| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 05/25/2004 | US6740870 Clear plastic packaging in a CMOS active pixel image sensor |
| 05/25/2004 | US6740582 Integrated circuits and methods for their fabrication |
| 05/25/2004 | US6740546 Packaged microelectronic devices and methods for assembling microelectronic devices |
| 05/25/2004 | US6740541 Unmolded package for a semiconductor device |
| 05/25/2004 | US6739733 LED lamp assembly |
| 05/25/2004 | CA2115303C High-power component cooling device |
| 05/21/2004 | WO2004042899A1 Alternator in connection with a remotely-cooled rectifier |
| 05/21/2004 | WO2004042833A1 Light-emitting diode |
| 05/21/2004 | WO2004032160A9 Methods and systems for processing a substrate using a dynamic liquid meniscus |
| 05/21/2004 | WO2004027823A3 Semiconductor multi-package module having wire bond interconnection between stacked packages |
| 05/21/2004 | WO2003079439A3 Chip stack with intermediate cavity |
| 05/21/2004 | WO2003019660A8 Hand-held computers incorporating reduced area imaging devices |
| 05/21/2004 | CA2505144A1 Alternator in connection with a remotely-cooled rectifier |
| 05/20/2004 | US20040097017 Method of manufacturing a semiconductor device |
| 05/20/2004 | US20040097015 Package for integrated circuit with thermal vias and method thereof |
| 05/20/2004 | US20040097010 Methods of forming semiconductor stacked die devices |
| 05/20/2004 | US20040097008 Three dimensional structure integrated circuit |
| 05/20/2004 | US20040095736 Multi-chip package having increased reliabilty |
| 05/20/2004 | US20040095729 Non-isolated heatsink(s) for power modules |
| 05/20/2004 | US20040095710 Circuit module |
| 05/20/2004 | US20040095075 High intensity light source arrangement |
| 05/20/2004 | US20040094832 Semiconductor package and manufacturing method thereof |
| 05/20/2004 | US20040094831 Semiconductor device, method for manufacturing semiconductor device and electronic equipment |
| 05/20/2004 | US20040094828 Double-sided multi-chip circuit component |
| 05/20/2004 | US20040093809 Double-pane window which generates solar-powered electricity |
| 05/19/2004 | EP1420462A1 Light emitting device |
| 05/19/2004 | EP1420461A2 Stacked photovoltaic device |
| 05/19/2004 | EP1420459A2 Solar cell module |
| 05/19/2004 | EP1419535A1 Multicolor light-emitting lamp and light source |
| 05/19/2004 | EP1419534A2 Method for producing contacts and printed circuit packages |
| 05/19/2004 | EP1419530A2 Method for producing electronic components |
| 05/19/2004 | EP1419529A2 Three-dimensional electronic device and relative manufacture method |
| 05/19/2004 | EP1419526A2 Through-via vertical interconnects, through-via heat sinks and associated fabrication methods |
| 05/19/2004 | DE10251530A1 Stack arrangement for FBGA memory module, has encapsulation at central region of each memory chip, constituting spacer between chips, and metallization connected to carrier substrate |
| 05/19/2004 | DE10251527A1 Manufacturing stack arrangement for FBGA memory module, by severing bond between bond pad and landing pad and bonding free ends to contact pads on carrier substrate |
| 05/19/2004 | DE10250621A1 Process for producing encapsulated chips, involves separates chipping with contacts from a wafer and spray coating to encapsulate and applying wiring structure |
| 05/19/2004 | DE10250538A1 Electronic component with two or more semiconductor chips, has circuit carrier flush with active surface of chips, forming fine wiring plane with contact terminals at edges |
| 05/19/2004 | DE10245296B3 Beleuchtungseinrichtung für ein Kraftfahrzeug und deren Eisatz als Frontscheinwerfer des Kraftfahrzeugs Lighting device for a motor vehicle and their Eisatz front headlights of the vehicle |
| 05/19/2004 | CN2617040Y Light-emitting diode bulb |
| 05/19/2004 | CN2617038Y Multi-layer chip stacked packaging structure |
| 05/19/2004 | CN1498423A Mixed analog and digital inegrated circits |
| 05/19/2004 | CN1498422A Power semiconductor module |
| 05/19/2004 | CN1497720A Packing semiconductor device |
| 05/19/2004 | CN1497712A Circuit device and its manufacturing method |
| 05/19/2004 | CN1150617C Semiconductor substrate and stackable semiconductor package and fabrication method thereof |
| 05/19/2004 | CN1150616C Semiconductor device, method for manufacturing the same, and method for mounting thd same |
| 05/18/2004 | US6738263 Stackable ball grid array package |
| 05/18/2004 | US6738258 Power semiconductor module |
| 05/18/2004 | US6737912 Resistance division circuit and semiconductor device |
| 05/18/2004 | US6737814 Enhanced trim resolution voltage-controlled dimming LED driver |
| 05/18/2004 | US6737811 High intensity light source arrangement |
| 05/18/2004 | US6737750 Structures for improving heat dissipation in stacked semiconductor packages |
