Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
12/2003
12/02/2003US6656767 Method of forming a stack of packaged memory dice
12/02/2003US6656765 Fabricating very thin chip size semiconductor packages
12/02/2003US6656757 Electro-optical transceiver system with controlled lateral leakage and method of making it
12/02/2003US6655638 Solar array concentrator system and method
12/02/2003US6655023 Method and apparatus for burning-in semiconductor devices in wafer form
11/2003
11/27/2003WO2003098707A1 Led array
11/27/2003WO2003098687A1 Semiconductor device and its manufacturing method
11/27/2003WO2003098666A2 High-frequency power semiconductor module with a hollow housing and method for the production thereof
11/27/2003WO2003085737A3 Method and apparatus for stacking multiple die in a flip chip semiconductor package
11/27/2003WO2003071601A3 Circuit module and method for the production thereof
11/27/2003WO2003036720A3 Led chip package
11/27/2003WO2003021679A3 Integrated circuit structure and a method of making an integrated circuit structure
11/27/2003WO2003017324A3 Structure and method for fabrication of a leadless chip carrier with embedded inductor
11/27/2003US20030219969 Semiconductor device and manufacturing method thereof
11/27/2003US20030218878 Modular mounting arrangement and method for light emitting diodes
11/27/2003US20030218868 Multi-chip module
11/27/2003US20030218723 Illumination apparatus and image projection apparatus using the illumination apparatus
11/27/2003US20030218666 Projection print engine and method for forming same
11/27/2003US20030218245 Semiconductor device and a method of manufacturing the same
11/27/2003US20030218233 Surface-mounting type of electronic circuit unit suitable for miniaturization and a method for fabricating the unit
11/27/2003US20030218216 Semiconductor memory module
11/27/2003US20030218191 Vertical electrical interconnections in a stack
11/27/2003US20030218182 Strees-controlled dielectric integrated circuit
11/27/2003US20030218174 Optical excitation/detection device using discrete photoemitter devices
11/27/2003US20030218165 Organic semiconductor device and method
11/27/2003US20030218057 Electrical bus with associated porous metal heat sink and method of manufacturing same
11/27/2003US20030217768 Photovoltaic roofing structure
11/27/2003DE10223719C1 Layer arrangement comprises first substrate having first main surface containing first thermally dissolvable delamination layer, and second substrate having second main surface containing second thermally dissolvable delamination layer
11/26/2003EP1365451A1 Module component
11/26/2003EP1364449A1 Circuit design for a circuit for switching currents
11/26/2003EP1364406A2 Circuit arrangement
11/26/2003EP1364402A2 Power module having improved transient thermal impedance
11/26/2003EP1364392A2 Method of manufacturing optical devices and related improvements
11/26/2003EP0734586B1 Method for fabricating self-assembling microstructures
11/26/2003CN2588535Y Control circuit chip structure
11/26/2003CN1458699A Structure of LED base and pins and producing method
11/26/2003CN1458688A Electronic module
11/26/2003CN1458443A Method for producing water pipe lamp using light-emitting diode
11/25/2003US6654249 Circuit arrangement
11/25/2003US6654175 Integrated LED/photodiode collimator array
11/25/2003US6653798 Voltage dimmable LED display producing multiple colors
11/25/2003US6653655 Integrated semiconductor device including high-voltage interconnections passing through low-voltage regions
11/25/2003US6653208 Wafer on wafer packaging and method of fabrication for full-wafer burn-in and testing
11/25/2003US6653166 Semiconductor device and method of making same
11/25/2003US6652808 Electric field assisted self-assembly of functionalized programmable nucleic acids, modified structures and other selective affinity or binding moieties
11/25/2003US6652291 Leadframe interposer
11/25/2003US6652123 Light emitting diode display having heat sinking circuit rails
11/20/2003WO2003096415A1 Semiconductor component
11/20/2003WO2003096414A2 Power supply component assembly on a printed circuit and method for obtaining same
11/20/2003WO2003096387A2 High efficiency solid-state light source and methods of use and manufacture
11/20/2003WO2003074939A3 Piezoelectric ignition mechanism
