| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 03/03/2004 | EP1394856A2 Surface-mounted electronic component module and method for manufacturing the same |
| 03/03/2004 | EP1394734A1 Ic card |
| 03/03/2004 | EP1394557A2 Electronic apparatus |
| 03/03/2004 | EP1393432A1 Electron tunneling device |
| 03/03/2004 | EP1393384A1 ELECTROMAGNETIC RADIATION SENSING WITH SINGLE CRYSTAL SiC |
| 03/03/2004 | EP1393375A1 Contact system |
| 03/03/2004 | EP1393374A1 High power led module for spot illumination |
| 03/03/2004 | EP1393373A1 High power semiconductor module |
| 03/03/2004 | EP1393370A2 Electronic chip and electronic chip assembly |
| 03/03/2004 | EP1247250B1 Chipcard arrangement |
| 03/03/2004 | CN1479946A Light emitting or light receiving semiconductor module and method for manufacturing the same |
| 03/03/2004 | CN1479407A Semiconductor assembly structure combined with antenna |
| 03/03/2004 | CN1140933C Photoelectric element and method of producing same |
| 03/02/2004 | US6700794 Decoupling capacitor closely coupled with integrated circuit |
| 03/02/2004 | US6700793 Semiconductor device |
| 03/02/2004 | US6700790 Circuit board with integrated circuit |
| 03/02/2004 | US6700783 Three-dimensional stacked heat spreader assembly for electronic package and method for assembling |
| 03/02/2004 | US6700194 Semiconductor device |
| 03/02/2004 | US6700191 Electronic power circuit of several power modules |
| 03/02/2004 | US6700178 Package of a chip with beveled edges |
| 03/02/2004 | US6700136 Light emitting device package |
| 03/02/2004 | US6700073 Semiconductor device |
| 03/02/2004 | US6699787 Semiconductor device and method of production of same |
| 03/02/2004 | US6699730 Stacked microelectronic assembly and method therefor |
| 03/02/2004 | US6698084 Method for manufacturing radio frequency module components with surface acoustic wave element |
| 02/26/2004 | WO2004017495A1 Cooling body and rectifier module for an electrical machine |
| 02/26/2004 | WO2004017434A2 Laminated polymer with integrated lighting, sensors and electronics |
| 02/26/2004 | WO2004017429A1 Packaging structure for imaging detectors |
| 02/26/2004 | WO2004017410A1 Ferroelectric memory and its manufacturing method |
| 02/26/2004 | WO2004017406A1 Functional coating of an scfm preform |
| 02/26/2004 | WO2004017399A1 Microelectronic packages with self-aligning features |
| 02/26/2004 | WO2004016897A2 Laminated glass and structural glass with integrated lighting, sensors and electronics |
| 02/26/2004 | WO2003065454A3 Split-gate power module and method for suppressing oscillation therein |
| 02/26/2004 | WO2003010796B1 Structure and method for fabrication of a leadless chip carrier with embedded antenna |
| 02/26/2004 | US20040039999 Circuit design for a circuit for switching currents |
| 02/26/2004 | US20040038561 Method for electrically connecting a semiconductor component to an electrical subassembly |
| 02/26/2004 | US20040038519 Wiring method and element arranging method using the same, and method of production image display devices |
| 02/26/2004 | US20040038450 Method of forming a stack of packaged memory dice |
| 02/26/2004 | US20040038449 Polymer compositions that can be used to make plastic reflector articles having light reflecting surfaces such as for use in automobile tail and head lights; compositions comprise base polycarbonate polymer matrix and thermally-conductive carbon material |
| 02/26/2004 | US20040038447 Packaged microelectronic devices and methods for assembling microelectronic devices |
| 02/26/2004 | US20040037088 Replaceable LED lamp capsule |
| 02/26/2004 | US20040037076 Light emitting diode lamp and light emitting diode display unit |
| 02/26/2004 | US20040036734 Ink tank and ink jet recording apparatus provided with the same |
| 02/26/2004 | US20040036547 Surface-mount crystal oscillator |
| 02/26/2004 | US20040036368 Integrally formed rectifier for internal alternator regulator (IAR) style alternator |
| 02/26/2004 | US20040036182 Bond pad rerouting element and stacked semiconductor device assemblies including the rerouting element |
| 02/26/2004 | US20040036164 Semiconductor device and its manufacturing method |
| 02/26/2004 | US20040036163 Multi-die semiconductor package |
| 02/26/2004 | US20040036159 Integrated circuit having memory disposed thereon and method of making thereof |
| 02/26/2004 | US20040036157 Semiconductor component with on board capacitor and method of fabrication |
| 02/26/2004 | US20040036155 Memory package |
| 02/26/2004 | US20040036152 Integrated circuit package employing flip-chip technology and method of assembly |
