| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
|---|
| 04/14/2004 | EP1408347A1 Radiation detector, radiation detector element, and radiation imaging apparatus |
| 04/14/2004 | EP1407641A2 Structure and method for fabrication of a leadless multi-die carrier |
| 04/14/2004 | EP1407491A2 Mixed analog and digital integrated circuits |
| 04/14/2004 | EP1407490A2 Single package containing multiple integrated circuit devices |
| 04/14/2004 | EP0878025B1 Semiconductor device with a high-frequency bipolar transistor on an insulating substrate |
| 04/14/2004 | CN2612075Y Package structure for LED |
| 04/14/2004 | CN1489884A High frequency circuit block member, its manufacturing method, high refrequency module device and its manufaturing method |
| 04/14/2004 | CN1489788A Unmolded package for semiconductor device |
| 04/14/2004 | CN1489429A Method for manufacturing circuit board and communication device |
| 04/14/2004 | CN1489206A 集成电路芯片组件 IC chip assembly |
| 04/14/2004 | CN1489202A Electronic device module |
| 04/14/2004 | CN1489201A 半导体器件 Semiconductor devices |
| 04/14/2004 | CN1146105C Component working with acoustic surface wave |
| 04/14/2004 | CN1146043C Via structure |
| 04/14/2004 | CN1146039C Scaleable integrated data processing device |
| 04/14/2004 | CN1146029C Electronic component and mobile communication device comprising same |
| 04/13/2004 | US6721196 Semiconductor memory chip module |
| 04/13/2004 | US6720737 LED illumination structure |
| 04/13/2004 | US6720730 High power led lamp |
| 04/13/2004 | US6720661 Semiconductor device, method of fabricating the same, stack-type semiconductor device, circuit board and electronic instrument |
| 04/13/2004 | US6720646 Power converter with improved lead frame arrangement including stand-up portion |
| 04/13/2004 | US6720643 Stacked semiconductor module |
| 04/13/2004 | US6720574 Method of testing a semiconductor chip |
| 04/13/2004 | US6720493 Radiation shielding of integrated circuits and multi-chip modules in ceramic and metal packages |
| 04/13/2004 | US6720208 Semiconductor device |
| 04/13/2004 | US6720203 Flexible organic electronic device with improved resistance to oxygen and moisture degradation |
| 04/13/2004 | US6719884 Tuning a band-gap by intermixing an impurity with one quantum well in the at least two areas to different values; copper or a copper alloy impurity; high-speed diffusion; dopes |
| 04/13/2004 | US6719446 Semiconductor light source for providing visible light to illuminate a physical space |
| 04/08/2004 | WO2004030109A1 Luminescent material, especially for led application |
| 04/08/2004 | WO2004030093A1 Press pack power semiconductor module |
| 04/08/2004 | WO2004030092A1 Semiconductor chip on which conductor tracks on a (1,0,0) crystal plane form an angle of at least ten degrees with the (0,1,0) and (0,0,1) crystal planes in order to increase the fracture resistance |
| 04/08/2004 | WO2004028748A2 Clamping assembly for high-voltage solid state devices |
| 04/08/2004 | WO2004010756A3 Surface-mountable component and method for the production thereof |
| 04/08/2004 | WO2003107421A3 Semi-conductor component |
| 04/08/2004 | WO2003103042A3 Electronic component comprising external surface contacts and a method for producing the same |
| 04/08/2004 | WO2003100827A3 Organic semiconductor device and method |
| 04/08/2004 | WO2003096414A3 Power supply component assembly on a printed circuit and method for obtaining same |
| 04/08/2004 | WO2003085738A3 Power module comprising two substrates and method for producing the same |
| 04/08/2004 | WO2003065450A3 Integrated circuits with backside contacts and methods for their fabrication |
| 04/08/2004 | WO2002050907B1 Interconnection of active and passive components in substrate |
| 04/08/2004 | US20040068703 Method of manufacturing circuit device |
| 04/08/2004 | US20040067606 Method for stack-packaging integrated circuit die using at least one die in the package as a spacer |
| 04/08/2004 | US20040067605 Semiconductor device having additional functional element and method of manufacturing thereof |
| 04/08/2004 | US20040066638 Multilayered hybrid electronic module |
| 04/08/2004 | US20040066634 Multilayer wiring board, manufacturing method therefor and test apparatus thereof |
| 04/08/2004 | US20040066617 Circuit board device and its manufacturing method |
| 04/08/2004 | US20040066307 Light-emitting device array |
| 04/08/2004 | US20040066249 Scalable computer system having surface-mounted capacitive couplers for intercommunication |
| 04/08/2004 | US20040066102 Apparatus and method for heat sink device |
| 04/08/2004 | US20040065963 Semiconductor multi-package module having wire bond interconnect between stacked packages and having electrical shield |
| 04/08/2004 | US20040065962 Integrated circuit chip module |
