| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 03/18/2004 | US20040051168 Semiconductor device and method for manufacturing the same |
| 03/18/2004 | US20040051119 Stacked semiconductor device and method of producing the same |
| 03/18/2004 | US20040051106 Light-emitting diode and method for the production thereof |
| 03/18/2004 | US20040051046 Highly sensitive imaging camera for space applications including detection of ultrahigh energy cosmic rays |
| 03/18/2004 | US20040051042 Acoustic absorption radiation sensing in SiC |
| 03/18/2004 | US20040050571 Semiconductor chip package having an adhesive tape attached on bonding wires |
| 03/18/2004 | US20040050414 Module battery |
| 03/17/2004 | EP1399005A2 Housing preform and electronic apparatus using the same |
| 03/17/2004 | EP1398832A2 Camera module for compact electronic equipments |
| 03/17/2004 | EP0885483A4 Push-pull power amplifier |
| 03/17/2004 | CN2606966Y Stacking type chip packaging body |
| 03/17/2004 | CN2606943Y Light-emitting diode dot matrix display module |
| 03/17/2004 | CN1483302A Carrier-based electronic module |
| 03/17/2004 | CN1483208A Method and apparatus for making semiconductor device and the semiconductor device |
| 03/17/2004 | CN1482677A Electronic element |
| 03/16/2004 | US6707691 Compact rectifier bridge and method for manufacturing the same |
| 03/16/2004 | US6707682 Low-EMI electronic apparatus, low-EMI circuit board, and method of manufacturing the low-EMI circuit board |
| 03/16/2004 | US6707681 Surface mount typed electronic circuit of small size capable of obtaining a high-Q |
| 03/16/2004 | US6707369 Power distributing box and power-device module |
| 03/16/2004 | US6707160 Semiconductor device using substrate having cubic structure and method of manufacturing the same |
| 03/16/2004 | US6707157 Three dimensional semiconductor integrated circuit device having a piercing electrode |
| 03/16/2004 | US6707143 Stacked semiconductor chips attached to a wiring board |
| 03/16/2004 | US6707142 Package stacked semiconductor device having pin linking means |
| 03/16/2004 | US6707141 Multi-chip module substrate for use with leads-over chip type semiconductor devices |
| 03/16/2004 | US6707140 Arrayable, scaleable, and stackable molded package configuration |
| 03/16/2004 | US6707069 Light emission diode package |
| 03/16/2004 | US6706971 Stackable microcircuit layer formed from a plastic encapsulated microcircuit |
| 03/16/2004 | US6706557 Method of fabricating stacked die configurations utilizing redistribution bond pads |
| 03/16/2004 | US6706547 Method of manufacturing a circuit device with trenches in a conductive foil |
| 03/16/2004 | US6706546 Optical reflective structures and method for making |
| 03/11/2004 | WO2004021459A1 White light emitting diode and its methode of making |
| 03/11/2004 | WO2003073040A3 Measurement method for determining a surface profile |
| 03/11/2004 | WO2003038865A3 Stacking multiple devices using direct soldering |
| 03/11/2004 | WO2003030245A3 Method for assembly of complementary-shaped receptacle site and device microstructures |
| 03/11/2004 | WO2003015153A3 Process to allow electrical and mechanical connection of an electrical device with a face equipped with contact pads |
| 03/11/2004 | US20040048459 Positioning circuit within electroconductive substrate; encapsulation |
| 03/11/2004 | US20040048417 Techniques for joining an opto-electronic module to a semiconductor package |
| 03/11/2004 | US20040047151 Optoelectronic component and method for the production thereof, module and device comprising a module of this type |
| 03/11/2004 | US20040047135 Electronic element |
| 03/11/2004 | US20040046263 Integrated circuit package employing flip-chip technology and method of assembly |
| 03/11/2004 | US20040046256 Semiconductor device and method of manufacturing semiconductor device including semiconductor elements mounted on base plate |
| 03/11/2004 | US20040046239 Stacked package for integrated circuits |
| 03/11/2004 | US20040046222 Light emitting device, display apparatus with an array of light emitting devices, and display apparatus method of manufacture |
| 03/11/2004 | US20040046005 Stack package and manufacturing method thereof |
| 03/11/2004 | US20040045595 Solar cell module-mounting structure and solar cell module array |
| 03/11/2004 | DE20319185U1 Kleine Stapel-Speicherkarte Small stack memory card |
| 03/11/2004 | DE20319173U1 Kleine Speicherkarte Small memory card |
| 03/11/2004 | DE10238812A1 Semiconductor memory device has fixed and alterable groups of contacts with adjustable contact region and corresponding semiconductor device |
