Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
07/2014
07/02/2014CN102217065B 光电子半导体器件 Optoelectronic semiconductor device
07/01/2014US8768284 Radio frequency integrated circuit with noise immunity border
07/01/2014US8766662 Integrity checking of configuration data of programmable device
07/01/2014US8766458 Surface depressions for die-to-die interconnects and associated systems and methods
07/01/2014US8766287 Light emitting device, light emitting device package, and lighting device with the same
07/01/2014US8766085 Photoelectric conversion device and method of manufacturing the same
07/01/2014US8763241 Method of manufacturing printed wiring board
06/2014
06/26/2014WO2014099772A1 Electrostatic discharge protection for electrical components, devices including such protection and methods for making the same
06/26/2014WO2014098768A1 Opto-electronic modules with masking feature for reducing the visibility of interior components
06/26/2014WO2014097916A1 Semiconductor device
06/26/2014WO2014097798A1 Semiconductor device
06/26/2014WO2014097725A1 Laminate electronic device and method of manufacturing same
06/26/2014WO2014097642A1 Electronic component package and method for manufacturing same
06/26/2014WO2014095895A1 Optoelectronic component and method for the production thereof
06/26/2014WO2014095556A1 Method for producing optoelectronic semiconductor chips, and optoelectronic semiconductor chip
06/26/2014WO2014095463A1 Led module with led chip groups
06/26/2014WO2014094629A1 Semiconductor package and method for fabricating base for semiconductor package
06/26/2014US20140179060 In situ-built pin-grid arrays for coreless substrates, and methods of making same
06/26/2014US20140179036 Method and system for heterogeneous substrate bonding for photonic integration
06/26/2014US20140176116 Quantifying silicon degradation in an integrated circuit
06/26/2014US20140175675 Devices and methods for stacking individually tested devices to form multi-chip electronic modules
06/26/2014US20140175674 Package on Package Device
06/26/2014US20140175673 Semiconductor package
06/26/2014US20140175670 Stacked die package
06/26/2014US20140175667 Semiconductor integrated circuit and semiconductor system with the same
06/26/2014US20140175595 Semiconductor device and method for manufacturing the same
06/26/2014US20140175454 Devices and systems for power conversion circuits
06/26/2014US20140175266 Circuit board assembly employed in optical connector
06/26/2014DE102013114723A1 Mit lumineszierendem Material bedeckte violette LEDs With luminescent material covered violet LEDs
06/26/2014DE102013104522B3 Power semiconductor module for arrangement with capacitor, has contact devices at longitudinal side of adjacent sub-units arranged mirror-symmetrically to one another
06/26/2014DE102013018140A1 Chip mit Gehäuse unter Verwendung eines Zwischenelementesubstrats mit durch Silizium hindurchgehende Durchführungen Chip with casing using a substrate with intermediate elements passing through silicon feedthroughs
06/26/2014DE102012224224A1 Infrarotsensor mit einer Mikrostruktur mit mehreren Thermoelementen und einem Trägerelement Infrared sensor having a microstructure with a plurality of thermal elements and a support element
06/26/2014DE102012112738A1 Elektronikmodul mit einer mit Kunststoff umhüllten elektronische Schaltung und Verfahren zu dessen Herstellung Electronic module having an electronic circuit wrapped with plastic and process for its preparation
06/26/2014DE102011085645B4 Leuchtdiodenmodul und Verfahren zum Betreiben eines Leuchtdiodenmoduls Light emitting diode module and method of operating a light-emitting diode module
06/26/2014DE102006002452B4 Halbleitervorrichtung und Verfahren zu ihrer Herstellung Semiconductor device and process for their preparation
06/26/2014DE102005025452B4 Verfahren zur Herstellung einer Halbleitervorrichtung mit einer Durchgangselektrode A method of manufacturing a semiconductor device having a through electrode
06/25/2014EP2747157A2 Light-emitting module and lighting source including the same
06/25/2014EP2747137A1 Semiconductor module
06/25/2014EP2747136A1 High density organic bridge device and method
06/25/2014EP2747135A1 Cascode circuit integration of group iii-n and group devices
06/25/2014EP2745320A1 Led mixing chamber with reflective walls formed in slots
06/25/2014EP2745289A1 Topology of distributing and connecting leds in a large area matrix
06/25/2014CN203674254U 一种led封装结构 One kind of led package structure
06/25/2014CN203674210U 白光发光器件 White light emitting device
06/25/2014CN203674209U 集成驱动led光源 Integrated drive led light
06/25/2014CN203674208U 发光组件及具有发光组件的背光装置 Light emitting module and the backlight device having a light emitting component
06/25/2014CN203674207U 晶闸管焊压接组件 Thyristor welding crimp assembly
06/25/2014CN203674204U 带焊球面阵列四边无引脚ic芯片堆叠封装件 Four sides with an array of non-leaded solder ball surface ic chip stack package
