Patents
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
01/2004
01/21/2004CN1469493A Regeneration method for solar cell module and solar cell module
01/21/2004CN1469472A Optical interconnecting integrated circuit, method for producing optical interconnecting integrated circuit, photoelectrical apparatus and electronic instrument
01/21/2004CN1469469A Power semiconductor device
01/21/2004CN1469461A Semiconductor device and methods for producing semiconductor device
01/21/2004CN1469447A Method for producing semiconductor
01/21/2004CN1469446A Semiconductor device and producing method thereof
01/21/2004CN1135616C 芯片罩盖 Chip cover
01/21/2004CN1135314C Head lamp of vehicle
01/20/2004US6680532 Multi chip module
01/20/2004US6680495 Silicon wafer with embedded optoelectronic material for monolithic OEIC
01/20/2004US6680219 Method and apparatus for die stacking
01/20/2004US6679618 Light emitting diode 360 degree warning lamp
01/15/2004WO2004006344A1 Apparatus, system, and method of electrically coupling photovoltaic modules
01/15/2004WO2004006343A1 Apparatus, system, and method of mechanically coupling photovoltaic modules
01/15/2004WO2004006333A1 Multi electric device package
01/15/2004WO2004006332A1 Modular board device and high frequency module and method for producing them
01/15/2004WO2004006331A1 Multilayer wiring circuit module and method for fabricating the same
01/15/2004WO2004006301A2 Apparatus, system, and method of diagnosing individual photovoltaic cells
01/15/2004US20040010717 Apparatus and method for preventing digital media piracy
01/15/2004US20040009647 Method of manufacturing semiconductor device
01/15/2004US20040009631 Semiconductor package with circuit side polymer layer and wafer level fabrication method
01/15/2004US20040009629 Electrode forming method in circuit device and chip package and multilayer board using the same
01/15/2004US20040008953 Optical module and optical transceiver module
01/15/2004US20040008459 Protected exciter for an electrical power generator and associated methods
01/15/2004US20040007782 Connecting circuit devices and assemblies thereof
01/15/2004US20040007775 Semiconductor package and fabrication method of the same
01/15/2004US20040007772 Power semiconductor device
01/15/2004US20040007771 Semiconductor package and method for fabricating the smae
01/15/2004US20040007768 Field programmable gate array assembly
01/15/2004US20040007709 Semiconductor integrated circuit, signal transmitting device, electro-optical device, and electronic apparatus
01/15/2004US20040007260 Inclined photovoltaic assembly
01/15/2004US20040006869 Method of manufacturing sheet material and method of manufacturing circuit device using the same
01/15/2004DE10329843A1 Verfahren zum wasserdichten Abdichten eines Leistungsschaltkreisabschnittes und Leistungsmodul mit einem derartigen Leistungsschaltkreisabschnitt A method for waterproofing a power circuit section and the power module having such a power switching circuit section
01/15/2004DE10228593A1 Elektronisches Bauteil mit einer Gehäusepackung Electronic device having a housing package
01/15/2004DE10227658A1 Metall-Keramik-Substrat für elektrische Schaltkreise -oder Module, Verfahren zum Herstellen eines solchen Substrates sowie Modul mit einem solchen Substrat A metal-ceramic substrate for electrical circuits -or- modules, method of making such a substrate and module substrate having such a
01/15/2004DE10227605A1 Schicht-Anordnung und Verfahren zum Herstellen einer Schicht-Anordnung Layer arrangement and method for producing a layer arrangement
01/15/2004DE10227106A1 Halbleitermodul Semiconductor module
01/14/2004EP1381258A1 High-frequency module
01/14/2004EP1381130A1 Protected exciter for an electrical power generator and associated methods
01/14/2004EP1381115A1 Pressure contact power semiconductor relay
01/14/2004EP1380057A1 High power led
01/14/2004CN1468467A Thick film millimeter wave transceiver module
01/14/2004CN1467842A Semiconductor integrated circuit, signal transmitting device, electro-optical device, and electronic apparatus
01/14/2004CN1467836A Semiconductor device, semiconductor package, and method for testing semiconductor device
01/14/2004CN1467829A Multi-die package
01/14/2004CN1467828A Semiconductor unit
01/14/2004CN1467803A Substrate having a plurality of bumps, method of forming the same, and method of bonding substrate to another
01/14/2004CN1467685A Ic card and manufacturing method thereof
