Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
01/2004
01/06/2004US6672745 Systems and components for enhancing rear vision from a vehicle
01/02/2004EP1376696A1 Semiconductor device
01/02/2004EP1376695A1 Power semiconductor device
01/02/2004EP1376690A2 Pressure-contact type semiconductor device
01/02/2004EP1376678A2 Manufacturing method of semiconductor device
01/01/2004US20040001136 Optical scanning device, image forming apparatus, and optical scanning method
01/01/2004US20040000968 Integrated passive devices fabricated utilizing multi-layer, organic laminates
01/01/2004US20040000867 Package structure of a composite LED
01/01/2004US20040000724 Common connection method for flip-chip assembled devices
01/01/2004US20040000723 Stacked multi-chip package, process for fabrication of chip structuring package, and process for wire-bonding
01/01/2004US20040000708 Memory expansion and chip scale stacking system and method
01/01/2004US20040000707 Modularized die stacking system and method
01/01/2004US20040000706 Semiconductor device, semiconductor package, and method for testing semiconductor device
01/01/2004US20040000705 Reconfigurable processor module comprising hybrid stacked integrated circuit die elements
01/01/2004US20040000701 Stand-alone organic-based passive devices
01/01/2004US20040000674 Optically coupled semiconductor device and method for manufacturing the same
01/01/2004US20040000425 Methods for fabricating three-dimensional all organic interconnect structures
01/01/2004US20040000334 Photovoltaic tiles, roofing system, and method of constructing roof
01/01/2004US20040000106 Double-pane window that generates solar-powered electricity
12/2003
12/31/2003WO2004002204A1 Metal-ceramic substrate for electric circuits or modules, method for producing one such substrate and module comprising one such substrate
12/31/2003WO2004001963A1 Electronic component comprising a multilayer substrate and corresponding method of production
12/31/2003WO2004001861A1 Photoelectric composite module and optical input/output device using the module as component element
12/31/2003WO2004001858A1 Light-receiving or light-emitting device and itsd production method
12/31/2003WO2004001848A1 Electronics circuit manufacture
12/31/2003WO2004001834A1 Composition for removing sidewall residues
12/31/2003WO2004001814A2 Method of forming a raised contact for a substrate
12/31/2003WO2002089208A8 Arrangement comprising at least two different electronic semiconductor circuits
12/31/2003CN1465214A Circuit module
12/31/2003CN1465098A Semiconductor device and its manufacturing method
12/31/2003CN1465076A Method for producing nanocomposite magnet using atomizing method
12/31/2003CN1465075A Production method for conductive paste and production method for printed circuit board
12/31/2003CN1464953A Led illuminator and card type led illuminating light source
12/31/2003CN1464555A Light-emitting diode decorative bulb and process for making it
12/31/2003CN1464551A Multi-chip packaging
12/31/2003CN1464540A Packing method capable of increasing percent of pass for multiple chip package
12/30/2003US6671202 Programmable circuit structures with reduced susceptibility to single event upsets
12/30/2003US6670776 Enhanced trim resolution voltage-controlled dimming LED driver
12/30/2003US6670751 Mounted at high density in large area with superior heat sink
12/30/2003US6670748 Novel daylight fluorescent inorganic nitride or oxynitride pigment emitting white light with good color rendering and high output; consistant at fluctuating operating temperatures
12/30/2003US6670702 Stackable ball grid array package
12/30/2003US6670701 Semiconductor module and electronic component
12/30/2003US6670697 Semiconductor device module frame and group thereof
12/30/2003US6670674 Transistor and power amplifier with improved bandwidth
12/30/2003US6670541 Solar battery, solar generating apparatus, and building
12/30/2003US6670221 Semiconductor device having a built-in contact-type sensor and manufacturing method thereof
12/30/2003US6670217 Methods for forming a die package
12/30/2003US6670207 Radiation emitter device having an integral micro-groove lens
12/30/2003US6669803 Simultaneous provision of controlled height bonding material at a wafer level and associated structures
12/30/2003US6669783 High temperature electrostatic chuck
12/30/2003US6669489 Interposer, socket and assembly for socketing an electronic component and method of making and using same
