Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
10/2003
10/09/2003WO2003082940A1 Film adhesives containing maleimide and related compounds and methods for use thereof
10/09/2003WO2003046989A3 Multi-chip module semiconductor devices
10/09/2003WO2003030247A3 Method for contacting electrical contact surfaces of a substrate and device consisting of a substrate having electrical contact surfaces
10/09/2003US20030190843 Apparatus for forming modular sockets using flexible interconnects and resulting structures
10/09/2003US20030190776 Module and method of making same
10/09/2003US20030189830 Light source device using led, and method of producing same
10/09/2003US20030189829 LED illumination apparatus and card-type LED illumination source
10/09/2003US20030189816 Semiconductor module
10/09/2003US20030189814 Electronic device
10/09/2003US20030189263 Semiconductor module
10/09/2003US20030189259 Semiconductor device and method for manufacturing the same
10/09/2003US20030189258 Semiconductor device
10/09/2003US20030189257 Multi-chip module and methods
10/09/2003US20030189256 Bond pad rerouting element, rerouted semiconductor devices including the rerouting element, stacked chip assemblies including the rerouted semiconductor devices, and methods
10/09/2003US20030189251 Semiconductor device
10/09/2003US20030189246 Semiconductor built -in millimeter-wave band module
10/09/2003US20030189214 Techniques for joining an opto-electronic module to a semiconductor package
10/09/2003US20030189201 Package of lightemitting diode with protective element
10/08/2003EP1351302A2 Power semiconductor module
10/08/2003EP1351301A2 Semiconductor built-in millimeter-wave band module
10/08/2003EP1351300A2 Semiconductor device and transceiver apparatus
10/08/2003EP1351285A2 Electrical device comprising two substrates bonded together and method of making same
10/08/2003EP1350290A2 Silicon wafer with embedded optoelectronic material for monolithic oeic
10/08/2003EP1350271A2 Interconnection of active and passive components in substrate
10/08/2003EP1350270A1 Stacked die package
10/08/2003CN1447984A Component comprising large number of light-emitting-diode chips
10/08/2003CN1447983A Radiation source and method for producing lens mould
10/08/2003CN1447958A Image display unit and prodn. method for image display unit
10/07/2003US6630744 Multichip module
10/07/2003US6630742 Method for forming bumps, semiconductor device, and solder paste
10/07/2003US6630734 Composite material, and manufacturing method and uses of same
10/07/2003US6630731 Semiconductor device
10/07/2003US6630727 Modularly expandable multi-layered semiconductor component
10/02/2003WO2003081967A1 Flexible interconnect structures for electrical devices and light sources incorporating the same
10/02/2003WO2003081602A1 A volumetric data storage apparatus comprising a plurality of stacked matrix-addressable memory devices
10/02/2003WO2003079754A2 Method for stacking chips within a multichip module package
10/02/2003WO2002041398A9 Microelectronic packages and packaging methods in which second microelectronic substrates are oriented relative to first microelectronic substrates at acute angles
10/02/2003US20030184985 Electronic device manufacturing method, electronic device and resin filling method
10/02/2003US20030184980 Circuit board with integrated circuit
10/02/2003US20030184966 Electronic package
10/02/2003US20030184963 Providing in package power supplies for integrated circuits
10/02/2003US20030184398 Sheet substrate for crystal oscillator and method of manufacturing surface-mount crystal oscillators using same
10/02/2003US20030183946 Semiconductor device
10/02/2003US20030183945 Chip size stack package and method of fabricating the same
10/02/2003US20030183944 Semiconductor device and manufacturing method for the same, circuit board, and electronic device
10/02/2003US20030183943 Integrated circuit die and an electronic assembly having a three-dimensional interconnection scheme
10/02/2003US20030183934 Method and apparatus for stacking multiple die in a flip chip semiconductor package
10/02/2003US20030183930 Semiconductor device and semiconductor module
10/02/2003US20030183926 Semiconductor device and semiconductor packaging device
10/02/2003US20030183925 Semiconductor module
10/02/2003US20030183924 High speed switching mosfets using multi-parallel die packages with/without special leadframes
10/02/2003US20030183921 Electronic device and method for manufacturing the same
10/02/2003US20030183917 Stacked semiconductor packaging device
