| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
|---|
| 06/22/2004 | US6753613 Stacked dice standoffs |
| 06/22/2004 | US6753604 High frequency circuit module and communication device |
| 06/22/2004 | US6753599 Semiconductor package and mounting structure on substrate thereof and stack structure thereof |
| 06/22/2004 | US6753207 Stacked semiconductor package and fabricating method thereof |
| 06/22/2004 | US6753205 Method for manufacturing a structure comprising a substrate with a cavity and a semiconductor integrated circuit bonded to a contact pad located in the cavity |
| 06/22/2004 | US6753197 Opto-electronic device integration |
| 06/22/2004 | US6752888 Mounting and curing chips on a substrate so as to minimize gap |
| 06/22/2004 | US6751859 Method for forming modular sockets using flexible interconnects and resulting structures |
| 06/17/2004 | WO2004051894A1 Bidirectional emitting and receiving module |
| 06/17/2004 | WO2004025699A3 Assemblies having stacked semiconductor chips |
| 06/17/2004 | WO2004025695A3 Semiconductor device with wire bond inductor and method |
| 06/17/2004 | WO2003061006A3 Stacked die in die bga package |
| 06/17/2004 | US20040115920 Semiconductor device and method for manufacturing the same, circuit board, electronic apparatus, and semiconductor device manufacturing apparatus |
| 06/17/2004 | US20040115919 Semiconductor device and its manufacturing method |
| 06/17/2004 | US20040115867 Semiconductor device and method for manufacturing same |
| 06/17/2004 | US20040115866 Methods of making microelectronic packages including folded substrates |
| 06/17/2004 | US20040115865 Method for fabricating semiconductor component with on board capacitor |
| 06/17/2004 | US20040115864 Manufacturing method for electronic component-mounted component, manufacturing method for electronic component-mounted completed product with the electronic component-mounted component, and electronic component-mounted completed product |
| 06/17/2004 | US20040115863 Bond pad of aluminum doped with Mg, Pd or Si, or Cu; reducing the overall tensile stresses in the wafer, controlling the abnormal growth of IMC |
| 06/17/2004 | US20040115849 Image display unit and method of producing image display unit |
| 06/17/2004 | US20040115696 Utilizing programmable functionalized self-assembling nucleic acids as building blocks for molecular electronic and photonic mechanisms, organizing interconnected nanostructures and/or micronized components of micro or optoelectronic devices |
| 06/17/2004 | US20040113697 Single package multi-chip RF power amplifier |
| 06/17/2004 | US20040113281 Multi-chip module and method of forming |
| 06/17/2004 | US20040113280 Multi-chip package |
| 06/17/2004 | US20040113275 Semiconductor multi-package module having inverted second package stacked over die-up flip-chip ball grid array (BGA) package |
| 06/17/2004 | US20040113269 Semiconductor device and method for manufacturing the same |
| 06/17/2004 | US20040113268 Semiconductor device |
| 06/17/2004 | US20040113266 [semiconductor package module and manufacturing mehod thereof] |
| 06/17/2004 | US20040113264 High performance vias for vertical IC packaging |
| 06/17/2004 | US20040113261 wiring pattern; connecting terminals via apertures : flip chips |
| 06/17/2004 | US20040113260 Electronic parts packaging structure and method of manufacturing the same |
| 06/17/2004 | US20040113258 Semiconductor power module |
| 06/17/2004 | US20040113256 Stack arrangement of a memory module |
| 06/17/2004 | US20040113255 Die attached to substrate; stacked die packages connected by wire bonding |
| 06/17/2004 | US20040113254 Multilayer semiconductor; connecting by wire bonding |
| 06/17/2004 | US20040113253 Semiconductor stacked multi-package module having inverted second package |
| 06/17/2004 | US20040113250 Integrated circuit assembly |
| 06/17/2004 | US20040113248 Semiconductor device and manufacturing the same |
| 06/17/2004 | US20040113246 Method of packaging at a wafer level |
| 06/17/2004 | US20040113245 Semiconductor device and process for fabricating the same |
| 06/17/2004 | US20040113222 Stacked microelectronic module with vertical interconnect vias |
| 06/17/2004 | US20040112633 Electronic device module |
| 06/17/2004 | US20040112373 Passive Solar Tracker for a Solar Concentrator |
| 06/17/2004 | DE10351924A1 Durchkontaktierungssubstrat und ein Verfahren zur Herstellung eines Durchkontaktierungssubstrats Durchkontaktierungssubstrat and a method for producing a Durchkontaktierungssubstrats |
| 06/17/2004 | DE10349692A1 Halbleitervorrichtung und Verfahren zur Herstellung derselben A semiconductor device and method of manufacturing the same |
| 06/17/2004 | DE10317101A1 On-Chip-Rauschunterdrückungssystem und ein Verfahren, dieses herzustellen On-chip noise reduction system and method of producing this |
