Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
07/2014
07/09/2014CN203707125U 一种新型大功率集成封装 A new high-power integrated package
07/09/2014CN203707124U 贴片型硅胶透镜封装光源 SMD silicone lens package source
07/09/2014CN203707123U 一种全彩led封装结构 An all-color led package
07/09/2014CN203707122U 一种led封装结构 One kind of led package structure
07/09/2014CN203707121U 彩色led灯封装结构 Color led light package
07/09/2014CN203707120U 固态发射器封装及多像素发射封装 Solid-state transmitter package and multi-pixel launch package
07/09/2014CN203707112U 一种晶体管封装结构 A transistor package structure
07/09/2014CN203707109U 一种多集成三极管 A multi-integrated transistor
07/09/2014CN203707108U 一种硅基圆片级扇出封装结构 A silicon-based fan-out wafer level package structure
07/09/2014CN203707106U 基于铝基板的集成型共晶光源 Based on the aluminum plate integrated eutectic light
07/09/2014CN103918077A 具有透镜系统的光电子模块 Optoelectronic module having a lens system
07/09/2014CN103918076A 半导体模块 Semiconductor Modules
07/09/2014CN103918075A 利用空间变化的电荷分布确定间距 Changes in the use of space charge distribution is determined pitch
07/09/2014CN103918067A 半导体模块及其制造方法 The semiconductor module and manufacturing method thereof
07/09/2014CN103918066A 半导体模块 Semiconductor Modules
07/09/2014CN103915430A 一种三维芯片堆栈结构 A three-dimensional chip stack structure
07/09/2014CN103915429A 白光led灯及灯丝 White led lights and filament
07/09/2014CN103915428A Led发光装置及封装方法 Led light emitting device and method of packaging
07/09/2014CN103915427A 发光装置及其制造方法 A light emitting device and manufacturing method thereof
07/09/2014CN103915426A 高透光性彩色led灯封装结构 High light transmittance color led light package
07/09/2014CN103915425A 功率用半导体装置 Power semiconductor device
07/09/2014CN103915424A 半导体模块封装 Semiconductor module package
07/09/2014CN103915423A 一种芯片三维堆叠封装结构及封装方法 A chip package structure and three-dimensional stacked packaging method
07/09/2014CN103915422A 用于半导体结构的方法和装置 Method and apparatus for a semiconductor structure
07/09/2014CN103915419A 半导体装置的硅穿孔双向修补电路 Silicon via bidirectional semiconductor device repair circuit
07/09/2014CN103915414A 倒装芯片晶片级封装及其方法 Flip chip and wafer level packaging method
07/09/2014CN102263087B 半导体元件及其制作方法 Semiconductor device and manufacturing method thereof
07/09/2014CN102237350B 照明装置以及包括发光元件的发光装置 Illumination device and a light emitting device includes a light emitting element
07/09/2014CN102169939B 发光器件、发光器件封装以及照明系统 A light emitting device, a light emitting device package and a lighting system
07/09/2014CN102017143B 辐射发射半导体芯片 Radiation-emitting semiconductor chip
07/09/2014CN101752356B 半导体芯片冷却装置 Semiconductor chip cooling device
07/09/2014CN101563778B Led半导体主体以及led半导体主体的应用 Application Led semiconductor body and led the semiconductor body
07/09/2014CN101379612B 半导体装置 Semiconductor device
07/08/2014US8775982 Optical proximity correction for active region design layout
07/08/2014US8773021 Light soaking system for photovoltaic modules
07/08/2014US8772953 Semiconductor device and programming method
07/08/2014US8772797 Display device with step configuration in the insulating layer
07/08/2014US8769810 Part mounting method
07/08/2014CA2521881C High power alingan based multi-chip light emitting diode
07/03/2014WO2014104913A1 Module with light-emitting diodes
07/03/2014WO2014104516A1 Circuit board having interposer embedded therein, electronic module using same, and method for manufacturing same
07/03/2014WO2014103855A1 Semiconductor device and manufacturing method therefor
07/03/2014WO2014103133A1 Semiconductor device
07/03/2014WO2014103036A1 Semiconductor device and automobile
07/03/2014WO2014101648A1 Package-on-package device
07/03/2014WO2014101338A1 Low-parasitic-inductance igbt power module
07/03/2014WO2014037815A3 Lead carrier with print-formed terminal pads
07/03/2014US20140184322 Through silicon via repair circuit
07/03/2014US20140183758 Method of manufacturing semiconductor device, block stacked body, and sequential stacked body
07/03/2014US20140183679 Electrical circuit and method for producing an electrical circuit
07/03/2014US20140183574 Light emitting device package, light emitting device using that package, and illumination device using the light emitting devices
07/03/2014US20140183566 Multi-chip led diode apparatus
07/03/2014DE202013101400U1 Anordnung zum Konvertieren des von einer LED-Lichtquelle emittierten Lichts An arrangement for converting the light emitted from an LED light source