| 03/10/2004 | EP1396885A1 Resin moulded automotive electronic control unit |
| 03/10/2004 | EP1396023A1 A method of producing a lamp |
| 03/10/2004 | CN2606457Y Super-miniature multichip active element integrated module with surface coat |
| 03/10/2004 | CN2606241Y High brightness position light of LED |
| 03/10/2004 | CN1481023A Multiple chips integrated module |
| 03/10/2004 | CN1481021A 半导体器件 Semiconductor devices |
| 03/09/2004 | US6704609 Multi-chip semiconductor module and manufacturing process thereof |
| 03/09/2004 | US6704201 Power feed and heat dissipating device for power semiconductor devices |
| 03/09/2004 | US6703868 Methods, apparatus, and systems for reducing interference on nearby conductors |
| 03/09/2004 | US6703713 Window-type multi-chip semiconductor package |
| 03/09/2004 | US6703703 Low cost power semiconductor module without substrate |
| 03/09/2004 | US6703699 Semiconductor device |
| 03/09/2004 | US6703651 Electronic device having stacked modules and method for producing it |
| 03/09/2004 | US6703560 Stress resistant land grid array (LGA) module and method of forming the same |
| 03/09/2004 | US6703310 Semiconductor device and method of production of same |
| 03/09/2004 | US6703261 Semiconductor device and manufacturing the same |
| 03/09/2004 | US6703075 Wafer treating method for making adhesive dies |
| 03/04/2004 | WO2004019657A2 Electronic assembly/system with reduced cost, mass, and volume and increased efficiency and power density |
| 03/04/2004 | WO2004019412A1 Silicon sub-mount capable of single wire bonding and of providing esd protection for light emitting diode devices |
| 03/04/2004 | WO2002099883A3 Electronic device and relative fabrication method |
| 03/04/2004 | WO2002091469A3 Three-dimensional electronic device and relative manufacture method |
| 03/04/2004 | US20040043732 Semiconductor device for radio communication device, and radio communication device using said semiconductor device |
| 03/04/2004 | US20040043603 Semiconductor component with backside contacts and method of fabrication |
| 03/04/2004 | US20040043535 Castellation wafer level packaging of integrated circuit chips |
| 03/04/2004 | US20040043534 Semiconductor device and manufacturing method thereof |
| 03/04/2004 | US20040042190 Multiple chip semiconductor package and method of fabricating same |
| 03/04/2004 | US20040042189 Multi-chip integrated module |
| 03/04/2004 | US20040042186 Surface-mounted electronic component module and method for manufacturing the same |
| 03/04/2004 | US20040042140 Double-sided thermally enhanced IC chip package |
| 03/04/2004 | US20040041580 Multichip module and testing method thereof |
| 03/04/2004 | US20040041521 Display device with molded light guide |
| 03/04/2004 | US20040041279 Electronic device package |
| 03/04/2004 | US20040041275 Semiconductor device mounting chip having tracing function |
| 03/04/2004 | US20040041260 Semiconductor component with backside contacts and method of fabrication |
| 03/04/2004 | US20040041258 Semiconductor chip having bond pads and multi-chip package |
| 03/04/2004 | US20040041256 Semiconductor device |
| 03/04/2004 | US20040041253 Electric power semiconductor device |
| 03/04/2004 | US20040041249 Stacked chip package with enhanced thermal conductivity |
| 03/04/2004 | US20040041246 Signal communication structures |
| 03/04/2004 | US20040041243 Thin film circuit board device and its manufacturing method |
| 03/04/2004 | US20040041201 Semiconductor device and capacitance regulation circuit |
| 03/04/2004 | US20040041165 Method for manufacturing light emitting diode devices |
| 03/04/2004 | US20040041164 Enhanced light extraction in leds through the use of internal and external optical elements |
| 03/04/2004 | US20040040743 Multilayer modules with flexible substrates |
| 03/04/2004 | US20040040648 Method for replicating optical elements, particularly on a wafer level, and replicas formed thereby |
| 03/04/2004 | US20040040592 Detector structure; narrow metallic tracks |
| 03/04/2004 | US20040040144 Integrally formed rectifier for internal alternator regulator (IAR) style alternator |
| 03/04/2004 | DE10332132A1 Halbleiterbaugruppe vom Stapeltyp mit einer oder mehrerer darin gestapelter Halbleiterbaugruppen Semiconductor package stack type with one or more is stacked semiconductor packages |
| 03/04/2004 | DE10296619T5 Leistungsmodul Power module |
| 03/04/2004 | DE10011005B4 Multichip module and method for producing a multichip module |
| 03/04/2004 | CA2497583A1 Electronic assembly/system with reduced cost, mass, and volume and increased efficiency and power density |
| 03/03/2004 | EP1394857A2 Semiconductor device |