Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
12/2003
12/17/2003CN1131563C Semiconductor assembly
12/16/2003US6665190 Modular PC card which receives add-in PC card modules
12/16/2003US6665182 Module unit for memory modules and method for its production
12/16/2003US6665170 Light emitting diode illumination system
12/16/2003US6664644 Semiconductor device and method for manufacturing the same
12/16/2003US6664643 Semiconductor device and method for manufacturing the same
12/16/2003US6664629 Semiconductor device
12/16/2003US6664628 An unsingulated semiconductor wafer comprising a plurality of dice; an electronic component attached to at least two of said dice, said electronic component overlapping said at least two dice
12/16/2003US6664623 Method to implement sealing and electrical connections to single cell and multi-cell regenerative photoelectrochemical devices
12/16/2003US6664617 Semiconductor package
12/16/2003US6664616 Semiconductor device and manufacturing method thereof
12/16/2003US6664562 Device integrated antenna for use in resonant and non-resonant modes and method
12/16/2003US6664137 Methods and structures for reducing lateral diffusion through cooperative barrier layers
12/16/2003US6664132 Method for producing three-dimensional circuits
12/16/2003US6664129 Integrated circuits and methods for their fabrication
12/11/2003WO2003103048A1 Die connected with integrated circuit component
12/11/2003WO2003103047A1 Stacked ic device with ic chip selecting/counting function
12/11/2003WO2003103042A2 Electronic component comprising external surface contacts and a method for producing the same
12/11/2003WO2003064317A3 Terminals for multi-layer devices
12/11/2003WO2003023823A3 Stacking of multilayer modules
12/11/2003WO2003021687A3 Irfpa roic with dual tdm reset integrators and sub-frame averaging functions per unit cell
12/11/2003WO2003021673A9 High-frequency chip packages
12/11/2003WO2003021667A3 Package with integrated inductor and/or capacitor
12/11/2003US20030228720 Semiconductor device and a method of manufacturing the same
12/11/2003US20030227751 Multichip package
12/11/2003US20030227095 Semiconductor device and manufacturing method thereof
12/11/2003US20030227080 Multi-chip module
12/11/2003US20030227079 Super high density module with integrated wafer level packages
12/11/2003US20030227075 Memory card and a method of manufacturing the same
12/11/2003US20030227023 White light source
12/11/2003US20030227022 White light source
12/11/2003US20030227020 Light emitting apparatus with current regulation function
12/11/2003US20030226901 IC card and manufacturing method thereof
12/11/2003US20030226685 Wiring structure
12/11/2003CA2483272A1 Die connected with integrated circuit component
12/10/2003EP1370123A2 Metal/ceramic bonding article and method for producing same
12/10/2003EP1369920A2 Wiring structure
12/10/2003EP1369912A2 Method of mounting a Flip chip using a laser beam
12/10/2003EP1368823A2 Method of manufacturing optical devices and related improvements
12/10/2003CN2591780Y LED Lattice module of arc drum shape reflective hole
12/10/2003CN1461499A Display device and its manufacturing method
12/10/2003CN1461495A Wiring method and element arragning method using the same, and method of producing image display devices
12/10/2003CN1461050A Semiconductor device and its mfg. method
12/10/2003CN1130515C Headlamp for vehicle
12/09/2003US6661662 Vehicular modular design multiple application rectifier assembly
12/09/2003US6661659 Water cooled inverter
12/09/2003US6661317 Microwave monolithic integrated circuit assembly with multi-orientation pyrolytic graphite heat-dissipating assembly
12/09/2003US6661100 Low impedance power distribution structure for a semiconductor chip package
12/09/2003US6661091 Semiconductor device
12/09/2003US6661086 Three-dimensionally embodied circuit with electrically connected semiconductor chips
12/09/2003US6661085 Barrier structure against corrosion and contamination in three-dimensional (3-D) wafer-to-wafer vertical stack
12/09/2003US6661084 Single level microelectronic device package with an integral window
12/09/2003US6661077 Semiconductor device including primary connecting plug and an auxiliary connecting plug
12/09/2003US6661032 Light emitting diode package structure having an electro-static protective diode
12/09/2003US6660930 Solar cell modules with improved backskin
12/09/2003US6660561 Method of assembling a stackable integrated circuit chip
12/09/2003US6660557 Method of manufacturing an electronic device
12/09/2003US6660556 Method of manufacturing a solar battery
12/09/2003US6660545 Semiconductor device and manufacturing method therefor, circuit substrate, and electronic apparatus
12/09/2003US6659512 Integrated circuit package employing flip-chip technology and method of assembly
12/09/2003US6658727 Method for assembling die package
12/04/2003WO2003101154A1 A controllable light emitting diode
12/04/2003WO2003100867A1 Power source device
12/04/2003WO2003100827A2 Organic semiconductor device and method
12/04/2003WO2003075347A3 Electronic module, panel with individual electronic modules and method for the production thereof
12/04/2003WO2003056876A3 Uniform illumination system
12/04/2003US20030224581 Flip chip packaging process using laser-induced metal bonding technology, system utilizing the method, and device created by the method
12/04/2003US20030224553 System for flexible interconnect packaging
12/04/2003US20030224199 Metal/ceramic bonding article and method for producing same
12/04/2003US20030223535 Lithography device for semiconductor circuit pattern generator
12/04/2003US20030223302 Semiconductor device having semiconductor memory
12/04/2003US20030223236 Projection lamp with led matrix panel
12/04/2003US20030223198 Stacked device assembly
12/04/2003US20030222674 Electronic circuit device and electronic device package
12/04/2003US20030222667 Probe card assembly
12/04/2003US20030222635 Movement actuator/sensor systems
12/04/2003US20030222350 Semiconductor device and method of fabricating the same
12/04/2003US20030222343 Substrate having a plurality of bumps, method of forming the same, and method of bonding substrate to another
12/04/2003US20030222337 Die connected with integrated circuit component for electrical signal passing therebetween
12/04/2003US20030222335 Circuit component, circuit component package,, circuit component built-in module, circuit component package production and circuit component built-in module production
12/04/2003US20030221313 Method for making stacked integrated circuits (ICs) using prepackaged parts
12/03/2003EP1367654A1 Display apparatus and its manufacturing method
12/03/2003EP1367646A1 Electronic module
12/03/2003EP1367645A2 Semiconductor device and manufacturing method thereof
12/03/2003EP1367643A2 Electronic module
12/03/2003CN2590178Y Stacking component for conformable integrated circuit
12/03/2003CN1460294A Led灯 Led lights
12/03/2003CN1459857A 半导体器件 Semiconductor devices
12/03/2003CN1459855A Semiconductor device and mfg. method thereof
12/03/2003CN1459852A Crystal wafer assembling structure
12/02/2003US6657849 Formation of an embedded capacitor plane using a thin dielectric
12/02/2003US6657761 Optical scanning device, image forming apparatus, and optical scanning method
12/02/2003US6657523 Stacked radio-frequency module
12/02/2003US6657382 Light emitting device, display apparatus with an array of light emitting devices, and display apparatus method of manufacture
12/02/2003US6657379 Illumination unit having at least one LED as light source
12/02/2003US6657309 Semiconductor chip and semiconductor device of chip-on-chip structure
12/02/2003US6657290 Semiconductor device having insulation layer and adhesion layer between chip lamination
12/02/2003US6657289 Apparatus relating to block configurations and fluidic self-assembly processes
12/02/2003US6657236 Enhanced light extraction in LEDs through the use of internal and external optical elements
12/02/2003US6657235 Optical excitation/detection device using discrete photoemitter devices
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