12/25/2003WO2003107427A1 Interlayer dielectric and pre-applied die attach adhesive materials
12/25/2003US20030235038 Power semiconductor module
12/25/2003US20030234452 Optical integrated circuit element package and process for making the same
12/25/2003US20030234443 Low profile stacking system and method
12/25/2003US20030234434 Semiconductor device
12/25/2003US20030234431 Led package
12/24/2003WO2003107439A1 Photovoltaic module with light reflecting backskin
12/24/2003WO2003107438A1 Solar cell modules with improved backskin
12/24/2003WO2003107423A1 A lamp and method of producing a lamp
12/24/2003WO2003107422A1 Semiconductor device and its manufacturing method
12/24/2003WO2003107421A2 Semi-conductor component
12/24/2003WO2003017324A8 Structure and method for fabrication of a leadless chip carrier with embedded inductor
12/24/2003WO2002071486A3 Mixed analog and digital integrated circuits
12/24/2003DE10214121C1 Optoelektronisches Bauelement mit mehreren Halbleiterchips Optoelectronic component having a plurality of semiconductor chips
12/24/2003CN1463043A Semiconductor device and its mfg. method
12/24/2003CN1463042A Electronic circuit device and electronic device package
12/24/2003CN1463036A Chip of memory, chip-on-chip device of using same and its mfg. method
12/24/2003CN1132242C Automated stacking and soldering appts. for three dimensional stack package devices and mfg. method thereof
12/24/2003CA2634288A1 Led packaging method and packaged led
12/24/2003CA2488904A1 A lamp and method of producing a lamp
12/23/2003US6667895 Integrated circuit device and module with integrated circuits
12/23/2003US6667558 Module and method of making same
12/23/2003US6667555 Spacer-connector stud for stacked surface laminated multi-chip modules and methods of manufacture
12/23/2003US6667551 Semiconductor device and manufacturing thereof, including a through-hole with a wider intermediate cavity
12/23/2003US6667544 Stackable package having clips for fastening package and tool for opening clips
12/23/2003US6667519 Mixed technology microcircuits
12/23/2003US6667497 LED package
12/23/2003US6667481 Two-dimensional image sensor
12/23/2003US6666567 Methods and apparatus for a light source with a raised LED structure
12/23/2003US6665992 Concrete construction block and method for forming the same
12/18/2003WO2003105460A2 Highly sensitive imaging camera for space applications including detection of ultrahigh energy cosmic rays
12/18/2003WO2003028103A3 Multi-stack surface mount light emitting diodes
12/18/2003WO2003001597A3 Vertically contacted stacked chips
12/18/2003US20030232486 Semiconductor device and method of manufacturing the same
12/18/2003US20030232462 Semiconductor devices and semiconductor device components with peripherally located, castellated contacts, assemblies and packages including such semiconductor devices or packages and associated methods
12/18/2003US20030232460 Semiconductor devices including peripherally located bond pads, assemblies, packages, and methods
12/18/2003US20030231842 Device for optical and/or electrical data transmission and/or processing
12/18/2003US20030230802 Semiconductor devices and semiconductor device components with peripherally located, castellated contacts, assemblies and packages including such semiconductor devices or packages and associated methods
12/18/2003US20030230801 Semiconductor device assemblies and packages including multiple semiconductor devices and methods
12/18/2003US20030230797 Semiconductor module structure incorporating antenna
12/18/2003US20030230796 Electrical connection for connecting a plurality of bonding pads includes first bonding pad and a bump disposed on first bonding pad, first wire stitch bonded to bump and second wire ball bonded to stitch bond of first wire
12/17/2003EP1372247A1 Rotatary electrical machine
12/17/2003EP1372215A2 Semiconductor module structure incorporating antenna
12/17/2003EP1372194A1 Method for fabricating shaped blocks
12/17/2003EP1372193A2 Semiconductor device and method of manufacturing the same
12/17/2003EP1372028A2 Illumination apparatus with movable LEDs and image projection apparatus using the same
12/17/2003EP1371094A1 sUPER-THIN HIGH SPEED FLIP CHIP PACKAGE
12/17/2003CN2593365Y High density multi-chip module
12/17/2003CN1462072A Semiconductor packaging device and its manufacturing method
12/17/2003CN1462071A System for flexible interconnection packaging
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