Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
11/2003
11/13/2003US20030211655 Stacked die module and techniques for forming a stacked die module
11/13/2003US20030210534 Integrated circuit die and an electronic assembly having a three-dimensional interconnection scheme
11/13/2003US20030210533 Multi-chip package having improved heat spread characteristics and method for manufacturing the same
11/13/2003US20030209809 Power distribution design method for stacked flip-chip packages
11/13/2003US20030209808 Semiconductor device having semiconductor chips mounted on package substrate
11/13/2003US20030209791 Semiconductor structure having stacked semiconductor devices
11/13/2003US20030209790 Semiconductor memory module
11/13/2003US20030209740 Semiconductor device
11/13/2003US20030209732 Apparatus for routing signals
11/13/2003US20030209714 Light emitting diodes; multicolor light
11/13/2003US20030209713 Transferring, connecting pad chip to substrates; adjustment width
11/13/2003DE20313195U1 Lamp chain, e.g. for decoration, has LED chips, each with first electrode permanently attached/electrically connected to first conductor, second electrode electrically connected to second conductor
11/12/2003EP1360882A1 A stackable microcircuit layer formed from a plastic encapsulated microcircuit and method of making the same
11/12/2003EP1360713A1 Light emitting semiconductor package
11/12/2003CN1127757C Bump-bonded semiconductor imaging device
11/11/2003US6646884 Sandwich-structured intelligent power module
11/11/2003US6646521 Connection for conducting high frequency signal between a circuit and a discrete electric component
11/11/2003US6646344 Composite material, and manufacturing method and uses of same
11/11/2003US6646342 Semiconductor chip and multi-chip module
11/11/2003US6646334 Stacked semiconductor package and fabricating method thereof
11/11/2003US6646333 Semiconductor module having interconnected semiconductor chips disposed one above the other
11/11/2003US6646331 Semiconductor device and semiconductor module
11/11/2003US6646321 Power transistor with internally combined low-pass and band-pass matching stages
11/11/2003US6646289 optronic integrally packaged die.
11/11/2003US6646196 Window structure with photovoltaic panel
11/11/2003US6645832 Etch stop layer for silicon (Si) via etch in three-dimensional (3-D) wafer-to-wafer vertical stack
11/11/2003US6645829 Optoelectronic integrated circuit (OEIC); outermost epitaxial layer exposed to the chemical-mechanical processing equipment is always silicon or silicon dioxide
11/11/2003US6645794 Method of manufacturing a semiconductor device by monolithically forming a sealing resin for sealing a chip and a reinforcing frame by transfer molding
11/06/2003WO2003092042A2 Clamping assembly for high-voltage solid state devices
11/06/2003WO2003073506A3 A modular integrated circuit chip carrier
11/06/2003WO2003049185A3 Semiconductor component circuit with a reduced oscillation tendency
11/06/2003WO2003043085A3 Electronic device carrier adapted for transmitting high frequency signals
11/06/2003WO2003032370A3 Stacked packages
11/06/2003WO2003019658A3 Organic luminous diode, method for the production and uses thereof
11/06/2003WO2002089208A3 Arrangement comprising at least two different electronic semiconductor circuits
11/06/2003US20030207516 Stacked die in die BGA package
11/06/2003US20030207515 Stacked die in die BGA package
11/06/2003US20030207510 Semiconductor device, and its manufacturing method, circuit substrate, and electronic apparatus
11/06/2003US20030207495 Stacked leads-over chip multi-chip module
11/06/2003US20030207493 Electro-optical transceiver system with controlled lateral leakage and method of making it
11/06/2003US20030207492 Semiconductor device and method for fabricating the same
11/06/2003US20030207488 Flexible organic electronic device with improved resistance to oxygen and moisture degradation
11/06/2003US20030206478 Semiconductor device including multi-chip
11/06/2003US20030205837 Device comprising components vertically stacked thereon and method for manufacturing the same
11/06/2003US20030205826 Multiple chips bonded to packaging structure with low noise and multiple selectable functions
11/06/2003US20030205824 Etch stop layer for silicon (Si) via etch in three-dimensional (3-D) wafer-to-wafer vertical stack
11/06/2003US20030205808 Semiconductor device
11/06/2003US20030205400 Plastic chip-scale package having integrated passive components
