| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 06/09/2004 | EP1427026A1 LIGHT−EMITTING OR LIGHT−RECEIVING SEMICONDUCTOR MODULE AND METHOD OF ITS MANUFACTURE |
| 06/09/2004 | EP1427016A2 Semiconductor device and circuit board mounted with the same |
| 06/09/2004 | EP1427006A1 Electronic parts packaging structure and method of manufacturing the same |
| 06/09/2004 | EP1425832A2 Method of manufacturing optical devices and related improvements |
| 06/09/2004 | EP1425803A1 White light led with multicolor light-emitting layers of macroscopic structure widths, arranged on a light-diffusing glass |
| 06/09/2004 | EP1425800A2 Image sensor with recessed planarizing layers and method for making same |
| 06/09/2004 | DE10331335A1 Leistungs-Halbleitervorrichtung Power semiconductor device |
| 06/09/2004 | CN2620381Y Micro-power module |
| 06/09/2004 | CN1503992A High power LED |
| 06/09/2004 | CN1503359A Electronic parts packaging structure and method of manufacturing the same |
| 06/09/2004 | CN1153293C Integrated circuit contg. low diffusion capacitance network |
| 06/08/2004 | US6747361 Semiconductor device and packaging method thereof |
| 06/08/2004 | US6747348 Apparatus and method for leadless packaging of semiconductor devices |
| 06/08/2004 | US6747347 Multi-chip electronic package and cooling system |
| 06/08/2004 | US6747293 Light emitting device |
| 06/08/2004 | US6747203 Photovoltaic module |
| 06/08/2004 | US6746911 Miniaturization; multilayer stacks; heat treatment to connect elements |
| 06/08/2004 | US6746889 Optoelectronic device with improved light extraction |
| 06/08/2004 | US6746885 Method for making a semiconductor light source |
| 06/03/2004 | WO2004047173A1 Semiconductor package and laminated semiconductor package |
| 06/03/2004 | WO2003056638A3 Method for the production of light-guiding led bodies in two chronologically separate stages |
| 06/03/2004 | WO2003023857A3 Led-luminous panel and carrier plate |
| 06/03/2004 | US20040106335 Semiconductor device and method of manufacturing the same |
| 06/03/2004 | US20040106231 Compact electronic device and process of manufacturing the same |
| 06/03/2004 | US20040106230 Multi-die module and method thereof |
| 06/03/2004 | US20040106229 Methods for assembling multiple semiconductor devices |
| 06/03/2004 | US20040106224 Method of manufacturing optical devices and related improvements |
| 06/03/2004 | US20040105242 Stackable module |
| 06/03/2004 | US20040105241 Stiffener design |
| 06/03/2004 | US20040104486 Electronic apparatus having an adhesive layer from wafer level packaging |
| 06/03/2004 | US20040104475 [high density semiconductor package] |
| 06/03/2004 | US20040104474 Semiconductor package and package stack made thereof |
| 06/03/2004 | US20040104470 Microelectronic packages with self-aligning features |
| 06/03/2004 | US20040104462 Semiconductor package |
| 06/03/2004 | US20040104446 Semiconductor module and power conversion device |
| 06/03/2004 | US20040104408 Stackable ceramic FBGA for high thermal applications |
| 06/03/2004 | US20040104350 Radiation detector, radiation detector element, and radiation imaging apparatus |
| 06/03/2004 | US20040104344 Radiation sensor with photo-thermal gain |
| 06/03/2004 | US20040104043 Compactness, low profile, and light-weight properties |
| 06/02/2004 | EP1424731A2 Electronic parts packaging structure and method of manufacturing the same |
| 06/02/2004 | EP1424728A1 Power semiconductor module |
| 06/02/2004 | EP1423877A2 Structure and method for fabrication of a leadless chip carrier with embedded inductor |
| 06/02/2004 | CN2619145Y Electronic colour changing lamp |
| 06/02/2004 | CN1501513A Stacked photovoltaic device |
| 06/02/2004 | CN1501484A Power semiconductor device |
| 06/02/2004 | CN1152201C Cold light source lamp |
| 06/01/2004 | US6744656 Semiconductor device and process for manufacturing the same |
| 06/01/2004 | US6744141 Stacked chip-size package type semiconductor device capable of being decreased in size |
| 06/01/2004 | US6744140 Semiconductor chip and method of producing the same |
| 06/01/2004 | US6744126 Multichip semiconductor package device |
| 06/01/2004 | US6744114 Package with integrated inductor and/or capacitor |
| 06/01/2004 | US6744073 Light-emitting or light-receiving semiconductor device and method for fabricating the same |
| 06/01/2004 | US6743982 Stretchable interconnects using stress gradient films |