11/20/2003WO2003067940A3 Circuit carrier and production thereof
11/20/2003WO2003034491A3 Semiconductor component
11/20/2003WO2003028088A3 Methods of forming metallurgy structures for wire and solder bonding and related structures
11/20/2003WO2003019653A3 Method for producing contacts and printed circuit packages
11/20/2003WO2003017327A3 A method and apparatus for die stacking
11/20/2003WO2003010796A3 Structure and method for fabrication of a leadless chip carrier with embedded antenna
11/20/2003US20030215993 Electronic component and fabricating method
11/20/2003US20030215984 Chip and wafer integration process using vertical connections
11/20/2003US20030215977 Electro-optical transceiver system with controlled lateral leakage and method of making it
11/20/2003US20030214616 Image display device and light emission device
11/20/2003US20030214050 Semiconductor device
11/20/2003US20030214029 Multichip wafer-level package and method for manufacturing the same
11/20/2003US20030214023 Semiconductor device having multi-chip package
11/20/2003US20030214007 Wafer-level package with bump and method for manufacturing the same
11/20/2003US20030213963 High speed electronic interconnection using a detachable substrate
11/20/2003DE20314804U1 Integrated rectifier switching network for LED is mounted in housing with frame with main and subsidiary columns with broad heads connected by conductor wires
11/20/2003DE10213546C1 Semiconductor device used in silicon microelectronics comprises a first substrate with an integrated component, a second substrate with an integrated repeater, a coupling layer arranged between the substrates, and a contacting element
11/19/2003EP1363328A2 Optical module and optical transceiver module
11/19/2003EP1363327A2 High speed electronic interconnection using a detachable substrate
11/19/2003EP1363149A2 Optical backplane
11/19/2003EP1362502A1 Arrangement with an integrated circuit mounted on a bearing means and a power supply module arrangement
11/19/2003EP1362501A1 Electronic device and method of manufacturing the same
11/19/2003EP1362500A1 An electronic device and a circuit arrangement
11/19/2003CN1457629A Arrangement with integrated circuit mounted on bearing means and power supply module arrangement
11/19/2003CN1457098A Semiconductor arrangement and producing method thereof
11/19/2003CN1456959A Semiconductor memory compoent face down chip interface circuit and face down chip interface method
11/18/2003US6650559 Power converting device
11/18/2003US6650064 Fault tolerant led display design
11/18/2003US6650048 Ventilated light emitting diode matrix panel
11/18/2003US6650024 Vehicle power distributor and method of producing the same
11/18/2003US6650019 Method of making a semiconductor package including stacked semiconductor dies
11/18/2003US6650013 Method of manufacturing wire bonded microelectronic device assemblies
11/18/2003US6650009 Structure of a multi chip module having stacked chips
11/18/2003US6650008 Stacked semiconductor packaging device
11/18/2003US6650007 Stackable ceramic fbga for high thermal applications
11/18/2003US6650006 Semiconductor package with stacked chips
11/18/2003US6650004 Semiconductor device
11/18/2003US6649978 Semiconductor module having multiple semiconductor chips
11/18/2003US6649941 Flip-chip device
11/18/2003US6649428 Semiconductor chip, semiconductor integrated circuit using the same, and method of selecting semiconductor chip
11/18/2003US6649008 Method of mass producing and packaging integrated subsystems
11/13/2003WO2003094248A1 Light-receiving panel or light-emitting panel, and manufacturing method thereof
11/13/2003WO2003094234A2 Component
11/13/2003WO2003069968A3 Housing for a power semiconductor module which is resistant to high voltages
11/13/2003WO2003039974A3 Package enclosing multiple packaged chips
11/13/2003WO2003036715A3 Adhesive wafers for die attach application
11/13/2003WO2003017328A3 Encapsulated integrated circuit package and method of manufacturing an integrated circuit package
11/13/2003US20030211679 Flip chip interface circuit of a semiconductor memory device and method for interfacing a flip chip
11/13/2003US20030211656 Method for fabricating multi-chip package semiconductor device
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