| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 02/04/2004 | CN1472784A Semiconductor power component device and packaging method thereof |
| 02/04/2004 | CN1472783A Noise shielded multi-layer substrates and manufacture thereof |
| 02/04/2004 | CN1137515C 芯片卡模块 Chip Card Module |
| 02/03/2004 | US6686663 Semiconductor device and a method of manufacturing the same |
| 02/03/2004 | US6686656 Integrated multi-chip chip scale package |
| 02/03/2004 | US6686655 Low profile multi-IC chip package connector |
| 02/03/2004 | US6686654 Multiple chip stack structure and cooling system |
| 02/03/2004 | US6686648 Electronic component with stacked semiconductor chips and method of producing the component |
| 02/03/2004 | US6686642 Micro-machined system comprising logic circuitry or electron emitter array; second surface with gradual incline; evacuation, hermetic sealing |
| 02/03/2004 | US6686223 Method for fabricating multi-chip package semiconductor device |
| 02/03/2004 | US6686222 Stacked semiconductor device manufacturing method |
| 02/03/2004 | US6686221 Method for forming packaged semiconductor device having stacked die |
| 02/03/2004 | US6686216 Electro-optical transceiver system with controlled lateral leakage and method of making it |
| 02/03/2004 | US6685817 Controlling thickness of plating over a width of a substrate |
| 02/03/2004 | US6685296 Ink tank and ink jet recording apparatus provided with the same |
| 02/03/2004 | US6685168 Surface acoustic wave component |
| 02/03/2004 | US6684493 Vertically mountable interposer, assembly and method |
| 01/29/2004 | WO2004010756A2 Surface-mountable component and method for the production thereof |
| 01/29/2004 | WO2004010502A1 Hybrid integrated circuit device |
| 01/29/2004 | WO2004008832A2 Attachable modular electronic systems |
| 01/29/2004 | WO2003096387A3 High efficiency solid-state light source and methods of use and manufacture |
| 01/29/2004 | WO2003034467A3 Semiconductor power module |
| 01/29/2004 | WO2003032390A3 Device with power semiconductor components for controlling the power of high currents and use of said device |
| 01/29/2004 | US20040018709 Stereolithographic methods for securing conductive elements to contacts of semiconductor device components |
| 01/29/2004 | US20040018662 Method of manufacturing a semiconductor device |
| 01/29/2004 | US20040018661 Stacked semiconductor module and method of manufacturing the same |
| 01/29/2004 | US20040018658 Noise shield type multi-layered substrate and munufacturing method thereof |
| 01/29/2004 | US20040018654 Method and apparatus for electronically aligning capacitively coupled chip pads |
| 01/29/2004 | US20040017664 Semiconductor memory module |
| 01/29/2004 | US20040017012 Semiconductor chip, wiring board and manufacturing process thereof as well as semiconductor device |
| 01/29/2004 | US20040017005 Power semiconductor module |
| 01/29/2004 | US20040017003 Semiconductor device and method of producing the same |
| 01/29/2004 | US20040017000 Integrated circuit package with exposed die surfaces and auxiliary attachment |
| 01/29/2004 | US20040016999 Semiconductor device |
| 01/29/2004 | US20040016985 Circuit arrangement with semiconductor elements arranged in chips |
| 01/29/2004 | US20040016942 Semiconductor device and a method of manufacturing the same, a circuit board and an electronic apparatus |
| 01/29/2004 | US20040016939 Encapsulation of a stack of semiconductor dice |
| 01/29/2004 | US20040016456 Photovoltaic device and method for producing the same |
| 01/29/2004 | US20040016455 Module battery |
| 01/29/2004 | DE19631046B4 Bond-Struktur Bond structure |
| 01/29/2004 | DE10257100A1 Leistungsschalter Circuit breaker |
| 01/29/2004 | DE10255818A1 Programmierbare Steuerung Programmable Logic Controller |
| 01/29/2004 | DE10231140A1 Optoelektronisches Bauelement mit elektrisch leitfähigem organischem Material sowie Verfahren zur Herstellung des Bauelementes Optoelectronic component with an electrically conductive organic material and methods for preparing the component |
| 01/28/2004 | EP1384266A2 Arrangement comprising at least two different electronic semiconductor circuits |
| 01/28/2004 | EP0892992B1 Three-colour sensor with a pin or nip series of layers |
| 01/28/2004 | CN1471734A Optoelectronic component and method for the production thereof, module and device comprising a module of this type |
| 01/28/2004 | CN1471730A Electronic circuit device and method for manufacturing the same |
| 01/28/2004 | CN1471168A Semiconductor storage module |
| 01/28/2004 | CN1471167A Modular triple chip laminate structure |
| 01/27/2004 | US6684007 Optical coupling structures and the fabrication processes |
| 01/27/2004 | US6683663 Forming displays on flexible or rigid substrates by dispensing slurries; electronics |
| 01/27/2004 | US6683416 Device transfer method, and device array method and image display unit production method using the same |
| 01/27/2004 | US6683385 Low profile stack semiconductor package |
