Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
10/2003
10/29/2003CN1452788A Semiconductor device and its mfg. method
10/29/2003CN1452767A LED display systems and methods with enhanced light intensity
10/29/2003CN1452245A Semiconductor device and method for mfg. same
10/29/2003CN1452240A Integrated circuit element installation structure and method
10/29/2003CN1126172C Spherical grid array package
10/29/2003CN1126159C Semiconductor wafer module and its making method
10/28/2003US6639309 Memory package with a controller on one side of a printed circuit board and memory on another side of the circuit board
10/28/2003US6639303 Integrated circuits and methods for their fabrication
10/28/2003US6639299 Semiconductor device having a chip size package including a passive element
10/28/2003US6639251 Light emitting element array module and printer head and micro-display using the same
10/28/2003US6639248 Light emitting and receiving device structure
10/28/2003US6639148 Extendible drain members for grounding RFI/EMI shielding
10/28/2003US6638789 Micromachine stacked wirebonded package fabrication method
10/28/2003US6638780 Method for manufacturing light emitting diode devices
10/23/2003WO2003041158A3 Semiconductor package device and method of formation and testing
10/23/2003US20030199638 Film adhesives containing maleimide compounds and methods for use thereof
10/23/2003US20030199118 Wire bonding method for a semiconductor package
10/23/2003US20030198068 Compact rectifier bridge and method for manufacturing the same
10/23/2003US20030198034 Multi-chip module and fabricating method thereof
10/23/2003US20030197290 Stackable semiconductor package and method for manufacturing same
10/23/2003US20030197287 Multiple chips bonded to packaging structure with low noise and multiple selectable functions
10/23/2003US20030197284 Semiconductor package
10/23/2003US20030197283 Multi-chip package and method for manufacturing the same
10/23/2003US20030197282 Low profile stack semiconductor package
10/23/2003US20030197281 Integrated circuit package having reduced interconnects
10/23/2003US20030197271 Module assembly for stacked BGA packages
10/23/2003US20030197268 Semiconductor device with stacked memory and logic substrates and method for fabricating the same
10/23/2003US20030197261 Memory card
10/23/2003US20030197260 Semiconductor device and manufacturing method thereof
10/23/2003US20030197258 Integrated circuit device packaging structure and packaging method
10/23/2003US20030197256 Power conditioning substrate stiffener
10/23/2003US20030197255 Semiconductor device
10/23/2003US20030197253 Method and apparatus for connecting vertically stacked integrated circuit chips
10/23/2003US20030197199 Semiconductor device and semiconductor module
10/23/2003US20030197127 SPECT for breast cancer detection
10/23/2003US20030196323 Methods for modifying a vertical surface mount package
10/22/2003EP1355432A1 High-frequency wave composite switch module and mobile body communication device using the same
10/22/2003EP1355353A2 Compact circuit carrier package
10/22/2003EP1355352A2 Stacked semiconductor device and method of manufacturing thereof
10/22/2003EP1355351A1 Semiconductor device
10/22/2003EP1354356A2 Semiconductor package and method
10/22/2003EP1354354A2 Microelectronic package having an integrated heat sink and build-up layers
10/22/2003EP0792517B1 Electrical contact structures from flexible wire
10/22/2003CN1451181A Method and device for transferring spin-poarized charge carriers
10/22/2003CN1451180A Planar hybrid diode rectifier bridge
10/22/2003CN1450640A Semiconductor device
10/22/2003CN1450633A Semiconductor device
10/22/2003CN1124922C Injection molding encapsulation for an electronic device directly onto a substrate
10/21/2003US6636429 EMI reduction in power modules through the use of integrated capacitors on the substrate level
10/21/2003US6636334 Semiconductor device having high-density packaging thereof
10/21/2003US6636185 Head-mounted display system
10/21/2003US6636110 Internal clock generating circuit for clock synchronous semiconductor memory device
10/21/2003US6636003 Apparatus and method for adjusting the color temperature of white semiconduct or light emitters
