Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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01/21/2004 | CN1469493A Regeneration method for solar cell module and solar cell module |
01/21/2004 | CN1469472A Optical interconnecting integrated circuit, method for producing optical interconnecting integrated circuit, photoelectrical apparatus and electronic instrument |
01/21/2004 | CN1469469A Power semiconductor device |
01/21/2004 | CN1469461A Semiconductor device and methods for producing semiconductor device |
01/21/2004 | CN1469447A Method for producing semiconductor |
01/21/2004 | CN1469446A Semiconductor device and producing method thereof |
01/21/2004 | CN1135616C 芯片罩盖 Chip cover |
01/21/2004 | CN1135314C Head lamp of vehicle |
01/20/2004 | US6680532 Multi chip module |
01/20/2004 | US6680495 Silicon wafer with embedded optoelectronic material for monolithic OEIC |
01/20/2004 | US6680219 Method and apparatus for die stacking |
01/20/2004 | US6679618 Light emitting diode 360 degree warning lamp |
01/15/2004 | WO2004006344A1 Apparatus, system, and method of electrically coupling photovoltaic modules |
01/15/2004 | WO2004006343A1 Apparatus, system, and method of mechanically coupling photovoltaic modules |
01/15/2004 | WO2004006333A1 Multi electric device package |
01/15/2004 | WO2004006332A1 Modular board device and high frequency module and method for producing them |
01/15/2004 | WO2004006331A1 Multilayer wiring circuit module and method for fabricating the same |
01/15/2004 | WO2004006301A2 Apparatus, system, and method of diagnosing individual photovoltaic cells |
01/15/2004 | US20040010717 Apparatus and method for preventing digital media piracy |
01/15/2004 | US20040009647 Method of manufacturing semiconductor device |
01/15/2004 | US20040009631 Semiconductor package with circuit side polymer layer and wafer level fabrication method |
01/15/2004 | US20040009629 Electrode forming method in circuit device and chip package and multilayer board using the same |
01/15/2004 | US20040008953 Optical module and optical transceiver module |
01/15/2004 | US20040008459 Protected exciter for an electrical power generator and associated methods |
01/15/2004 | US20040007782 Connecting circuit devices and assemblies thereof |
01/15/2004 | US20040007775 Semiconductor package and fabrication method of the same |
01/15/2004 | US20040007772 Power semiconductor device |
01/15/2004 | US20040007771 Semiconductor package and method for fabricating the smae |
01/15/2004 | US20040007768 Field programmable gate array assembly |
01/15/2004 | US20040007709 Semiconductor integrated circuit, signal transmitting device, electro-optical device, and electronic apparatus |
01/15/2004 | US20040007260 Inclined photovoltaic assembly |
01/15/2004 | US20040006869 Method of manufacturing sheet material and method of manufacturing circuit device using the same |
01/15/2004 | DE10329843A1 Verfahren zum wasserdichten Abdichten eines Leistungsschaltkreisabschnittes und Leistungsmodul mit einem derartigen Leistungsschaltkreisabschnitt A method for waterproofing a power circuit section and the power module having such a power switching circuit section |
01/15/2004 | DE10228593A1 Elektronisches Bauteil mit einer Gehäusepackung Electronic device having a housing package |
01/15/2004 | DE10227658A1 Metall-Keramik-Substrat für elektrische Schaltkreise -oder Module, Verfahren zum Herstellen eines solchen Substrates sowie Modul mit einem solchen Substrat A metal-ceramic substrate for electrical circuits -or- modules, method of making such a substrate and module substrate having such a |
01/15/2004 | DE10227605A1 Schicht-Anordnung und Verfahren zum Herstellen einer Schicht-Anordnung Layer arrangement and method for producing a layer arrangement |
01/15/2004 | DE10227106A1 Halbleitermodul Semiconductor module |
01/14/2004 | EP1381258A1 High-frequency module |
01/14/2004 | EP1381130A1 Protected exciter for an electrical power generator and associated methods |
01/14/2004 | EP1381115A1 Pressure contact power semiconductor relay |
01/14/2004 | EP1380057A1 High power led |
01/14/2004 | CN1468467A Thick film millimeter wave transceiver module |
01/14/2004 | CN1467842A Semiconductor integrated circuit, signal transmitting device, electro-optical device, and electronic apparatus |
01/14/2004 | CN1467836A Semiconductor device, semiconductor package, and method for testing semiconductor device |
01/14/2004 | CN1467829A Multi-die package |
01/14/2004 | CN1467828A Semiconductor unit |
01/14/2004 | CN1467803A Substrate having a plurality of bumps, method of forming the same, and method of bonding substrate to another |
01/14/2004 | CN1467685A Ic card and manufacturing method thereof |