10/02/2003US20030183914 Improved memory package with a controller on one side of a printed circuited board and memory on another side of the circuit board
10/02/2003US20030183912 Multi-chip package
10/02/2003US20030183907 Resin-molded device and manufacturing apparatus thereof
10/02/2003US20030183863 Semiconductor device and transceiver apparatus
10/02/2003US20030183751 Linear light source and reading light exposure apparatus
10/02/2003US20030183367 10SI alternator housing to accommodate larger improved heavy duty 17SI rectifier
10/02/2003US20030183307 Electrical device and method of making
10/02/2003DE10213881C1 Memory module has two semiconductor chips stacked on top of one another with underlying chip received in recess in surface of electronic circuit board
10/02/2003CA2480307A1 A volumetric data storage apparatus comprising a plurality of stacked matrix-addressable memory devices
10/01/2003EP1349213A2 Linear light source and light exposure apparatus
10/01/2003CN1445851A Light-thin laminated packaged semiconductor device and manufacturing process thereof
10/01/2003CN1123069C Encapsulation of phtoelectric element and manufacturing method thereof
09/2003
09/30/2003US6628538 Memory module including module data wirings available as a memory access data bus
09/30/2003US6628527 Mounting structure for electronic parts and manufacturing method thereof
09/30/2003US6628526 Electronic device manufacturing method, electronic device and resin filling method
09/30/2003US6628070 Electro-optical device with cover having a first wall indentation for accommodating control electronics
09/30/2003US6628043 Electronic component and method of production thereof
09/30/2003US6627997 Semiconductor module and method of mounting
09/30/2003US6627990 Thermally enhanced stacked die package
09/30/2003US6627985 Reconfigurable processor module comprising hybrid stacked integrated circuit die elements
09/30/2003US6627984 Chip stack with differing chip package types
09/30/2003US6627980 Stacked semiconductor device assembly with microelectronic spring contacts
09/30/2003US6627979 Semiconductor package and fabrication method of the same
09/30/2003US6627953 High density electronic circuit modules
09/30/2003US6627480 Stacked semiconductor package and fabricating method thereof
09/30/2003US6627479 Semiconductor device having a plurality of semiconductor elements interconnected by a redistribution layer
09/25/2003WO2003079439A2 Chip stack with intermediate cavity
09/25/2003WO2003079438A1 Multijunction photovoltaic device with shadow-free independent cells and the production method thereof
09/25/2003WO2003079435A2 Microwave monolithic integrated circuit assembly with multi-orientation pyrolytic graphite heat-dissipating assembly
09/25/2003WO2003079431A1 Semiconductor device and its manufacturing method, circuit board, and electric apparatus
09/25/2003WO2003079430A1 Semiconductor device and its manufacturing method, circuit board and electronic apparatus
09/25/2003WO2003078171A1 Optical write head
09/25/2003WO2002097880A3 Power semiconductor module and method for the production of a power semiconductor module
09/25/2003US20030180988 Semiconductor device and method of manufacturing the same
09/25/2003US20030180987 Stacked die package
09/25/2003US20030180013 Transistor outline package with exteriorly mounted risistors
09/25/2003US20030179549 Low voltage drop and high thermal perfor mance ball grid array package
09/25/2003US20030179548 Flexible interconnect structures for electrical devices and light sources incorporating the same
09/25/2003US20030178900 Rectifier for alternator having rectifier element covered with rectifier terminal
09/25/2003US20030178726 Semiconductor device built-in multilayer wiring board and method of manufacturing same
09/25/2003US20030178716 Light thin stacked package semiconductor device and process for fabrication thereof
09/25/2003US20030178715 Multilayer; substrates, passivation layer, adhesive
09/25/2003US20030178714 Semiconductor device having a built-in contact-type sensor and manufacturing method thereof
09/25/2003US20030178710 Semiconductor chip stack structure and method for forming the same
09/25/2003US20030178657 Transimpedance amplifier assembly with separate ground leads and separate power leads for included circuits
09/25/2003US20030178627 Led module
09/25/2003US20030178565 Thermal type infrared ray imaging device and fabrication method thereof
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