| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 07/01/2004 | US20040125197 Semiconductor apparatus having conductive layers and semiconductor thin films |
| 07/01/2004 | US20040124724 AC generator for vehicle having rectifying unit |
| 07/01/2004 | US20040124545 High density integrated circuits and the method of packaging the same |
| 07/01/2004 | US20040124542 Semiconductor device and method for manufacturing the same |
| 07/01/2004 | US20040124539 Multi-chip stack flip-chip package |
| 07/01/2004 | US20040124538 Multi-layer integrated semiconductor structure |
| 07/01/2004 | US20040124523 Semiconductor devices including peripherally located bond pads, intermediates thereof, assemblies, and packages including the semiconductor devices, and support elements for the semiconductor devices |
| 07/01/2004 | US20040124520 Stacked electronic structures including offset substrates |
| 07/01/2004 | US20040124518 Multilayer packages; connecting wire bonds; heat spreading |
| 07/01/2004 | US20040124516 Circuit device, circuit module, and method for manufacturing circuit device |
| 07/01/2004 | US20040124513 High-density multichip module package |
| 07/01/2004 | US20040124512 Thermal enhance MCM package |
| 07/01/2004 | US20040124509 Method and structure for vertically-stacked device contact |
| 07/01/2004 | US20040124487 LED package die having a small footprint |
| 07/01/2004 | US20040124474 Semiconductor device and sustaining circuit |
| 07/01/2004 | DE10359430A1 Verfahren und Vorrichtung für Röntgenbilddetektoranordnungen Method and apparatus for X-ray detector arrays |
| 07/01/2004 | DE10316355B3 Flexible spring-loaded outer contact system for semiconductor module carrying heavy load has housing with frame members at sides carrying contact points for contact springs |
| 07/01/2004 | CA2507431A1 Single package multi-chip rf power amplifier |
| 06/30/2004 | EP1434271A2 Integrated semiconductor device comprising semiconductor thin films and optical print head |
| 06/30/2004 | EP1434269A2 Semiconductor device assembly having wiring layers and semiconductor thin films, and optical print head |
| 06/30/2004 | EP1434268A2 Electronic substrate, power module and motor driver |
| 06/30/2004 | EP1434267A1 Manufacturing process of a stacked semiconductor device and corresponding device |
| 06/30/2004 | EP1434264A2 Semiconductor device and manufacturing method using the transfer technique |
| 06/30/2004 | EP1434262A2 Semiconductor device manufactured by the transfer technique |
| 06/30/2004 | EP1433204A2 Device with power semiconductor components for controlling the power of high currents and use of said device |
| 06/30/2004 | EP0815615B1 A package housing multiple semiconductor dies |
| 06/30/2004 | CN2622545Y Illumination lamp with large lighting range |
| 06/30/2004 | CN1509134A Method for producing circuit device, circuit moudle and method for producing circuit devicd |
| 06/30/2004 | CN1508963A AC generator of vehicles |
| 06/30/2004 | CN1508888A LED Lighting lightsource |
| 06/30/2004 | CN1508883A 半导体器件及保持电路 The semiconductor device and hold circuit |
| 06/30/2004 | CN1508856A After-stage through-hole discrete circuit element and manufacturing method thereof |
| 06/30/2004 | CN1508844A Method for manufacturing semiconductor device, semeconductor device and electronic product |
| 06/30/2004 | CN1156003C Assembly structure |
| 06/29/2004 | US6757178 Electronic circuit equipment using multilayer circuit board |
| 06/29/2004 | US6756689 Power device having multi-chip package structure |
| 06/29/2004 | US6756684 Flip-chip ball grid array semiconductor package with heat-dissipating device and method for fabricating the same |
| 06/29/2004 | US6756683 High-frequency semiconductor device including a semiconductor chip |
| 06/29/2004 | US6756681 Radio frequency integrated circuit having increased substrate resistance enabling three dimensional interconnection with feedthroughs |
| 06/29/2004 | US6756667 Hermetically sealed semiconductor power module and large scale module comprising the same |
| 06/29/2004 | US6756664 Noise eliminating system on chip and method of making same |
