| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 02/18/2004 | EP1389820A2 Low inductance circuit arrangement for power semiconductor moduls |
| 02/18/2004 | EP1389802A1 Protective layer for an intermediate contact plate in a power semiconductor module |
| 02/18/2004 | CN1476636A Molecule component |
| 02/18/2004 | CN1139125C High-power microwave hybrid integrated circuit |
| 02/18/2004 | CN1139120C Packaging structure for integrated circuit |
| 02/17/2004 | US6693801 Electronic device |
| 02/17/2004 | US6693364 Optical integrated circuit element package and process for making the same |
| 02/17/2004 | US6693363 Ball grid array chip packages having improved testing and stacking characteristics |
| 02/17/2004 | US6693362 Chips are densely mounted, have high operating frequencies, are mounted in arrangement that is easy to repair, and have good heat radiation property |
| 02/17/2004 | US6693361 Packaging of integrated circuits and vertical integration |
| 02/17/2004 | US6693358 Semiconductor chip, wiring board and manufacturing process thereof as well as semiconductor device |
| 02/17/2004 | US6693347 Semiconductor device |
| 02/17/2004 | US6693346 Semiconductor memory module having double-sided stacked memory chip layout |
| 02/17/2004 | US6693237 Sealing composition for sealing solar cell, and solar cell module and building material-integral type solar cell module using said composition |
| 02/17/2004 | US6692987 BOC BGA package for die with I-shaped bond pad layout |
| 02/17/2004 | US6692985 Solar cell substrate with thin film polysilicon |
| 02/17/2004 | US6692269 Circuit module with universal connectivity |
| 02/17/2004 | US6692136 LED/phosphor-LED hybrid lighting systems |
| 02/12/2004 | WO2004014114A1 Method for manufacturing board with built-in device and board with built-in device, and method for manufacturing printed wiring board and printed wiring board |
| 02/12/2004 | WO2004013934A1 Dielectric interconnect frame incorporating emi shield and hydrogen absorber for tile t/r modules |
| 02/12/2004 | WO2004013910A1 Microelectronic adaptors, assemblies and methods |
| 02/12/2004 | WO2004013698A1 High-density interconnection of temperature sensitive electronic devices |
| 02/12/2004 | WO2003094234A3 Component |
| 02/12/2004 | WO2003030254A3 Process for assembling systems and structure thus obtained |
| 02/12/2004 | WO2003023856A3 Semiconductor structures with cavities, and methods of fabrication |
| 02/12/2004 | US20040029329 Method for transferring and stacking of semiconductor devices |
| 02/12/2004 | US20040029315 Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice |
| 02/12/2004 | US20040029314 Semiconductor device and manufacturing method thereof |
| 02/12/2004 | US20040027869 Semiconductor device |
| 02/12/2004 | US20040027802 Arrangement with an integrated circuit mounted on a bearing means and a power supply module arrangement |
| 02/12/2004 | US20040027314 Image display unit and production method thereof |
| 02/12/2004 | US20040027067 Light emitting diode, light emitting device using the same, and fabrication processes therefor |
| 02/12/2004 | US20040026791 Apparatus for forming a stack of packaged memory dice |
| 02/12/2004 | US20040026790 Semiconductor device and semiconductor chip for use therein |
| 02/12/2004 | US20040026789 Semiconductor device |
| 02/12/2004 | US20040026780 High-frequency semiconductor device |
| 02/12/2004 | US20040026778 Low cost power semiconductor module without substate |
| 02/12/2004 | US20040026777 Semiconductor device |
| 02/12/2004 | US20040026773 Packaged microelectronic components |
| 02/12/2004 | US20040026771 High-density inter-die interconnect structure |
| 02/12/2004 | US20040026768 Semiconductor dice with edge cavities |
| 02/12/2004 | US20040026744 Semiconductor module |
| 02/12/2004 | US20040026706 Radiation source and method for producing a lens mould |
| 02/12/2004 | US20040026689 Encapsulated organic-electronic component, method for producing the same and use thereof |
| 02/12/2004 | US20040026683 Light emitting device and lighting apparatus using the same |
| 02/12/2004 | DE19601372B4 Halbleitermodul Semiconductor module |
| 02/12/2004 | DE10315246A1 Halbleiter-Speichermodul A semiconductor memory module |
| 02/12/2004 | DE10310809A1 Leistungshalbleitereinrichtung Power semiconductor device |
| 02/12/2004 | DE10234102A1 Light emitting diode arrangement has many diodes which are directly interconnected by both housings and electrodes |
| 02/11/2004 | EP1388916A1 Optoelectronic package |
| 02/11/2004 | CN2603518Y IC module for contactless IC card reader-writer |
