| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 05/11/2004 | US6734556 Semiconductor device with chip-on-chip construction joined via a low-melting point metal layer |
| 05/11/2004 | US6734553 Semiconductor device |
| 05/11/2004 | US6734551 Semiconductor device |
| 05/11/2004 | US6734543 Module housing and power semiconductor module |
| 05/11/2004 | US6734541 Semiconductor laminated module |
| 05/11/2004 | US6734539 Stacked module package |
| 05/11/2004 | US6734538 Article comprising a multi-layer electronic package and method therefor |
| 05/11/2004 | US6734529 Vertically mountable interposer and assembly |
| 05/11/2004 | US6734497 Insulated gate bipolar transistor, semiconductor device, method of manufacturing insulated-gate bipolar transistor, and method of manufacturing semiconductor device |
| 05/11/2004 | US6734474 Integrated semiconductor circuit having contact points and configuration having at least two such circuits |
| 05/11/2004 | US6734370 Multilayer modules with flexible substrates |
| 05/11/2004 | US6734111 Method to GaAs based lasers and a GaAs based laser |
| 05/11/2004 | US6734042 Semiconductor device and method for fabricating the same |
| 05/11/2004 | US6734041 Semiconductor chip module and method for manufacturing the same |
| 05/11/2004 | US6733156 Light-emitting diode illuminated light-emitting |
| 05/11/2004 | US6732428 Method for increasing electronic component density on an electronic circuit board |
| 05/11/2004 | CA2274785C A chip module and process for the production thereof |
| 05/06/2004 | WO2004038895A1 Rectifier of ac generator for vehicle and method for manufacturing the same |
| 05/06/2004 | WO2004038801A2 Light emitting diode assembly for ac operation and methods of fabricating same |
| 05/06/2004 | WO2004038798A2 Stacked electronic structures including offset substrates |
| 05/06/2004 | WO2004038759A2 Method and apparatus for using light emitting diodes |
| 05/06/2004 | WO2004006301A3 Apparatus, system, and method of diagnosing individual photovoltaic cells |
| 05/06/2004 | WO2003079435A3 Microwave monolithic integrated circuit assembly with multi-orientation pyrolytic graphite heat-dissipating assembly |
| 05/06/2004 | WO2003010796A8 Structure and method for fabrication of a leadless chip carrier with embedded antenna |
| 05/06/2004 | US20040088416 Printed circuit board and method manufacturing the same |
| 05/06/2004 | US20040087055 Semiconductor device and method of making same |
| 05/06/2004 | US20040085796 System-in-package type semiconductor device |
| 05/06/2004 | US20040085292 Head-mounted display system |
| 05/06/2004 | US20040085017 Variable LED display panel |
| 05/06/2004 | US20040084781 Compact system module with built-in thermoelectric cooling |
| 05/06/2004 | US20040084771 Methods and apparatus for a thin stacked ball-grid array package |
| 05/06/2004 | US20040084760 Multichip module and manufacturing method |
| 05/06/2004 | US20040084759 Housing preform and electronic apparatus using the same |
| 05/06/2004 | US20040084756 Electronic circuit device and manufacturing method thereof |
| 05/06/2004 | US20040084681 Radiation emitter device having an integral micro-groove lens |
| 05/06/2004 | US20040084078 Solar cell module and edge face sealing member for same |
| 05/06/2004 | US20040084077 Solar collector having an array of photovoltaic cells oriented to receive reflected light |
| 05/06/2004 | EP1416542A1 Improved solar cell |
| 05/06/2004 | EP1416219A1 Led illuminator and card type led illuminating light source |
| 05/06/2004 | EP1415345A2 Multichip led package with in-package quantitative and spectral sensing capability and digital signal output |
| 05/06/2004 | DE10248644A1 Leistungshalbleitermodul The power semiconductor module |
| 05/06/2004 | DE10246728B3 Verfahren zur Herstellung gedünnter Chipstapel zB für den Einsatz in einer Chipkarte A process for producing thinned chip pile, for example, for use in a smart card |
| 05/06/2004 | CA2501686A1 Light emitting diode assembly for ac operation and methods of fabricating same |
| 05/05/2004 | CN1494149A Electronic apparatus |
| 05/05/2004 | CN1494148A Multi chip semi-conductor package and its manufacturing method |
| 05/05/2004 | CN1494143A Semiconductor device and its mfg. method, circuidboard, electronic device and apparatus for mfg. semiconductor device |
| 05/05/2004 | CN1494142A Lead wire, resin closed semiconductor device and its mfg. method |
| 05/05/2004 | CN1494139A Camera assembly for small electronic apparatus |
| 05/05/2004 | CN1494109A Circuit apparatus mfg. method |
| 05/05/2004 | CN1148804C Highly integrated chip-on-chip packaging |