| 01/27/2004 | US6683384 Air isolated crossovers |
| 01/27/2004 | US6683377 Electrical and electronic apparatus comprising substrates having metallic and nonmetallic surfaces, chips, wires and dielectric adhesives as aperture fillers and coverings for conductors |
| 01/27/2004 | US6683374 Electronic component and process for producing the electronic component |
| 01/27/2004 | US6683373 Method of modifying connecting leads and thinning bases of encapsulated modular electronic components to obtain a high-density module, and a module obtained thereby |
| 01/27/2004 | US6682981 Stress controlled dielectric integrated circuit fabrication |
| 01/27/2004 | US6682955 Stacked die module and techniques for forming a stacked die module |
| 01/27/2004 | US6682954 Method for employing piggyback multiple die #3 |
| 01/27/2004 | US6682948 Semiconductor device and method for manufacturing the same |
| 01/27/2004 | US6682211 Replaceable LED lamp capsule |
| 01/27/2004 | US6682207 Green phosphor converted light emitting diode |
| 01/22/2004 | WO2004008817A2 A multi-configuration processor-memory device |
| 01/22/2004 | WO2004008618A2 Active rectifier module for three-phase generators of vehicles |
| 01/22/2004 | WO2004008553A1 Optoelectronic component comprising an electroconductive organic material, and method for producing said component |
| 01/22/2004 | WO2004008532A2 High power mcm package |
| 01/22/2004 | WO2004008531A1 Lead frame for stacked semiconductor packages, stacked semiconductor packages using it, and fabrication method thereof |
| 01/22/2004 | WO2004008506A1 Large-diameter sic wafer and manufacturing method thereof |
| 01/22/2004 | WO2004008488A2 Ganged detector pixel, photon/pulse counting radiation imaging device |
| 01/22/2004 | WO2003067646A3 Semiconductor substrate comprising an electrically isolated region, in particular for vertical integration |
| 01/22/2004 | WO2003030252A3 Process for producing interconnects |
| 01/22/2004 | WO2003019617A3 Method for producing electronic components |
| 01/22/2004 | WO2002089207A3 High performance, low cost microelectronic circuit package with interposer |
| 01/22/2004 | US20040015807 Semiconductor device and semiconductor integrated circuit |
| 01/22/2004 | US20040014308 Barrier structure against corrosion and contamination in three-dimensional (3-D) wafer-to-wafer vertical stack |
| 01/22/2004 | US20040014258 Monolithic Microwave Integrated Circuits; for automobile steering systems |
| 01/22/2004 | US20040014257 Method for joining lead frames in a package assembly, method for forming a chip stack package, and a chip stack package |
| 01/22/2004 | US20040012992 Multi-level package for a memory module |
| 01/22/2004 | US20040012991 Semiconductor memory module |
| 01/22/2004 | US20040012957 Passive radiation optical system module especially for use with light-emitting diodes |
| 01/22/2004 | US20040012941 Low profile stacked multi-chip package and method of forming same |
| 01/22/2004 | US20040012934 Multi-configuration processor-memory substrate device |
| 01/22/2004 | US20040012698 Image pickup model and image pickup device |
| 01/22/2004 | US20040012337 Device transfer method, and device array method and image display unit production method using the same |
| 01/22/2004 | US20040012275 Power electronic component module and method for assembling same |
| 01/22/2004 | US20040012096 Stack-type semiconductor package having one or more semiconductor packages stacked therein |
| 01/22/2004 | US20040012094 Flip-chip integrated circuit package and method of assembly |
| 01/22/2004 | US20040012085 Semiconductor device |
| 01/22/2004 | US20040012081 Semiconductor wafer having electrically connected passive device chips, passive devices and semiconductor package using the same |
| 01/22/2004 | US20040012080 Connection of integrated circuits |
| 01/22/2004 | US20040012064 Semiconductor module and power conversion device |
| 01/22/2004 | US20040011962 Multicycle integration focal plane array (MIFPA) for lock-in (LI-), gated (G-), and gated lock-in (GLI-) imaging, spectroscopy and spectroscopic imaging |
| 01/22/2004 | DE10312642A1 Halbleitereinrichtung und Herstellungsverfahren von Kontakthöcker auf Halbleiterchips A semiconductor device and manufacturing method of bumps on semiconductor chips |
| 01/22/2004 | DE10231091A1 Aktivgleichrichter-Modul für Drehstromgeneratoren von Fahrzeugen Active rectifier module for alternators of vehicles |
| 01/22/2004 | DE10228328A1 Elektronisches Bauelement mit einem Mehrlagensubstrat und Herstellungsverfahren An electronic device with a multi-layer substrate and manufacturing method |
| 01/21/2004 | CN1470080A Semiconductor device and method of its manufacture |
| 01/21/2004 | CN1470079A Lighting or light-receiving semiconductor module and method of its manufacture |
| 01/21/2004 | CN1470075A Semiconductor light emitting element formed no a clear or translucent substrate |
| 01/21/2004 | CN1470072A LED module |