01/14/2004 | CN1134825C Secure semiconductor device |
01/13/2004 | US6678167 High performance multi-chip IC package |
01/13/2004 | US6677674 Semiconductor package having two chips internally connected together with bump electrodes and both chips externally connected to a lead frame with bond wires |
01/13/2004 | US6677673 Clamping assembly for high-voltage solid state devices |
01/13/2004 | US6677671 Apparatus for forming a stack of packaged memory dice |
01/13/2004 | US6677670 Semiconductor device |
01/13/2004 | US6677669 Semiconductor package including two semiconductor die disposed within a common clip |
01/13/2004 | US6677655 Silicon wafer with embedded optoelectronic material for monolithic OEIC |
01/13/2004 | US6677614 Semiconductor light-emitting device and method for manufacturing the device |
01/13/2004 | US6677237 Semiconductor chip, semiconductor device, circuit board and electronic equipment and production methods for them |
01/13/2004 | US6676282 Vehicle headlamp and a vehicle |
01/08/2004 | WO2004004000A1 Structure for connecting power supply to semiconductor device |
01/08/2004 | WO2004003991A2 Electronic component with a housing packaging |
01/08/2004 | WO2003030225B1 Semiconductor chip with multiple rows of bond pads |
01/08/2004 | WO2003023834A3 Method of manufacturing optical devices and related improvements |
01/08/2004 | WO2002041397A3 Low profile integrated module interconnects |
01/08/2004 | US20040004887 Volumetric data storage apparatus |
01/08/2004 | US20040004835 LED structure in lamp type |
01/08/2004 | US20040004820 Electronic module |
01/08/2004 | US20040004818 Method for waterproofing power circuit section and power module having power circuit section |
01/08/2004 | US20040004291 Semiconductor device |
01/08/2004 | US20040004286 Stackable layers containing ball grid array packages |
01/08/2004 | US20040004280 Semiconductor device and system having semiconductor device mounted thereon |
01/08/2004 | US20040004227 Unit for driving light-emitting device |
01/08/2004 | US20040003840 Method for regenerating photovoltaic module and photovoltaic module |
01/08/2004 | US20040003836 Paste composition and solar cell employing the same |
01/08/2004 | US20040003691 Forming folded-stack packaged device using vertical progression folding tool |
01/08/2004 | DE10325569A1 IC Karte und Verfahren zu ihrer Herstellung IC card and processes for their preparation |
01/08/2004 | DE10227867A1 Zusammensetzung zum Entfernen von Sidewall-Residues Composition for removing Sidewall Residues |
01/08/2004 | DE10227544A1 Vorrichtung zur optischen und/oder elektrischen Datenübertragung und/oder -verarbeitung An apparatus for optical and / or electrical data transmission and / or processing |
01/08/2004 | DE10226363A1 Halbleiterbauelemente Semiconductor devices |
01/07/2004 | EP1378941A2 Semiconductor module and power conversion device |
01/07/2004 | EP1378938A2 Semiconductor module and power conversion device |
01/07/2004 | EP1378152A2 A method and apparatus for fabricating a circuit board with a three dimensional surface mounted array of semiconductor chips |
01/07/2004 | CN2598150Y LED support |
01/07/2004 | CN2598136Y Wafer stacking structure |
01/07/2004 | CN1466782A Loghting device using LED |
01/07/2004 | CN1466781A Receiving optics and photosemiconductor device having the same |
01/07/2004 | CN1466213A Multi-chip semiconductor package and mfg. method thereof |
01/07/2004 | CN1466212A Multichip semiconductor package with chip carrier having down stretched pin |
01/07/2004 | CN1466211A Semiconductor package and mfg. method thereof |
01/07/2004 | CN1466203A Shrinkage controllable leadframe and flip chip type semiconductor package having same |
01/07/2004 | CN1134065C Circuit and method for providing interconnections among individual integrated circuit chips in multi-chip module |
01/06/2004 | US6674233 Illumination unit having at least one LED as light source |
01/06/2004 | US6674221 Electronic component module and piezoelectric oscillator device |
01/06/2004 | US6674175 Ball grid array chip packages having improved testing and stacking characteristics |
01/06/2004 | US6674161 Semiconductor stacked die devices |
01/06/2004 | US6674160 Multi-chip semiconductor device |
01/06/2004 | US6674159 Bi-level microelectronic device package with an integral window |
01/06/2004 | US6673651 Method of manufacturing semiconductor device including semiconductor elements mounted on base plate |
01/06/2004 | US6673650 Multi chip semiconductor package and method of construction |
01/06/2004 | US6673642 Electro-optical transceiver system with controlled lateral leakage and method of making it |