Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
09/2003
09/25/2003US20030178228 Method for scalable architectures in stackable three-dimentsional integrated circuits and electronics
09/24/2003EP1347558A2 Rectifier for an alternator with rectifier element covered by its terminal
09/24/2003EP1347513A2 Low voltage drop and high thermal performance ball grid array package
09/24/2003EP1347474A1 Semiconductor device, and method and apparatus for manufacturing semiconductor device
09/24/2003EP1346617A2 Multilayered hybrid electronic module
09/24/2003EP1171912B1 Method for the vertical integration of electric components by reverse side contacting
09/24/2003CN2575852Y Insulation wire clamping column
09/24/2003CN1444277A Semiconductor assembly
09/23/2003US6625037 Printed circuit board and method manufacturing the same
09/23/2003US6625031 Module part and electronic device
09/23/2003US6625027 Power electronics heat sink structure comprising common thermally conductive layer, plurality of isolated layers each mounted over different region of surface of common layer and comprising both thermally conductive and dielectric materials
09/23/2003US6625024 Power converter enclosure
09/23/2003US6624648 Probe card assembly
09/23/2003US6624511 Hybrid integrated circuit device
09/23/2003US6624506 Multichip semiconductor device and memory card
09/23/2003US6624505 Packaged integrated circuits and methods of producing thereof
09/23/2003US6624448 Semiconductor device with multiple supporting points
09/23/2003US6624046 Three dimensional processor using transferred thin film circuits
09/23/2003US6624005 Semiconductor memory cards and method of making same
09/23/2003CA2276376C Power module board and power module using the board
09/23/2003CA2273125C Microwave integrated circuit multi-chip-module and microwave integrated circuit multi-chip-module mounting structure
09/23/2003CA2057744C Multichip module
09/18/2003WO2003007389A3 Led-module for illuminating devices
09/18/2003WO2002061814A3 Method of manufacturing optical devices and related improvements
09/18/2003US20030176018 Assemblies including stacked semiconductor devices separated a distance defined by adhesive material interposed therebetween, packages including the assemblies, and methods
09/18/2003US20030176017 Method of mounting chips
09/18/2003US20030174504 Threating device
09/18/2003US20030174481 Semiconductor module
09/18/2003US20030174031 Microwave monolithic integrated circuit assembly with multi-orientation pyrolytic graphite heat-dissipating assembly
09/18/2003US20030173680 Semiconductor device and fabrication method of the same
09/18/2003US20030173679 Stacked dice standoffs
09/18/2003US20030173678 Semiconductor device and method for fabricating the same
09/18/2003US20030173673 Inserting between each component a separating plane of a thin sheet of dielectric, one face of which is metallized to constitute capacitor planes and connected to ground to shield the adjacent component; easy decoupling
09/18/2003US20030173668 Semiconductor device having a bond pad and method therefor
09/18/2003US20030173663 Semiconductor device
09/18/2003US20030173579 Power semiconductor device
09/18/2003US20030173569 Receiving optics and photosemiconductor device having the same
09/18/2003US20030173522 Ganged detector pixel, photon/pulse counting radiation imaging device
09/18/2003US20030172967 Solar battery cell and manufacturing method thereof
09/17/2003CN1443370A 半导体装置 Semiconductor device
09/17/2003CN1443369A Housing device and contact element used therein
09/17/2003CN1443348A Passive radiation optical system module especially for use with liqht-emitting diodes
09/17/2003CN1442902A Semiconductor device and its manufacturing method
09/17/2003CN1442836A Colour mixture full coloured LED display module
09/17/2003CN1121722C Power semiconductor switch device
09/17/2003CN1121721C Multichip module
09/16/2003US6621716 LED package
09/16/2003US6621703 Automotive bridge rectifier assembly with thermal protection
09/16/2003US6621701 Water cooled inverter
09/16/2003US6621223 Package socket and package legs structure for led and manufacturing of the same
09/16/2003US6621172 Semiconductor device and method of fabricating the same, circuit board, and electronic equipment