| 06/01/2004 | US6743696 Apparatus and method for leadless packaging of semiconductor devices |
| 06/01/2004 | US6743664 Flip-chip on flex for high performance packaging applications |
| 06/01/2004 | US6743069 Facilitating the spread of encapsulant between surfaces of electronic devices |
| 05/27/2004 | WO2004045050A1 Three-phase ac generator for vehicle |
| 05/27/2004 | WO2004044995A1 Light emitting device |
| 05/27/2004 | WO2003058719B1 Monolithic interconnection interface for the stacking of electronic components and the production method thereof |
| 05/27/2004 | WO2003024157A3 Voltage dimmable led display producing multiple colors |
| 05/27/2004 | US20040100772 Packaged microelectronic component assemblies |
| 05/27/2004 | US20040100192 Led lamp |
| 05/27/2004 | US20040099948 Power semiconductor module with improved insulation strength |
| 05/27/2004 | US20040099945 IC package for a multi-chip module |
| 05/27/2004 | US20040099944 Semiconductor device |
| 05/27/2004 | US20040099938 Assemblies having stacked semiconductor chips and methods of making same |
| 05/27/2004 | US20040099934 Noise eliminating system on chip and method of making same |
| 05/27/2004 | US20040099911 Novel electronic device structures including interconnecting microfluidic channels |
| 05/27/2004 | US20040099868 Light emitting semiconductor package |
| 05/27/2004 | US20040099441 Printed circuit board,its manufacturing method and csp manufacturing method |
| 05/27/2004 | DE202004000641U1 Light emitting diode comprises a support formed by a cathode connection and anode connections forming a supporting platform, chips arranged in a hollow chamber, a light-permeable body for sealing the chips, and a resistor |
| 05/27/2004 | DE19920505B4 Umrichter mit Temperatursymmetrierung Inverter with Temperatursymmetrierung |
| 05/27/2004 | DE10321913A1 System-in-package-Halbleitervorrichtung System-in-package semiconductor device |
| 05/27/2004 | DE10252252A1 Electrical power supply for vehicle, mounts rectifier and fan separately from alternator and uses mounting spacer as DC connection point |
| 05/27/2004 | DE10121970B4 Leistungshalbleitermodul in Druckkontaktierung Power semiconductor module in pressure contact |
| 05/26/2004 | EP1421631A1 A method to gaas based lasers and a gaas based laser |
| 05/26/2004 | EP1421628A2 Irfpa roic with dual tdm reset integrators and sub-frame averaging functions per unit cell |
| 05/26/2004 | EP1421618A2 Power electronics component |
| 05/26/2004 | EP1421617A2 Power electronics component |
| 05/26/2004 | EP1421616A2 Method for fixing an electrical element and a module with an electrical element fixed thus |
| 05/26/2004 | EP1421614A2 Process to allow electrical and mechanical connection of an electrical device with a face equipped with contact pads |
| 05/26/2004 | CN2618364Y Rapid radiative silicon rectifier bridge |
| 05/26/2004 | CN2618052Y Element collecting light |
| 05/26/2004 | CN2618045Y LED lamp bulb |
| 05/26/2004 | CN1499650A Solar cell module and edge face sealing member for same |
| 05/26/2004 | CN1499636A System combined semiconductor device |
| 05/26/2004 | CN1499630A Modularized device of stackable semiconductor package and preparing method |
| 05/26/2004 | CN1499622A Lead frame, its mfg. method and resin sealed semiconductor device and its mfg. method |
| 05/26/2004 | CN1499596A Mfg. method of assembly set with electronic component and mfg. method for related products |
| 05/26/2004 | CN1499590A Semiconductor device and its mfg. method |
| 05/26/2004 | CN1151559C Tiled electronic display structure |
| 05/26/2004 | CN1151009C Fabricating interconnects and tips using sacrificial substrates |
| 05/25/2004 | US6741085 Contact carriers (tiles) for populating larger substrates with spring contacts |
| 05/25/2004 | US6740984 Ball grid array chip packages having improved testing and stacking characteristics |
| 05/25/2004 | US6740983 Efficient burn in |
| 05/25/2004 | US6740981 Semiconductor device including memory unit and semiconductor module including memory units |
| 05/25/2004 | US6740980 Semiconductor device |
| 05/25/2004 | US6740973 Stacked structure for an image sensor |
| 05/25/2004 | US6740970 Semiconductor device with stack of semiconductor chips |
| 05/25/2004 | US6740964 Semiconductor package for three-dimensional mounting, fabrication method thereof, and semiconductor device |