| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 04/28/2004 | CN1492483A Method for producing self assembling microstructure |
| 04/28/2004 | CN1147933C Process for producing high speed and high-capacity flash solid memory |
| 04/28/2004 | CN1147930C Semi-conductor package structure and mfg. method thereof |
| 04/28/2004 | CN1147792C Signalnig improvement using extended transmission lines on high speed DIMMS |
| 04/27/2004 | US6728904 Electronic circuit package |
| 04/27/2004 | US6728113 Method and apparatus for non-conductively interconnecting integrated circuits |
| 04/27/2004 | US6727766 Oscillator with dielectric resonator and electronic apparatus using the same |
| 04/27/2004 | US6727584 Semiconductor module |
| 04/27/2004 | US6727583 Semiconductor device |
| 04/27/2004 | US6727582 Semiconductor device |
| 04/27/2004 | US6727581 Semiconductor module |
| 04/27/2004 | US6727579 Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structures |
| 04/27/2004 | US6727575 Semiconductor device |
| 04/27/2004 | US6727574 Sealed plurality of chips stacked on surface of die pad with exposed surface; high speed, accuracy |
| 04/27/2004 | US6727533 Semiconductor apparatus having a large-size bus connection |
| 04/27/2004 | US6727118 Power distribution design method for stacked flip-chip packages |
| 04/27/2004 | US6727116 Semiconductor devices including peripherally located bond pads, assemblies, packages, and methods |
| 04/27/2004 | US6727114 Semiconductor device and a method of manufacturing the same |
| 04/22/2004 | WO2004034761A1 Electronic substrate of a three-dimensional electronic module |
| 04/22/2004 | WO2004034575A1 Semiconductor device |
| 04/22/2004 | WO2004034459A2 Method for producing a thinned down stack of chips |
| 04/22/2004 | WO2004034434A2 Components, methods and assemblies for multi-chip packages |
| 04/22/2004 | WO2004034433A2 Semiconductor stacked multi-package module having inverted second package |
| 04/22/2004 | WO2004034428A2 Semiconductor device package |
| 04/22/2004 | WO2004034240A2 A scalable computer system having surface-mounted capacitive couplers for intercommunication |
| 04/22/2004 | WO2004025694A3 .electromagnetic radiation sensing device with integrated housing including two superimposed sensors |
| 04/22/2004 | WO2004015335A3 Concentrating solar energy receiver |
| 04/22/2004 | WO2003085703A3 Electronic component having at least one semiconductor chip and flip-chip contacts, and method for the production thereof |
| 04/22/2004 | WO2003075348A3 Stacked die semiconductor device |
| 04/22/2004 | WO2003071596A3 Electronic component with an adhesive layer and method for the production thereof |
| 04/22/2004 | US20040077124 High-frequency circuit block, its manufacturing method, high-frequency module device, and its manufacturing method |
| 04/22/2004 | US20040075985 Power component assembly for mechatronic integration of power components |
| 04/22/2004 | US20040075515 Semiconductor device, and method and apparatus for manufacturing semiconductor device |
| 04/22/2004 | US20040075491 High-frequency wave composite switch module and mobile body communication device using the same |
| 04/22/2004 | US20040075399 LED light engine for AC operation and methods of fabricating same |
| 04/22/2004 | US20040075176 Packaged semiconductor device |
| 04/22/2004 | US20040075171 Decoupling capacitor closely coupled with integrated circuit |
| 04/22/2004 | US20040075169 Electrical and electronic apparatus having P-type transistors and diodes, supported on terminal frames, so that the drain and cathode have a common potential |
| 04/22/2004 | US20040075101 Mounted on a lead frame; a curvature of the lateral direction of an envelope is < a curvature of the vertical direction |
| 04/22/2004 | DE10341560A1 Leistungs-Halbleitervorrichtung Power semiconductor device |
| 04/22/2004 | DE10327926A1 Schaltungsintegriertes Mikromodul Integrated circuit Micromodule |
| 04/22/2004 | DE10325013A1 Verfahren zum Regenerieren eines photovoltaischen Moduls und photovoltaisches Modul A method for regenerating a photovoltaic module and the photovoltaic module |
| 04/22/2004 | DE10312238A1 Leistungshalbleitereinrichtung Power semiconductor device |
| 04/22/2004 | DE10300759A1 High power switching combination formed from bipolar semiconductor and power field effect transistor, employs silicon-silicon bonding technology |
| 04/22/2004 | DE10196942T5 Halbleiter-Leistungsmodul Semiconductor power module |
| 04/21/2004 | EP1411551A1 Stacked semiconductor module and assembling method of the same |
| 04/21/2004 | EP1411549A1 Semiconductor power module with electrically conducting carbon nanotubes |
| 04/21/2004 | EP1410447A2 Extendible drain members for grounding rfi/emi shielding |
| 04/21/2004 | EP1410424A1 Opto-electronic device integration |
| 04/21/2004 | CN2613048Y Composite structure of dot matrix LED |