| 05/04/2004 | US6731665 Laser arrays for high power fiber amplifier pumps |
| 05/04/2004 | US6731514 Stackable module |
| 05/04/2004 | US6731353 Method and apparatus for transferring blocks |
| 05/04/2004 | US6731031 Apparatus and method for heat sink device |
| 05/04/2004 | US6731015 Super low profile package with stacked dies |
| 05/04/2004 | US6731014 Semiconductor package substrate, semiconductor package |
| 05/04/2004 | US6731013 Wiring substrate, semiconductor device and package stack semiconductor device |
| 05/04/2004 | US6731011 Memory module having interconnected and stacked integrated circuits |
| 05/04/2004 | US6731010 Resin sealed stacked semiconductor packages with flat surfaces |
| 05/04/2004 | US6731009 Multi-die assembly |
| 05/04/2004 | US6731001 Semiconductor device including bonded wire based to electronic part and method for manufacturing the same |
| 05/04/2004 | US6730997 Method of transferring ultra-thin substrates and application of the method to the manufacture of a multi-layered thin film device |
| 05/04/2004 | US6730989 Semiconductor package and method |
| 05/04/2004 | US6730937 Passivation layer covering; arranged in rows and columns in matrix |
| 05/04/2004 | US6730933 Hybrid integrated circuit device |
| 05/04/2004 | US6730856 Ceramic circuit board and method for manufacturing the same |
| 05/04/2004 | US6730855 Electronic element |
| 05/04/2004 | US6730544 Stackable semiconductor package and method for manufacturing same |
| 05/04/2004 | US6730543 Methods for multiple die stack apparatus employing |
| 05/04/2004 | US6730530 Semiconductor light emitting element formed on a clear or translucent substrate |
| 05/04/2004 | US6730527 Chip and defect tolerant method of mounting same to a substrate |
| 04/29/2004 | WO2004008817A3 A multi-configuration processor-memory device |
| 04/29/2004 | WO2004008618A3 Active rectifier module for three-phase generators of vehicles |
| 04/29/2004 | WO2003049204A3 Optoelectronic component |
| 04/29/2004 | WO2002103795A3 Semiconductor module having multiple semiconductor chips |
| 04/29/2004 | WO2002103792A3 Method of manufacturing a semiconductor device and semiconductor device |
| 04/29/2004 | US20040082103 Semiconductor package with marking film and manufacturing method thereof |
| 04/29/2004 | US20040082100 Method and apparatus for manufacturing electronic component-mounted component, and electronic component-mounted component |
| 04/29/2004 | US20040080939 Illuminator |
| 04/29/2004 | US20040080938 Uniform illumination system |
| 04/29/2004 | US20040080341 Electronic circuit apparatus and integrated circuit device |
| 04/29/2004 | US20040080045 Semiconductor device and chip-stack semiconductor device |
| 04/29/2004 | US20040080044 Hybrid integrated circuit device and method for fabricating the same and electronic device |
| 04/29/2004 | US20040080043 Semiconductor device with reinforced under-support structure and method of fabricating the same |
| 04/29/2004 | US20040080040 Semiconductor device and chip-stack semiconductor device |
| 04/29/2004 | US20040080036 System in package structure |
| 04/29/2004 | US20040080013 Chip-stack semiconductor device and manufacturing method of the same |
| 04/29/2004 | US20040078969 Method of manufacturing circuit board and communication appliance |
| 04/29/2004 | DE10248683A1 Passive component for integration into a high power circuit module has multiplayer structure with electrically contactable external metallized layers |
| 04/29/2004 | DE10227515B4 Lichtdiode mit Keramiksubstrat und Reflektor Light-emitting diode with ceramic substrate and reflector |
| 04/29/2004 | DE10134986B4 Verbindung gehäusegefaßter integrierter Speicherbausteine mit einer Leiterplatte Connection housing calmer integrated memory devices with a circuit board |
| 04/28/2004 | EP1414281A1 Circuit module |
| 04/28/2004 | EP1414066A1 Circuit and method for monitoring semiconductor power elements |
| 04/28/2004 | EP1414065A2 Configuration of power devices enabeling the mechatronic integration of power devices |
| 04/28/2004 | EP1414050A1 Method for producing nanocomposite magnet using atomizing method |
| 04/28/2004 | EP1413618A1 Luminescent material, especially for LED application |
| 04/28/2004 | EP1413054A1 Auxiliary circuitry for monolithic microwave integrated circuit |
| 04/28/2004 | EP1412983A2 Electronic device and relative fabrication method |
| 04/28/2004 | EP1412966A1 Multi-wavelength semiconductor laser arrays and applications thereof |
| 04/28/2004 | CN1492506A Polycrystalline light-emitting diode module package |