09/16/2003US6621169 Stacked semiconductor device and method of producing the same
09/16/2003US6621162 High frequency circuit apparatus
09/16/2003US6621156 Semiconductor device having stacked multi chip module structure
09/16/2003US6621155 Integrated circuit device having stacked dies and impedance balanced transmission lines
09/16/2003US6620996 Device comprising substrate with first conductivity type crystalline semiconductor particles and insulator, and second conductivity type layer comprising mixed amorphous and crystalline semiconductor forming PN junction
09/16/2003US6620995 Non-imaging system for radiant energy flux transformation
09/16/2003US6620731 Method for fabricating semiconductor components and interconnects with contacts on opposing sides
09/16/2003US6620706 Condensed memory matrix
09/16/2003US6620651 Adhesive wafers for die attach application
09/16/2003US6620649 Method for selectively providing adhesive on a semiconductor device
09/16/2003US6620648 Multi-chip module with extension
09/16/2003US6620642 Opto-electronic device integration
09/12/2003WO2003075367A1 Light-emitting device comprising led chip and method for manufacturing this device
09/12/2003WO2003075349A1 Stacked die semiconductor device
09/12/2003WO2003075348A2 Stacked die semiconductor device
09/12/2003WO2003075347A2 Electronic module, panel with individual electronic modules and method for the production thereof
09/12/2003WO2003030225A3 Semiconductor chip with multiple rows of bond pads
09/12/2003CA2478495A1 Piezoelectric ignition mechanism
09/11/2003WO2003074939A2 Piezoelectric ignition mechanism
09/11/2003US20030171008 Method for aligning structures on a semiconductor substrate
09/11/2003US20030170922 Light irradiating device, manufacturing method thereof, and lighting apparatus using the light irradiating device
09/11/2003US20030169098 Resistance division circuit and semiconductor device
09/11/2003US20030169035 Determining a surface profile of an object
09/11/2003US20030168989 Package socket and package legs structure for led and manufacturing of the same
09/11/2003US20030168964 Nanowire light emitting device and display
09/11/2003US20030168946 Radial power megasonic transducer
09/11/2003US20030168744 Semiconductor device and method of manufacturing the same
09/11/2003US20030168739 Array structure of solder balls able to control collapse
09/11/2003US20030168727 Multi-layer board
09/11/2003US20030168726 Power semiconductor device
09/11/2003US20030168725 Methods of making microelectronic assemblies including folded substrates
09/11/2003US20030168254 Semiconductor chip mounting wiring board, manufacturing method for same, and semiconductor module
09/11/2003US20030168253 Microelectronic component and assembly having leads with offset portions
09/11/2003US20030168252 Contact device and a process to facilitate contact of power electronics components and an assembly that consists of one or several power electronics components
09/10/2003EP1343169A2 Memory Systems
09/10/2003EP1342292A1 Circuit module with universal connectivity
09/10/2003CN1441495A Semiconductor device and its producing method, curcuit board and electronic instrument
09/10/2003CN1441494A Semiconductor device and its producing method
09/10/2003CN1441493A Semiconductor element in stacked structure
09/09/2003US6618267 Multi-level electronic package and method for making same
09/09/2003US6617795 Multichip LED package with in-package quantitative and spectral sensing capability and digital signal output
09/09/2003US6617786 Electronic device encapsulated directly on a substrate
09/09/2003US6617700 Repairable multi-chip package and high-density memory card having the package
09/09/2003US6617695 Semiconductor device and semiconductor module using the same
09/09/2003US6617694 Semiconductor chip, semiconductor device, methods of fabricating thereof, circuit board and electronic device
09/09/2003US6617693 Semiconductor device and semiconductor chip for use therein
09/09/2003US6617688 Semiconductor device and flat electrodes
09/09/2003US6617679 Semiconductor package for multiple high power transistors
09/09/2003US6617678 Semiconductor device
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