01/14/2004CN1134825C Secure semiconductor device
01/13/2004US6678167 High performance multi-chip IC package
01/13/2004US6677674 Semiconductor package having two chips internally connected together with bump electrodes and both chips externally connected to a lead frame with bond wires
01/13/2004US6677673 Clamping assembly for high-voltage solid state devices
01/13/2004US6677671 Apparatus for forming a stack of packaged memory dice
01/13/2004US6677670 Semiconductor device
01/13/2004US6677669 Semiconductor package including two semiconductor die disposed within a common clip
01/13/2004US6677655 Silicon wafer with embedded optoelectronic material for monolithic OEIC
01/13/2004US6677614 Semiconductor light-emitting device and method for manufacturing the device
01/13/2004US6677237 Semiconductor chip, semiconductor device, circuit board and electronic equipment and production methods for them
01/13/2004US6676282 Vehicle headlamp and a vehicle
01/08/2004WO2004004000A1 Structure for connecting power supply to semiconductor device
01/08/2004WO2004003991A2 Electronic component with a housing packaging
01/08/2004WO2003030225B1 Semiconductor chip with multiple rows of bond pads
01/08/2004WO2003023834A3 Method of manufacturing optical devices and related improvements
01/08/2004WO2002041397A3 Low profile integrated module interconnects
01/08/2004US20040004887 Volumetric data storage apparatus
01/08/2004US20040004835 LED structure in lamp type
01/08/2004US20040004820 Electronic module
01/08/2004US20040004818 Method for waterproofing power circuit section and power module having power circuit section
01/08/2004US20040004291 Semiconductor device
01/08/2004US20040004286 Stackable layers containing ball grid array packages
01/08/2004US20040004280 Semiconductor device and system having semiconductor device mounted thereon
01/08/2004US20040004227 Unit for driving light-emitting device
01/08/2004US20040003840 Method for regenerating photovoltaic module and photovoltaic module
01/08/2004US20040003836 Paste composition and solar cell employing the same
01/08/2004US20040003691 Forming folded-stack packaged device using vertical progression folding tool
01/08/2004DE10325569A1 IC Karte und Verfahren zu ihrer Herstellung IC card and processes for their preparation
01/08/2004DE10227867A1 Zusammensetzung zum Entfernen von Sidewall-Residues Composition for removing Sidewall Residues
01/08/2004DE10227544A1 Vorrichtung zur optischen und/oder elektrischen Datenübertragung und/oder -verarbeitung An apparatus for optical and / or electrical data transmission and / or processing
01/08/2004DE10226363A1 Halbleiterbauelemente Semiconductor devices
01/07/2004EP1378941A2 Semiconductor module and power conversion device
01/07/2004EP1378938A2 Semiconductor module and power conversion device
01/07/2004EP1378152A2 A method and apparatus for fabricating a circuit board with a three dimensional surface mounted array of semiconductor chips
01/07/2004CN2598150Y LED support
01/07/2004CN2598136Y Wafer stacking structure
01/07/2004CN1466782A Loghting device using LED
01/07/2004CN1466781A Receiving optics and photosemiconductor device having the same
01/07/2004CN1466213A Multi-chip semiconductor package and mfg. method thereof
01/07/2004CN1466212A Multichip semiconductor package with chip carrier having down stretched pin
01/07/2004CN1466211A Semiconductor package and mfg. method thereof
01/07/2004CN1466203A Shrinkage controllable leadframe and flip chip type semiconductor package having same
01/07/2004CN1134065C Circuit and method for providing interconnections among individual integrated circuit chips in multi-chip module
01/06/2004US6674233 Illumination unit having at least one LED as light source
01/06/2004US6674221 Electronic component module and piezoelectric oscillator device
01/06/2004US6674175 Ball grid array chip packages having improved testing and stacking characteristics
01/06/2004US6674161 Semiconductor stacked die devices
01/06/2004US6674160 Multi-chip semiconductor device
01/06/2004US6674159 Bi-level microelectronic device package with an integral window
01/06/2004US6673651 Method of manufacturing semiconductor device including semiconductor elements mounted on base plate
01/06/2004US6673650 Multi chip semiconductor package and method of construction
01/06/2004US6673642 Electro-optical transceiver system with controlled lateral leakage and method of making it