| 05/18/2004 | US6737743 Memory chip cut out of wafer including basic chips functioning as memory chip independently from each other, dicing line interposed between and connecting basic chips, and configuring part of memory chip; each basic chip is operated independently |
| 05/18/2004 | US6737742 Stacked package for integrated circuits |
| 05/18/2004 | US6737741 Process for mounting electronic device and semiconductor device |
| 05/18/2004 | US6737738 Multi-level package for a memory module |
| 05/18/2004 | US6737736 Semiconductor device |
| 05/18/2004 | US6737680 Method and apparatus for fabricating a photocoupler with reduced mount area |
| 05/18/2004 | US6737581 Configuration of a plurality of circuit modules |
| 05/18/2004 | US6737573 Backup power supply apparatus |
| 05/13/2004 | WO2003079754A3 Method for stacking chips within a multichip module package |
| 05/13/2004 | WO2003069969A3 High density 3-d integrated circuit package |
| 05/13/2004 | US20040092147 Connector for automotive bridge rectifier assembly |
| 05/13/2004 | US20040092117 Method for fabricating a through-hole interconnection substrate and a through-hole interconnection substrate |
| 05/13/2004 | US20040092099 Semiconductor device and manufacturing method therefor, circuit board, and electronic equipment |
| 05/13/2004 | US20040092056 Multilayer memory stacking method and multilayer memory made by the method |
| 05/13/2004 | US20040090845 Fabrication and assembly structures and methods for memory devices |
| 05/13/2004 | US20040090759 Multi-package stack module |
| 05/13/2004 | US20040090756 Chip packaging structure and manufacturing process thereof |
| 05/13/2004 | US20040089955 A first integrated circuit affixed to a substrate; an electronic circuit component affixed to the substrate; a first encapsulation structure encasing the first integrated circuit; a second integrated circuit affixed to the first |
| 05/13/2004 | US20040089943 First and second ceramic substrates housed in a case. The first ceramic substrate has electronic components including a semiconductor component mounted on its surface. The second ceramic substrate is fixed to the top face of the |
| 05/13/2004 | US20040089936 Semiconductor device |
| 05/13/2004 | US20040089934 Stacked semiconductor module and assembling method of the same |
| 05/13/2004 | US20040089932 Methods and apparatuses relating to block configurations and fluidic self-assembly processes |
| 05/13/2004 | US20040089931 Power semiconductor device |
| 05/13/2004 | US20040089930 Simplified stacked chip assemblies |
| 05/13/2004 | US20040089921 Lead frame and method of producing the same, and resin-encapsulated semiconductor device and method of producing the same |
| 05/13/2004 | US20040089872 An apparatus consisting of a single wire bond silicon sub-mount used to make an LED device which also has built-in ESD protection in the sub-mount. The single wire bond silicon sub- mount uses a pass-through interconnection between the |
| 05/13/2004 | US20040089865 Optoelectronic package |
| 05/13/2004 | US20040089864 Light emitting diode and method of making the same |
| 05/13/2004 | DE19939933B4 Elektronische Leistungs-Moduleinheit Electronic power module unit |
| 05/13/2004 | DE10249854A1 Power semiconductor component group for AC motor control, using mounting layer with parallel conductor regions for contacting power semiconductors |
| 05/13/2004 | DE10245892A1 Beleuchtungseinrichtung zur Hinterleuchtung einer Bildwiedergabevorrichtung Illumination device for backlighting a display device |
| 05/12/2004 | EP1418630A1 LED lamp |
| 05/12/2004 | EP1418627A2 Solar cell module and edge face sealing member for same |
| 05/12/2004 | EP1418622A1 Encapsulation of multiple integrated circuits |
| 05/12/2004 | EP1418621A2 Vehicular headlamp employing semiconductor light source |
| 05/12/2004 | EP1418617A2 Semiconductor device and method of manufacturing the same |
| 05/12/2004 | EP1417711A1 Power electronic component module and method for assembling same |
| 05/12/2004 | EP1417710A2 A method and apparatus for die stacking |
| 05/12/2004 | EP0792463B1 Mounting spring elements on semiconductor devices |
| 05/12/2004 | CN1496579A Method of manufacturing optical devices and related improvements |
| 05/12/2004 | CN1495894A Optical coupling semiconductor device and its mfg. method |
| 05/12/2004 | CN1495893A Semiconductor device and its aking method |
| 05/12/2004 | CN1495891A 集成电路装置与电子装置 The integrated circuit device and the electronic device |
| 05/12/2004 | CN1495870A Composite intermediate connection element of microelectronic component and its making method |
| 05/12/2004 | CN1149683C Light-emitting diode white light source |
| 05/11/2004 | US6734728 RF power transistor with internal bias feed |
| 05/11/2004 | US6734670 Determining a surface profile of an object |
| 05/11/2004 | US6734568 Semiconductor device and method of manufacturing the same |