11/05/2003EP1359618A2 Semiconductor device
11/05/2003EP1359612A2 Methods of manufacturing a hybrid integrated circuit device
11/05/2003EP1358673A1 Chip transfer method and apparatus
11/05/2003EP1269538B1 Method of forming a stacked-die integrated circuit chip package on a wafer level
11/05/2003CN1453869A 半导体存储器模块 Semiconductor memory module
11/05/2003CN1453868A Multi-chip package and producing method thereof
11/05/2003CN1453867A 树脂密封型半导体器件 Resin-sealed type semiconductor device
11/05/2003CN1453857A Method for producing mixed integrated circuit apparatus
11/05/2003CN1453847A Semiconductor device and producing method thereof, circuit substrate and electronic instrument
11/05/2003CN1453841A Improved memory package
11/05/2003CN1127141C Circuit interconnection adopting virtual mirror image packaging piece
11/05/2003CN1127046C Display apparatus
11/04/2003US6643142 Module having a lead frame equipped with components on both sides
11/04/2003US6643136 Multi-chip package with embedded cooling element
11/04/2003US6642782 Rectifying charge storage element
11/04/2003US6642627 Semiconductor chip having bond pads and multi-chip package
11/04/2003US6642617 Semiconductor device
11/04/2003US6642615 Semiconductor device and method of manufacturing the same, circuit board and electronic instrument
11/04/2003US6642613 Techniques for joining an opto-electronic module to a semiconductor package
11/04/2003US6642610 Wire bonding method and semiconductor package manufactured using the same
11/04/2003US6642576 Power semiconductor device having layered structure of power semiconductor elements and terminal members
11/04/2003US6642550 Silicon sub-mount capable of single wire bonding and of providing ESD protection for light emitting diode devices
11/04/2003US6642545 Semiconductor light emitting device
11/04/2003US6642081 Interlocking conductor method for bonding wafers to produce stacked integrated circuits
11/04/2003US6642064 Method of making a high density programmable logic device in a multichip module package
10/2003
10/30/2003WO2003090256A2 Method and apparatus for connecting vertically stacked integrated circuit chips
10/30/2003WO2003067648A3 Semiconductor device and method of manufacturing the same
10/30/2003WO2003047306A3 Radial power megasonic transducer
10/30/2003WO2003030255A3 Multiple die interconnect system
10/30/2003US20030203678 Method and apparatus for forming modular sockets using flexible interconnects and resulting structures
10/30/2003US20030203663 Flexible circuit connector for stacked chip module
10/30/2003US20030203542 Protected bond fingers
10/30/2003US20030203540 Stacked semiconductor package and fabricating method thereof
10/30/2003US20030203537 Method of fabricating stacked die configurations utilizing redistribution bond pads
10/30/2003US20030203531 Defect-free semiconductor templates for epitaxial growth and method of making same
10/30/2003US20030202372 Semiconductor memory module
10/30/2003US20030201546 Resin-sealed semiconductor device
10/30/2003US20030201545 Multiple chips bonded to packaging structure with low noise and multiple selectable functions
10/30/2003US20030201529 Package stacked semiconductor device having pin linking means
10/30/2003US20030201527 Semiconductor device and method of manufacturing same
10/30/2003US20030201525 Standoffs for centralizing internals in packaging process
10/30/2003US20030201524 Tape automated bonding with strip carrier frame assembly
10/30/2003US20030201523 Semiconductor device and communication terminal using thereof
10/30/2003US20030201522 Semiconductor device having improved alignment of an electrode terminal on a semiconductor chip and a conductor coupled to the electrode terminal
10/30/2003US20030201521 Semiconductor packaging device and manufacture thereof
10/30/2003US20030201513 Multi-level integrated circuit for wide-gap substrate bonding
10/30/2003US20030200654 Silicon substrate; etching aperture, channels; overcoating with dielectrics
10/29/2003EP1357597A1 Voltage conversion module
10/29/2003EP1357591A2 Method of mounting electrical components on a base plate in a radio frequency terminal unit
10/29/2003EP1356718A2 Packaged integrated circuits and methods of producing thereof
10/29/2003EP1356521A1 Power transistor with internally combined low-pass and band-pass matching stages
10/29/2003EP1356520A2 Microelectronic substrate with integrated devices
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