| 06/17/2004 | DE10255848A1 Semiconductor memory module, especially a short loop through (SLT) bus topology chip, has connections on its foot end so that it can be connected to a memory module circuit board with its longitudinal axis perpendicular to it |
| 06/17/2004 | DE10254547A1 Arrangement for mechanical protection of chip module assembly, has distance holder filling gaps on circuit board between chips, at least partly passing over edges of chips, and slightly higher than chips |
| 06/16/2004 | EP1429590A1 Thin film circuit board device and its manufacturing method |
| 06/16/2004 | EP1429459A2 Piezoelectric oscillator, manufacturing method thereof, and electronic device |
| 06/16/2004 | EP1429395A2 LED light source mimicking a filamented lamp |
| 06/16/2004 | EP1429393A2 Solar cell module |
| 06/16/2004 | EP1429389A1 Compact circuit module having high mounting accuracy and method of manufacturing the same |
| 06/16/2004 | EP1429388A1 High performance vias for vertical IC packaging |
| 06/16/2004 | EP1429385A1 Housing for power semiconductor modules |
| 06/16/2004 | EP1429384A1 Circuit for semiconductor devices and method for producing the same |
| 06/16/2004 | EP1428414A1 Power efficient led driver quiescent current limiting circuit configuration |
| 06/16/2004 | EP1428293A2 Structure and method for fabrication of a leadless chip carrier with embedded antenna |
| 06/16/2004 | EP1428266A1 Chain link metal interconnect structure |
| 06/16/2004 | EP1428259A2 Semiconductor module |
| 06/16/2004 | EP1428258A1 Thin electronic label and method for making same |
| 06/16/2004 | EP1427962A1 Variable optics spot module |
| 06/16/2004 | CN1505838A System on a package fabricated on a semiconductor or dielectric wafer |
| 06/16/2004 | CN1505459A Circuit apparatus |
| 06/16/2004 | CN1505150A Semiconductor device and method of manufacturing the same |
| 06/16/2004 | CN1505149A Three-dimensional packaging apparatus of multichip integrated circuit |
| 06/16/2004 | CN1505148A Semiconductor device and method of manufacturing the same |
| 06/16/2004 | CN1505147A Electronic parts packaging structure and method of manufacturing the same |
| 06/16/2004 | CN1505146A Multiple chip module |
| 06/16/2004 | CN1505138A Semiconductor device and method of manufacturing the same |
| 06/16/2004 | CN1504978A Electronic installation, manufacturing method thereof and electronic equipment |
| 06/15/2004 | US6750547 Package comprising first microelectronic substrate coupled to second microelectronic substrate to form assembly, and conformal conductive link coupled between first and second connection sites and conforming to contour of assembly |
| 06/15/2004 | US6750545 Semiconductor package capable of die stacking |
| 06/15/2004 | US6750516 Systems and methods for electrically isolating portions of wafers |
| 06/15/2004 | US6749320 Lamp for a flashlight |
| 06/15/2004 | US6748645 Aligned modular printed circuit film elements |
| 06/10/2004 | WO2004049439A1 Semiconductor device |
| 06/10/2004 | WO2004049436A1 Semiconductor device having a bond pad and method for its fabrication |
| 06/10/2004 | WO2004049433A1 Power semiconductor module |
| 06/10/2004 | WO2004049424A2 Microelectronic packaging and components |
| 06/10/2004 | WO2004049394A2 Digital and rf system and method therefor |
| 06/10/2004 | WO2004030109A8 Luminescent material, especially for led application |
| 06/10/2004 | WO2004008488A9 Ganged detector pixel, photon/pulse counting radiation imaging device |
| 06/10/2004 | US20040110323 Method for producing encapsulated chips |
| 06/10/2004 | US20040109481 Light emitting device and optical device using the same |
| 06/10/2004 | US20040109327 LED light source mimicking a filamented lamp |
| 06/10/2004 | US20040109283 Integrated circuit chip package with formable intermediate 3D wiring structure |
| 06/10/2004 | US20040109282 Flip-chip sub-assembly, methods of making same and device including same |
| 06/10/2004 | US20040108821 Compound color optical LED |
| 06/10/2004 | US20040108590 Carrier-based electronic module |
| 06/10/2004 | US20040108589 Power semiconductor module |
| 06/10/2004 | US20040108587 High density chip carrier with integrated passive devices |
| 06/10/2004 | US20040108584 Thin scale outline package |
| 06/10/2004 | US20040108583 Thin scale outline package stack |
| 06/10/2004 | US20040108581 Assemblies having stacked semiconductor chips and methods of making same |
| 06/10/2004 | US20040108579 Multilayer semiconductor chips; stress relieving interface |
| 06/10/2004 | US20040108556 Semiconductor device |
| 06/10/2004 | US20040108460 Infrared sensor |
| 06/10/2004 | US20040108364 Multi-chip sack and method of fabrication utilizing self-aligning electrical contact array |
| 06/09/2004 | EP1427027A1 Semiconductor device and method of its manufacture |