| 02/26/2004 | US20040036074 Optical interconnection integrated circuit, method of manufacturing optical interconnection integrated circuit, electro-optical apparatus, and electronic apparatus |
| 02/26/2004 | US20040035460 Photovoltaic module with light reflecting backskin |
| 02/26/2004 | DE10324598A1 Halbleitervorrichtung Semiconductor device |
| 02/26/2004 | DE10236376A1 Träger für optoelektronische Bauelemente sowie optische Sendeeinrichtung und optische Empfangseinrichtung Carrier for optoelectronic devices and optical transmitting device and optical receiving device |
| 02/26/2004 | DE10121136B4 LED-Modul LED module |
| 02/25/2004 | EP1391924A1 Semiconductor device and its manufacturing method, circuit board, and electric apparatus |
| 02/25/2004 | EP1391923A1 Semiconductor device and its manufacturing method, circuit board and electronic apparatus |
| 02/25/2004 | CN1478249A Rectifying charge storing element |
| 02/25/2004 | CN1139997C Photoelectric element and method for mfg. same |
| 02/25/2004 | CN1139989C Semiconductor module and power converter using the same |
| 02/24/2004 | US6697257 Power semiconductor module |
| 02/24/2004 | US6696784 Light emitting diode module |
| 02/24/2004 | US6696765 Thermal stress resistance |
| 02/24/2004 | US6696755 Semiconductor device |
| 02/24/2004 | US6696754 Semiconductor module including a plurality of semiconductor devices detachably |
| 02/24/2004 | US6696751 Semiconductor device and portable device having a mounting region sharing point symmetry |
| 02/24/2004 | US6696714 Multichip semiconductor device having a hip with redundancy restoration fuse that affects a redundant memory array |
| 02/24/2004 | US6696704 Composite light-emitting device, semiconductor light-emitting unit and method for fabricating the unit |
| 02/24/2004 | US6696686 SPECT for breast cancer detection |
| 02/24/2004 | US6696320 Low profile stacked multi-chip package and method of forming same |
| 02/24/2004 | US6696318 Methods for forming a die package |
| 02/19/2004 | WO2004016055A1 An electronic product, a body and a method of manufacturing |
| 02/19/2004 | WO2004015775A1 Stacking substrate for at least one ic and system comprising such a substrate |
| 02/19/2004 | WO2004015774A1 Power circuit breaker |
| 02/19/2004 | WO2004015771A2 Semiconductor device and method of manufacturing the same |
| 02/19/2004 | WO2004015767A1 Heat dissipation device for integrated circuits |
| 02/19/2004 | WO2004015764A2 Vertical system integration |
| 02/19/2004 | WO2004015758A1 Semiconductor device and method for manufacturing the same |
| 02/19/2004 | WO2004015406A1 Method for determining the quality or functional capacity of a surfactant |
| 02/19/2004 | WO2004015335A2 Concentrating solar energy receiver |
| 02/19/2004 | WO2003098666A3 High-frequency power semiconductor module with a hollow housing and method for the production thereof |
| 02/19/2004 | WO2003065469A3 Power module |
| 02/19/2004 | WO2003065449A3 Power semiconductor, and method for producing the same |
| 02/19/2004 | WO2003028102A3 Modification of the function of a chip using a multi-chip housing |
| 02/19/2004 | WO2003026016A3 Image sensor with recessed planarizing layers and method for making same |
| 02/19/2004 | US20040033673 Method of packaging semiconductor dice employing at least one redistribution layer |
| 02/19/2004 | US20040033654 Semiconductor device and method of fabricating the same |
| 02/19/2004 | US20040032017 Structure and method of stacking multiple semiconductor substrates of a composite semiconductor device |
| 02/19/2004 | US20040032016 Multi chip package |
| 02/19/2004 | US20040032013 Semiconductor dice packages employing at least one redistribution layer and methods of fabrication |
| 02/19/2004 | US20040032011 Microelectronic assemblies incorporating inductors |
| 02/19/2004 | US20040031972 Stacked packages |
| 02/19/2004 | US20040031618 Radiation shielding of three dimensional multi-chip modules |
| 02/19/2004 | US20040031570 Apparatus for bonding a chip using an insulating adhesive tape |
| 02/19/2004 | US20040031545 Melting copper (Cu) and copper oxide (Cu2O) in a specified atmosphere of an oxygen partial pressure, and solidifying the same; Cu and Cu2O are dispersed with each other; plastic workability; use as heat-radiating board of a semiconductor |
| 02/19/2004 | US20040031517 Concentrating solar energy receiver |
| 02/19/2004 | DE20312598U1 Electrical signal light unit has light emitting diodes on the outer surface of a ring with a lens unit |
| 02/18/2004 | EP1389897A1 Printed circuit board, its manufacturing method, and csp manufacturing methdo |