| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 04/01/2004 | US20040061213 Semiconductor multi-package module having package stacked over die-up flip chip ball grid array package and having wire bond interconnect between stacked packages |
| 04/01/2004 | US20040061212 Semiconductor multi-package module having wire bond interconnect between stacked packages |
| 04/01/2004 | US20040061211 Semiconductor package |
| 04/01/2004 | US20040061203 Semiconductor device |
| 04/01/2004 | US20040061146 Multi-chip semiconductor package and fabrication method thereof |
| 04/01/2004 | US20040061138 Power semiconductor device with high radiating efficiency |
| 04/01/2004 | US20040060732 Multichip module having chips on two sides |
| 04/01/2004 | US20040060645 Forming folded-stack packaged device using progressive folding tool |
| 04/01/2004 | US20040060195 Methods and systems for processing a substrate using a dynamic Liquid meniscus |
| 04/01/2004 | DE20319650U1 Flexible array of LEDs for creating illuminating surfaces by cutting circuit board into shape as needed |
| 04/01/2004 | DE10244664A1 Elektronisches Bauteil mit Halbleiterchips in einem Stapel und Verfahren zur Herstellung desselben The same electronic device having the semiconductor chip in a stack and method for producing |
| 04/01/2004 | DE10244446A1 Halbleiterchip oder Halbleiterchipstapel Semiconductor chip or semiconductor chip stack |
| 04/01/2004 | DE10243981A1 Elektronische Baueinheit, insbesondere Regler für Generatoren in Kraftfahrzeugen The electronic package, in particular regulator for generators in motor vehicles |
| 04/01/2004 | DE10243421A1 Scheinwerfer mit pyramidenstumpfförmigen Reflektorstrukturen Headlamps with truncated pyramidal reflector structures |
| 03/31/2004 | EP1403923A1 Press pack power semiconductor module |
| 03/31/2004 | EP1403921A2 Electronic device with stacked semiconductor chips and associated manufacturing process |
| 03/31/2004 | EP1403135A2 Lighting device in particular for a vehicle |
| 03/31/2004 | EP1402575A2 Vertically contacted stacked chips |
| 03/31/2004 | EP1402572A1 Method for producing miniature amplifier and signal processing unit |
| 03/31/2004 | CN2609188Y Power module with flat packaged structure |
| 03/31/2004 | CN2608825Y LED general illuminous lamp bulb |
| 03/31/2004 | CN1485963A Semiconductor device and method for fabricating the same |
| 03/31/2004 | CN1485933A Manufacturing method of light emitting diode bulb and its structure |
| 03/31/2004 | CN1485914A Window opening type multi-chip semiconductor package |
| 03/31/2004 | CN1485913A Multichip module and testing method thereof |
| 03/31/2004 | CN1485884A Method for fabricating semiconductor device |
| 03/31/2004 | CN1144093C Camera having flexible printed circuit board |
| 03/30/2004 | US6714625 Lithography device for semiconductor circuit pattern generation |
| 03/30/2004 | US6714422 High frequency module device and method for its preparation |
| 03/30/2004 | US6714418 Method for producing an electronic component having a plurality of chips that are stacked one above the other and contact-connected to one another |
| 03/30/2004 | US6714414 Spring spacer assemblies for maintaining electrical components in contact with thermal transfer surfaces |
| 03/30/2004 | US6713898 Internal reactor thyristor stack |
| 03/30/2004 | US6713876 Optical semiconductor housing and method for making same |
| 03/30/2004 | US6713865 Semiconductor device having semiconductor element housed in packed with heat sink |
| 03/30/2004 | US6713857 Low profile stacked multi-chip semiconductor package with chip carrier having opening and fabrication method of the semiconductor package |
| 03/30/2004 | US6713856 Stacked chip package with enhanced thermal conductivity |
| 03/30/2004 | US6713854 Electronic circuit module with a carrier having a mounting pad array |
| 03/30/2004 | US6713844 Semiconductor-chip mounting substrate having at least one projection thereon and a pressure holding means |
| 03/30/2004 | US6713788 Opto-electric mounting apparatus |
| 03/30/2004 | US6713762 Acoustic absorption electromagnetic radiation sensing with SIC |
| 03/30/2004 | US6713327 Stress controlled dielectric integrated circuit fabrication |
| 03/25/2004 | WO2004025708A2 Support plate for semiconductor components |
| 03/25/2004 | WO2004025699A2 Assemblies having stacked semiconductor chips |
| 03/25/2004 | WO2004025695A2 Semiconductor device with wire bond inductor and method |
| 03/25/2004 | WO2004025694A2 .electromagnetic radiation sensing device with integrated housing including two superimposed sensors |
| 03/25/2004 | WO2004025474A1 A memory circuit comprising a non-volatile ram and a ram |
| 03/25/2004 | US20040058474 Semiconductor chip module and method of manufacture of same |