| 04/21/2004 | CN2613047Y Stacking packaging assembly for integrated circuit |
| 04/21/2004 | CN2613046Y 芯片封装结构 Chip package structure |
| 04/21/2004 | CN1491448A Circuit board device and its manufacturing mehtod |
| 04/21/2004 | CN1491440A Hybrid integrated circuit device and method for fabricating the same and electronic device |
| 04/21/2004 | CN1491439A Multi-chip circuit module and method for producing the same |
| 04/21/2004 | CN1491436A Chip transfer method and apparatus |
| 04/21/2004 | CN1490875A Semiconductor device and producing method thereof |
| 04/21/2004 | CN1490874A Laminated semiconductor devices |
| 04/21/2004 | CN1146994C Semiconductor device |
| 04/21/2004 | CN1146993C Surface electroluminescent lamp and liquid crystal display device disposed surface electroluminuscent lamp |
| 04/21/2004 | CN1146990C High-frequency integrated circuit device and mfr. method thereof |
| 04/20/2004 | US6724794 Opto-electronic device integration |
| 04/20/2004 | US6724638 Printed wiring board and method of producing the same |
| 04/20/2004 | US6724630 Stacked device assembly |
| 04/20/2004 | US6724237 Semiconductor integrated circuit for multi-chip package with means to optimize internal drive capacity |
| 04/20/2004 | US6724090 Multi-chip package and method for manufacturing the same |
| 04/20/2004 | US6724084 Semiconductor chip and production thereof, and semiconductor device having semiconductor chip bonded to solid device |
| 04/20/2004 | US6724074 Stack semiconductor chip package and lead frame |
| 04/20/2004 | US6723585 Leadless package |
| 04/20/2004 | US6722028 Method of making electronic device |
| 04/15/2004 | WO2004032571A2 Light source module comprising light emitting diodes and method for production thereof |
| 04/15/2004 | WO2004032253A1 Light-emitting member and lighting lamp using same |
| 04/15/2004 | WO2004032251A1 White light emitting device |
| 04/15/2004 | WO2004032235A2 Device for producing a bundled light flux |
| 04/15/2004 | WO2004032206A1 Forming folded-stack packaged device using progressive folding tool |
| 04/15/2004 | WO2004032160A2 Methods and systems for processing a substrate using a dynamic liquid meniscus |
| 04/15/2004 | WO2004031844A1 Illumination device for backlighting an image reproduction device |
| 04/15/2004 | WO2004001814A3 Method of forming a raised contact for a substrate |
| 04/15/2004 | WO2003065472A3 Structures and materials for dye sensitized solar cells |
| 04/15/2004 | WO2003007663A9 Micro-lens arrays for display intensity enhancement |
| 04/15/2004 | US20040072456 Methods of removably mounting electronic components to a circuit board, and sockets formed by the methods |
| 04/15/2004 | US20040072413 Semiconductor device and method of manufacturing the same, circuit board and electronic instrument |
| 04/15/2004 | US20040070950 Voltage conversion module |
| 04/15/2004 | US20040070948 Cavity-down ball grid array semiconductor package with heat spreader |
| 04/15/2004 | US20040070697 Method of forming an active matrix display |
| 04/15/2004 | US20040070333 Full-color display divice |
| 04/15/2004 | US20040070083 Stacked flip-chip package |
| 04/15/2004 | US20040070080 Low cost, high performance flip chip package structure |
| 04/15/2004 | US20040070074 Hybrid integrated circuit device |
| 04/15/2004 | US20040070066 Power semiconductor device |
| 04/15/2004 | US20040070064 Semiconductor device and fabrication method of the same |
| 04/15/2004 | US20040069326 Edge roller having mounted on it a proximity head capable of forming a meniscus and including a concave portion with ports opening into it including a process liquid injection port, a vacuum port and a surface tension control port |
| 04/15/2004 | US20040068869 Mounting spring elements on semiconductor devices, and wafer-level testing methodology |
| 04/15/2004 | US20040068864 Web fabrication of devices |
| 04/15/2004 | DE10322745A1 Leistungshalbleiter-Bauelement mit hoher Abstrahlungseffizienz Power semiconductor device having high radiation efficiency |
| 04/15/2004 | DE10296523T5 LDMOS-Transistor und Leistungsverstärker mit einer gemeinsam genutzten Erdungsebene LDMOS transistor and power amplifier having a shared ground plane |
| 04/15/2004 | DE10295972T5 Nicht in einer Form hergestellte Packung für eine Halbleiteranordnung Not manufactured in a mold package for a semiconductor device |
| 04/15/2004 | DE10244791A1 Electronic power component cooling device, has heat-sink provided with metal-filled channels for conducting signals of component to external environment |
| 04/15/2004 | DE10232052A1 Heat sink for rectifier unit for electrical machine e.g. 3-phase generator for automobile, with air flow openings spaced around diode boundary surface in heat sink |
| 04/15/2004 | DE10192788T5 Verfahren und Vorrichtung zur Kantenverbindung zwischen Elementen einer integrierten Schaltung Method and device for edge connection between elements of an integrated circuit |