07/03/2014DE102013114938A1 Halbleiterbauelement und Verfahren zur Herstellung eines Halbleiterbauelements A semiconductor device and method of manufacturing a semiconductor device
07/03/2014DE102013113469A1 Flip-chip-wafer-level-baueinheit und diesbezügliche verfahren Flip-chip wafer-level assembly and related methods
07/03/2014DE102011006445B4 Halbleitermodul und Verfahren zum Herstellen desselben The same semiconductor module and method of producing
07/03/2014DE102007050868B4 Leistungshalbleitervorrichtung Power semiconductor device
07/03/2014DE102006032490B4 Halbleitervorrichtung Semiconductor device
07/03/2014DE102004048529B4 Elektronisches Gerät mit Halbleiterchip, der über eine Lötmittelschicht mit einem metallischen Leiterteil flächig verbunden ist An electronic device having the semiconductor chip, which is connected via a solder layer surface with a metallic conductor portion
07/02/2014EP2750212A1 Light emitting device package, light emitting device using that package, and illumination device using the light emitting devices
07/02/2014EP2750193A2 Light emitting diode device
07/02/2014EP2750192A2 Light emitting diode device
07/02/2014EP2750189A1 Package on package device
07/02/2014EP2750188A2 Light-emitting module board and manufacturing method of the light-emitting module board
07/02/2014EP2750187A1 Semiconductor device and semiconductor device manufacturing method
07/02/2014EP2750184A1 Semiconductor module
07/02/2014EP2750173A2 Power semiconductor element bonded to a substrate by a Sn-Sb-Cu solder and manufacturing method therefor
07/02/2014EP2748871A1 Semiconductor light emitting device and method for manufacturing same
07/02/2014EP2748850A1 Packaging dram and soc in an ic package
07/02/2014CN203691259U 一种应用于直流屏的新型硅链 Applied to the new DC panel of silicon chain
07/02/2014CN203690340U 一种wfcob光源 One kind of light source wfcob
07/02/2014CN203690338U 一种混色双闪led灯 One kind of blending double flash led light
07/02/2014CN203690301U Led光源 Led light
07/02/2014CN203690300U 一种具有强化出光结构的多led芯片封装器件 An enhanced multi-light structure has led chip package devices
07/02/2014CN203690299U 插接式led荧光晶体片与led灯泡 Plug-led fluorescent crystal film and led bulb
07/02/2014CN203690298U 一种增加显色指数的led灯 An increased CRI led lights
07/02/2014CN203690297U 一种大功率多色cob集成封装结构 A multicolor cob integrated package of high-power
07/02/2014CN203690296U 一种大功率rgbw交叉混色cob集成封装结构 One kind of power rgbw cross mixing cob integrated package
07/02/2014CN203690295U 一种led灯及其支架底座 One kind of led lights and stand base
07/02/2014CN203690290U 无引线平面表贴式厚膜混合集成电路 Flat leadless surface mount thick film hybrid integrated circuits
07/02/2014CN203686726U 一种具有邦定式led的柔性条形灯 Flexible strip lights led a kind of bonding formula
07/02/2014CN103907184A 电力转换装置 Power conversion means
07/02/2014CN103907165A 功率模块、电力转换装置及电动车辆 Power module, the power conversion device and an electric vehicle
07/02/2014CN103904206A 半导体装置及其制造方法 Semiconductor device and manufacturing method thereof
07/02/2014CN103904204A 发光二极管灯条 Light-emitting diode
07/02/2014CN103904202A 一种用于制作led多芯片封装基板的方法及滚压刀具 A method for making a multi-chip package substrate led method and rolling tool
07/02/2014CN103904188A 发光二极管及其混光方法 Mixed light-emitting diode and method
07/02/2014CN103904185A 一种柔性led发光器件 A flexible led light-emitting devices
07/02/2014CN103904118A 具有存储器功能的场效应晶体管及其三维集成方法 The field effect transistor having a memory function and three-dimensional integrated approach
07/02/2014CN103904075A 光遮断器 Photo-interrupter
07/02/2014CN103904074A 电路和用于制造电路的方法 Circuit and a method for manufacturing the circuit
07/02/2014CN103904073A Led和oled集成照明模块 Led and oled integrated lighting module
07/02/2014CN103904072A 一种大功率led芯片集成封装结构 One kind of power led chip package structure
07/02/2014CN103904071A 一种透明基板led灯条的制造工艺 A transparent substrate manufacturing process led lights
07/02/2014CN103904070A 一种光棒及使用其的光源 An optical light source rods and use thereof
07/02/2014CN103904069A 一种固定于同一芯片上的双灯珠结构 A fixed structure Lamps beads on the same chip
07/02/2014CN103904068A 发光二极管发光装置 Light emitting diode device
07/02/2014CN103904067A 半导体装置 Semiconductor device
07/02/2014CN103904066A 一种倒装芯片堆叠封装结构及封装方法 A flip-chip stacked package structure and packaging method
07/02/2014CN103904064A 硅穿孔修补电路 Silicon perforation repair circuit
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