10/21/2003US6635987 High power white LED lamp structure using unique phosphor application for LED lighting products
10/21/2003US6635970 Power distribution design method for stacked flip-chip packages
10/21/2003US6635969 Semiconductor device having chip-on-chip structure, and semiconductor chip used therefor
10/21/2003US6635968 Semiconductor device having improved alignment of an electrode terminal on a semiconductor chip and a conductor coupled to the electrode terminal
10/21/2003US6635962 Chip on chip semiconductor device
10/21/2003US6635960 Angled edge connections for multichip structures
10/21/2003US6635902 Serial connection structure of light emitting diode chip
10/21/2003US6635817 Solar cell array having lattice or matrix structure and method of arranging solar cells and panels
10/21/2003US6634771 Semiconductor light source using a primary and secondary heat sink combination
10/21/2003US6634770 Light source using semiconductor devices mounted on a heat sink
10/21/2003US6634098 Methods for assembling, modifying and manufacturing a vertical surface mount package
10/16/2003WO2003085738A2 Power module comprising two substrates and method for producing the same
10/16/2003WO2003085737A2 Method and apparatus for stacking multiple die in a flip chip semiconductor package
10/16/2003WO2003085729A1 Method of manufacturing an electronic device
10/16/2003WO2003085726A1 Semiconductor device and its manufacturing method
10/16/2003WO2003085725A2 In package power supplies for integrated circuits
10/16/2003WO2003085703A2 Electronic component having at least one semiconductor chip and flip-chip contacts, and method for the production thereof
10/16/2003WO2002059952A3 Method of manufacturing optical devices and related improvements
10/16/2003US20030194834 Semiconductor device and method for the fabrication thereof
10/16/2003US20030193085 Semiconductor assembly with a semiconductor module
10/16/2003US20030193076 Elevated plug ends bond wafers; mating bonding pads; resistant to chemical mechanical polishing
10/16/2003US20030192583 Ultrasonic slitting of photovoltaic cells and modules
10/16/2003US20030192171 Space-saving packaging of electronic circuits
10/16/2003DE10237561C1 Power semiconductor circuit device has DC and AC terminal leads extending parallel to substrate and/or connector paths and provided with surface elements for bonding wire connections
10/15/2003EP1353374A1 Semiconductor chip assemblies, methods of making same and components for same
10/15/2003EP1352427A1 Circuit arrangement with semiconductor elements arranged in chips
10/15/2003EP0769209B1 Method of manufacturing three-dimensional circuits
10/15/2003CN1449232A Circuit component built-in module and method of manufacturing the same
10/15/2003CN1449036A Resin moulded devices and manufacturing installation therefor
10/15/2003CN1449031A Semiconductor devices
10/15/2003CN1449030A Millimeter band module with built-in semiconductor
10/15/2003CN1449003A Method for packaging memory body and device for the same
10/15/2003CN1448986A Semiconductor device and electric optical device
10/15/2003CN1448982A Method for increasing pass percentage of A/D conversion chip and product thereof
10/15/2003CN1124651C Lid air bridge line
10/15/2003CN1124426C 照明系统 Lighting system
10/14/2003US6633120 LED lamps
10/14/2003US6633086 Stacked chip scale package structure
10/14/2003US6633081 Semiconductor device on a packaging substrate
10/14/2003US6633079 Wafer level interconnection
10/14/2003US6633078 Semiconductor device, method for manufacturing an electronic equipment, electronic equipment and portable information terminal
10/14/2003US6632732 Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methods
10/14/2003US6632706 Three dimensional structure integrated circuit fabrication process
10/09/2003WO2003084297A1 Wiring structure and its manufacturing method
10/09/2003WO2003084026A1 Regulator and rectifier for an electric machine and electric machine
10/09/2003WO2003083954A2 Solar cell module-mounting structure and solar cell module array
10/09/2003WO2003083943A2 Light-emitting diode emitting homogeneous parallel light
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