| 04/08/2004 | US20040065951 Multi chip module |
| 04/08/2004 | US20040065894 Light emitting device using led |
| 04/08/2004 | DE19625240B4 Halbleitervorrichtung Semiconductor device |
| 04/08/2004 | DE10338087A1 Production of an electronic switching arrangement for vehicles, comprises applying a switching structure to a base, connecting wires to the base, electrically connecting the wires with the switching structure, and further processing |
| 04/08/2004 | DE10245945A1 Lichtquellenmodul sowie Verfahren zu dessen Herstellung Light source module and method for its production |
| 04/08/2004 | DE10245933A1 Einrichtung zur Erzeugung eines gebündelten Lichtstroms Means for generating a bundled light flux |
| 04/07/2004 | EP1406302A1 Semiconductor device and semiconductor module |
| 04/07/2004 | EP1405377A2 Led-module for illuminating devices |
| 04/07/2004 | EP1405352A1 Substrate for an electroluminescent display device and method of manufacturing said substrate |
| 04/07/2004 | EP1405343A2 Multichip module fabricated on a semiconductor or dieletric wafer and method for manufacturing same |
| 04/07/2004 | EP1404224A1 Medical x-ray device and power module therefor |
| 04/07/2004 | CN2610555Y Three-phase integrated rectifier |
| 04/07/2004 | CN1488163A Method for manufacturing optical devices and related improvements |
| 04/07/2004 | CN1487586A Semiconductor apparatus and processing system utilizing the same semiconductor apparatus |
| 04/07/2004 | CN1487584A Great power device and its heat sink pressure-mounting method |
| 04/07/2004 | CN1145211C Polycrystal chip semiconductor package structure |
| 04/06/2004 | US6717819 Solderable flexible adhesive interposer as for an electronic package, and method for making same |
| 04/06/2004 | US6717812 Apparatus and method for fluid-based cooling of heat-generating devices |
| 04/06/2004 | US6717275 Semiconductor module |
| 04/06/2004 | US6717258 Power semiconductor device |
| 04/06/2004 | US6717253 Assembly package with stacked dies and signal transmission plate |
| 04/06/2004 | US6717252 Semiconductor device |
| 04/06/2004 | US6717251 Stacked type semiconductor device |
| 04/06/2004 | US6717250 Stacked semiconductor apparatus and electronic device including stacked semiconductor apparatus |
| 04/06/2004 | US6717249 Non-contact type IC card and process for manufacturing-same |
| 04/06/2004 | US6717248 Semiconductor package and method for fabricating the same |
| 04/06/2004 | US6717244 Semiconductor device having a primary chip with bumps in joined registration with bumps of a plurality of secondary chips |
| 04/06/2004 | US6717149 Compact detection device for a gamma camera |
| 04/06/2004 | US6717061 Stacking of multilayer modules |
| 04/06/2004 | US6716676 Thermally-enhanced stacked-die ball grid array semiconductor package and method of fabricating the same |
| 04/06/2004 | US6716672 Three dimensional interconnection method and electronic device obtained by same |
| 04/06/2004 | US6716670 Method of forming a three-dimensional stacked semiconductor package device |
| 04/06/2004 | US6716669 High-density interconnection of temperature sensitive electronic devices |
| 04/01/2004 | WO2004027966A1 Snubber module and power conversion device |
| 04/01/2004 | WO2004027823A2 Semiconductor multi-package module having wire bond interconnection between stacked packages |
| 04/01/2004 | WO2004003991A3 Electronic component with a housing packaging |
| 04/01/2004 | US20040063340 Multilayer wiring board, manufacturing method therefor and test apparatus thereof |
| 04/01/2004 | US20040063304 Electronic component with a stack of semiconductor chips and a method for producing the electronic component |
| 04/01/2004 | US20040063268 Manufacturing method of semiconductor device |
| 04/01/2004 | US20040063248 Multiple chip stack structure and cooling system |
| 04/01/2004 | US20040063247 Semiconductor device and method for manufacturing the same |
| 04/01/2004 | US20040063246 Semiconductor multi-package module having package stacked over die-down flip chip ball grid array package and having wire bond interconnect between stacked packages |
| 04/01/2004 | US20040063245 Method of fabricating an electronic component |
| 04/01/2004 | US20040063243 Method of manufacturing an electronic device |
| 04/01/2004 | US20040063242 Semiconductor multi-package module having package stacked over ball grid array package and having wire bond interconnect between stacked packages |
| 04/01/2004 | US20040063233 Method for fabricating semiconductor device |
| 04/01/2004 | US20040061238 Semiconductor device and method of manufacturing the same |
| 04/01/2004 | US20040061224 Spherical semiconductor device and method for fabricating the same |
| 04/01/2004 | US20040061221 High power MCM package |