| 03/25/2004 | US20040058472 Area array semiconductor package and 3-dimensional stack thereof |
| 03/25/2004 | US20040057215 Electronic component, in particular regulator for generators in motor vehicles |
| 03/25/2004 | US20040056363 Semiconductor device and a method of manufacturing the same |
| 03/25/2004 | US20040056349 Circuit board |
| 03/25/2004 | US20040056347 Semiconductor chip module and method of manufacture of same |
| 03/25/2004 | US20040056346 Power module with improved transient thermal impedance |
| 03/25/2004 | US20040056344 Multi-chip circuit module and method for producing the same |
| 03/25/2004 | US20040056342 Stacked die module and techniques for forming a stacked die module |
| 03/25/2004 | US20040056341 Semiconductor device, semiconductor package member, and semiconductor device manufacturing method |
| 03/25/2004 | US20040056277 Semiconductor multi-package module including stacked-die package and having wire bond interconnect between stacked packages |
| 03/25/2004 | US20040056268 Semiconductor device and method for fabricating the same |
| 03/25/2004 | US20040056265 Optical and electro-optical apparatus comprising multicolor emitters in layouts to improve light/illumination efficiency |
| 03/25/2004 | US20040056262 Optical excitation/detection device and method for making same using discrete photoemitter devices |
| 03/25/2004 | US20040056104 Electronic device and method of manufacturing the same |
| 03/25/2004 | US20040055783 Automotive electronic control unit |
| 03/25/2004 | DE10249712B3 Circuit for monitoring power semiconducting components has each isolated contact surface/group connected via active and/or passive component(s) to star circuit(s) star point, external contact surface |
| 03/24/2004 | EP1401020A1 Semiconductor device and manufacturing method thereof |
| 03/24/2004 | EP1401019A2 Electronic device, especially regulator for generators in engine driven vehicles |
| 03/24/2004 | EP1400747A2 Projector with frustopyramidal reflector structures |
| 03/24/2004 | EP1399963A2 High temperature electrostatic chuck |
| 03/24/2004 | EP1399955A1 Method for preparing low dielectric films |
| 03/24/2004 | EP1399953A1 Opto-electronic device integration |
| 03/24/2004 | EP1399952A1 Opto-electronic device integration |
| 03/24/2004 | EP0976161A4 Optoelectronic semiconductor diodes and devices comprising same |
| 03/24/2004 | CN2607667Y Stacked light emitting diode body |
| 03/24/2004 | CN1484308A Open type multi-chip stacking package unit |
| 03/24/2004 | CN1143154C Optomodule |
| 03/23/2004 | US6710794 Light print head |
| 03/23/2004 | US6710455 Space-efficient; printed circuits; logic modules |
| 03/23/2004 | US6710454 Adhesive layer for an electronic apparatus having multiple semiconductor devices |
| 03/23/2004 | US6710439 Three-dimensional power semiconductor module and method of manufacturing the same |
| 03/23/2004 | US6710437 Semiconductor device having a chip-size package |
| 03/23/2004 | US6710436 Method and apparatus for electrostatically aligning integrated circuits |
| 03/23/2004 | US6710435 Semiconductor device arrangement and method of fabricating the same |
| 03/23/2004 | US6710433 Leadless chip carrier with embedded inductor |
| 03/23/2004 | US6710426 Semiconductor device and transceiver apparatus |
| 03/23/2004 | US6710246 Apparatus and method of manufacturing a stackable package for a semiconductor device |
| 03/23/2004 | US6709949 Method for aligning structures on a semiconductor substrate |
| 03/23/2004 | US6709894 Semiconductor package and method for fabricating the same |
| 03/23/2004 | US6709890 Method of manufacturing semiconductor integrated circuit device |
| 03/23/2004 | US6709132 LED bulb |
| 03/23/2004 | CA2251424C Light emitting diode 360.degree. warning lamp |
| 03/18/2004 | WO2004023568A1 Light-emitting device having light-emitting elements |
| 03/18/2004 | WO2004023546A1 Methods of making microelectronic packages including folded substrates |
| 03/18/2004 | WO2004008532A3 High power mcm package |
| 03/18/2004 | WO2003090256A3 Method and apparatus for connecting vertically stacked integrated circuit chips |
| 03/18/2004 | WO2003067669A3 Solar power devices for providing power to handheld devices |
| 03/18/2004 | WO2003034495A3 Method for packing electronic modules and multiple chip packaging |
| 03/18/2004 | WO2003030252B1 Process for producing interconnects |
| 03/18/2004 | US20040053444 Manufacturing method of a semiconductor device incorporating a passive element and a redistribution board |
| 03/18/2004 | US20040053442 Semiconductor package with stacked substrates and multiple semiconductor dice |
| 03/18/2004 | US20040052060 Low profile chip scale stacking system and method |
| 03/18/2004 | US20040051170 Semiconductor device and method of manufacturing the same |