chip assembly
08/21/2003US20030157796 Etch stop layer for silicon (si) via etch in three-dimensional (3-d) wafer-to-wafer vertical stack
08/21/2003US20030157782 Dielectric recess for wafer-to-wafer and die-to-die metal bonding and method of fabricating the same
08/21/2003US20030157761 Method for forming bumps, semiconductor device, and solder paste
08/21/2003US20030157748 Process of vertically stacking multiple wafers supporting different active integrated circuit (IC) devices
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