| 02/11/2004 | CN2603517Y Semiconductor chip stacking structure |
| 02/11/2004 | CN2603502Y High-brightness plane lamp structure |
| 02/11/2004 | CN2603377Y Combined photoelectric sensor |
| 02/10/2004 | US6690845 Three-dimensional opto-electronic modules with electrical and optical interconnections and methods for making |
| 02/10/2004 | US6690203 Method and apparatus for a failure-free synchronizer |
| 02/10/2004 | US6690089 Semiconductor device having multi-chip package |
| 02/10/2004 | US6690088 Integrated circuit package stacking structure |
| 02/10/2004 | US6690087 Power semiconductor module ceramic substrate with upper and lower plates attached to a metal base |
| 02/10/2004 | US6689670 High-frequency module |
| 02/10/2004 | US6689640 Chip scale pin array |
| 02/10/2004 | US6689637 Method of manufacturing a multi-chip semiconductor package |
| 02/10/2004 | US6689636 Semiconductor device and fabrication method of the same |
| 02/10/2004 | US6688053 Double-pane window that generates solar-powered electricity |
| 02/05/2004 | WO2004012266A1 Electronic package substrate with back side, cavity mounted capacitors and method of fabrication therefor |
| 02/05/2004 | WO2004012265A1 Method and apparatus for electronically aligning capacitively coupled chip pads |
| 02/05/2004 | US20040023466 Stacked wafer aligment method |
| 02/05/2004 | US20040023436 Structure of high performance combo chip and processing method |
| 02/05/2004 | US20040023433 High-density interconnection of temperature sensitive electronic devices |
| 02/05/2004 | US20040023058 Dielectric interconnect frame incorporating EMI shield and hydrogen absorber for tile T/R modules |
| 02/05/2004 | US20040022038 Electronic package with back side, cavity mounted capacitors and method of fabrication therefor |
| 02/05/2004 | US20040022031 Overmolded device with contoured surface |
| 02/05/2004 | US20040022026 Stacked electronic device modules with heat pipes |
| 02/05/2004 | US20040021629 Light emitting diode device |
| 02/05/2004 | US20040021477 Method for ball grid array chip packages having improved testing and stacking characteristics |
| 02/05/2004 | US20040021231 Semiconductor device and its manufacturing method |
| 02/05/2004 | US20040021230 Ultra thin stacking packaging device |
| 02/05/2004 | US20040021218 Module component |
| 02/05/2004 | US20040021212 Semiconductor device, method for manufacturing an electronic equipment, electronic equipment, and portable information terminal |
| 02/05/2004 | US20040021211 Microelectronic adaptors, assemblies and methods |
| 02/05/2004 | US20040021210 Semiconductor packaging apparatus |
| 02/05/2004 | US20040021176 Integrated circuit device and electronic device |
| 02/05/2004 | US20040021149 Pressure-contact type semiconductor device |
| 02/05/2004 | US20040021144 Carrier for opto-electronic elements, an optical transmitter and an optical receiver |
| 02/05/2004 | US20040021139 Semiconductor dice having backside redistribution layer accessed using through-silicon vias, methods of fabrication and assemblies |
| 02/05/2004 | US20040020528 Low cost solar energy extraction |
| 02/05/2004 | US20040020046 Deforming conductive particles by application of a stress; mixing the deformed conductive particles with a binder that includes a thermosetting resin as a main component |
| 02/05/2004 | DE19902462B4 Halbleiterbauelement mit Chip-on-Chip-Aufbau A semiconductor device with a chip-on-chip structure |
| 02/05/2004 | DE10245932B3 Light-emitting diode illumination device has spaces provided between side edges of adjacent light-emitting diodes for output of emitted light |
| 02/05/2004 | DE10244713A1 Oberflächenmontierbares Bauelement und Verfahren zu dessen Herstellung Surface-mountable component and process for its preparation |
| 02/05/2004 | DE10233050A1 Light emitting diode source especially for white light has blue LED and gallium nitride uv diode irradiating a fluorescent material |
| 02/04/2004 | EP1387606A2 Device for controlling a vehicle |
| 02/04/2004 | EP1387412A1 Light source device using led, and method of producing same |
| 02/04/2004 | EP1387403A2 Semiconductor packaging |
| 02/04/2004 | EP1387401A2 Integrated circuits and methods for their fabrication |
| 02/04/2004 | EP1386357A1 Illuminator |
| 02/04/2004 | EP1386348A2 Semiconductor device and method of making same |
| 02/04/2004 | CN1472808A Semiconductor device |
| 02/04/2004 | CN1472807A Ultrathin stack components |
| 02/04/2004 | CN1472805A Electric circuit elements, electric circuit assembly, electric circuit built-in modules and manufacture thereof |