06/25/2014CN203674203U 一种带焊球面阵列四边无引脚封装体堆叠封装件 A tape edges leadless solder area array package stacked package
06/25/2014CN103890942A 堆叠式封装体结构 Stacked package structure
06/25/2014CN103890941A 功率半导体模块和具有多个功率半导体模块的功率半导体模块组件 The power semiconductor module and a power semiconductor module having a plurality of components of the power semiconductor module
06/25/2014CN103890934A 半导体装置以及半导体装置制造方法 Semiconductor device and manufacturing method of a semiconductor device
06/25/2014CN103887416A 发光二极管的制造方法 The method of manufacturing a light emitting diode
06/25/2014CN103887402A 发光二极管封装结构、其围墙结构及围墙结构的制造方法 A light emitting diode package structure, the wall structure and a method of manufacturing the structure of the wall
06/25/2014CN103887388A 一种透明柔性led显示芯片 A transparent flexible led display chip
06/25/2014CN103887300A 具有高可靠性导热绝缘基板的功率igbt模块 High reliability with power igbt module thermal insulating substrate
06/25/2014CN103887299A 一种高压led光源 A high pressure led light
06/25/2014CN103887298A 一种提高led集成光源光通量输出的结构 Method for improving light flux output led integrated structure
06/25/2014CN103887297A 一种具有均匀电流密度的led发光器件 Led light emitting device having a uniform current density
06/25/2014CN103887296A 发光装置及其制造方法 A light emitting device and manufacturing method
06/25/2014CN103887295A 发光芯片组合及其制造方法 Combination and method of manufacturing the light emitting chip
06/25/2014CN103887294A 一种led发光装置及其制造方法 A light-emitting device and manufacturing method led
06/25/2014CN103887293A 一种新型led芯片 A novel led chip
06/25/2014CN103887292A 堆叠式双芯片封装结构及其制备方法 Stacked dual-chip package structure and preparation method
06/25/2014CN103887291A 三维扇出型PoP封装结构及制造工艺 Three fan-out PoP package structure and manufacturing process
06/25/2014CN103887290A 具有接合中介层的集成电路器件 Joining the interposer having an integrated circuit device
06/25/2014CN103887289A 高密度互连器件及方法 High density interconnect devices and methods
06/25/2014CN103887288A 半导体集成电路和具有半导体集成电路的半导体系统 The semiconductor integrated circuit and a semiconductor integrated circuit system having a semiconductor
06/25/2014CN103887277A 封装结构及其组装方法 Package structure and method of assembly
06/25/2014CN103887274A 半导体封装件 The semiconductor package
06/25/2014CN103887269A 高频装置 High-frequency devices
06/25/2014CN103887265A 具有印刷电路层的集成电路封装及其制作方法 IC package and method of making a printed circuit layers
06/25/2014CN103887264A 预空间变换器、空间变换器、以及半导体装置检查设备 Pre space transformer, the space transformer, and a semiconductor device inspecting apparatus
06/25/2014CN103887258A 使用具有硅通孔的中介层衬底的芯片封装 Use an intermediary layer substrate having TSV chip packaging
06/25/2014CN103887226A 晶圆堆叠结构及其制作方法与晶圆的制作方法 Wafer stack structure and method of making and wafer fabrication method
06/25/2014CN102791062B 用于发光二极管(led)串的电流匹配的系统和方法 System and method for light emitting diode (led) the current matching string
06/25/2014CN102569272B 一种基板的多层隔片式ic芯片堆叠封装件及其生产方法 A multilayer board spacer type ic chip stack package and its production method
06/25/2014CN102543988B 金属支撑垂直结构无荧光粉白光led的制备方法 Vertical metal support structure without phosphor white led preparation
06/25/2014CN102163594B 树脂密封型电子控制装置及其制造方法 Apparatus and method for manufacturing a resin sealed type electronic control
06/25/2014CN102163581B 半导体模块 Semiconductor Modules
06/24/2014US8760901 Semiconductor device having a control chip stacked with a controlled chip
06/24/2014US8759953 Electronic component including a shielding metal film disposed on a resin layer
06/24/2014US8759848 Light-emitting device
06/24/2014US8759847 White LED assembly with LED string and intermediate node substrate terminals
06/24/2014US8759125 Light-emitting dies incorporating wavelength-conversion materials and related methods
06/19/2014WO2014093317A1 High performance package on package
06/19/2014WO2014092089A1 Power semiconductor device, rectifier device, and power source device
06/19/2014WO2014091836A1 Semiconductor device, imaging device and semiconductor device manufacturing method
06/19/2014WO2014091608A1 Power semiconductor module and power conversion apparatus using same
06/19/2014WO2014090893A1 Optoelectronic semiconductor component and method for producing an optoelectronic semiconductor component
06/19/2014WO2014090686A1 Power semiconductor module and contacting arrangement
06/19/2014WO2014090685A1 Power semiconductor module and contact-making arrangement
06/19/2014WO2014090605A1 Display device and method for producing a display device
06/19/2014WO2014090157A1 Encapsulation structure and encapsulation method for light-emitting diode
06/19/2014WO2014066153A4 Multiple die stacking for two or more die
06/19/2014WO2014056762A3 Method for producing an optoelectronic semiconductor component and optoelectronic semiconductor component
06/19/2014US20140170814 Ball grid array semiconductor device and its manufacture
06/19/2014US20140167817 Semiconductor device
06/19/2014US20140167292 Semiconductor integrated circuit device
06/19/2014US20140167291 Semiconductor package having supporting plate and method of forming the same
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