| 06/29/2004 | US6756663 Semiconductor device including wiring board with three dimensional wiring pattern |
| 06/29/2004 | US6756662 Semiconductor chip module and method of manufacture of same |
| 06/29/2004 | US6756661 Semiconductor device, a semiconductor module loaded with said semiconductor device and a method of manufacturing said semiconductor device |
| 06/29/2004 | US6756610 Light irradiating device |
| 06/29/2004 | US6756305 Stacked dice bonded with aluminum posts |
| 06/29/2004 | US6756288 Method of subdividing a wafer |
| 06/29/2004 | US6754950 Electronic component and method of production thereof |
| 06/29/2004 | US6754946 Integrally formed rectifier for internal alternator regulator (IAR) style alternator |
| 06/24/2004 | WO2004054002A1 Solar panel and production method therefor |
| 06/24/2004 | WO2004053988A1 Single-phase power converter module |
| 06/24/2004 | WO2004053973A1 Method of packaging integrated circuits, and integrated circuit packages produced by the method |
| 06/24/2004 | WO2004053934A2 Led package die having a small footprint |
| 06/24/2004 | WO2004053933A2 Composite leadframe led package and method of making the same |
| 06/24/2004 | WO2004032160A3 Methods and systems for processing a substrate using a dynamic liquid meniscus |
| 06/24/2004 | WO2004023546A9 Methods of making microelectronic packages including folded substrates |
| 06/24/2004 | US20040121561 Method of forming electronic dies wherein each die has a layer of solid diamond |
| 06/24/2004 | US20040121556 Thinning techniques for wafer-to-wafer vertical stacks |
| 06/24/2004 | US20040121528 Electronic unit integrated into a flexible polymer body |
| 06/24/2004 | US20040121521 Semiconductor dice having back side redistribution layer accessed using through-silicon vias, methods of fabrication and assemblies |
| 06/24/2004 | US20040121516 Method for manufacturing semiconductor apparatus, and semiconductor apparatus and electric appliance |
| 06/24/2004 | US20040120453 Methods and apparatus for X-ray image detector assemblies |
| 06/24/2004 | US20040120127 Compact circuit module having high mounting accuracy and method of manufacturing the same |
| 06/24/2004 | US20040119560 High frequency composite switch module |
| 06/24/2004 | US20040119169 three dimensional integrated circuit stacked structure; forms a part of a wireless communications device, such as a cellular telephone |
| 06/24/2004 | US20040119166 Semiconductor device and method of manufacturing the same |
| 06/24/2004 | US20040119162 Semiconductor device and manufacturing method thereof |
| 06/24/2004 | US20040119153 Semiconductor multi-package module having inverted land grid array (LGA) package stacked over ball grid array (BGA) package |
| 06/24/2004 | US20040119152 Semiconductor multi-package module having inverted bump chip carrier second package |
| 06/24/2004 | US20040119151 Pre-applied underfill |
| 06/24/2004 | US20040119150 reduces insertion loss and return loss |
| 06/24/2004 | US20040119148 Semiconductor device package |
| 06/24/2004 | US20040119068 Methods and structures for reducing lateral diffusion through cooperative barrier layers |
| 06/24/2004 | US20040118806 Etch thinning techniques for wafer-to-wafer vertical stacks |
| 06/24/2004 | US20040118601 Multichip module having chips on two sides |
| 06/24/2004 | US20040118587 Modular packaging arrangements and methods |
| 06/24/2004 | US20040118446 Solar cell module |
| 06/24/2004 | US20040118144 Hermetic inverter/converter chamber with multiple pressure and cooling zones |
| 06/24/2004 | DE10258035A1 Single-phase power converter module, e.g. automobile rectifier, has auxiliary element for inhibiting connector tilt about connecting vane longitudinal axis that can be separated after module assembly |
| 06/24/2004 | CA2508133A1 Composite leadframe led package and method of making the same |
| 06/24/2004 | CA2508121A1 Led package die having a small footprint |
| 06/23/2004 | EP1432103A1 AC generator for vehicle having rectifying unit |
| 06/23/2004 | EP1432036A2 Semiconductor device and sustaining circuit |
| 06/23/2004 | EP1432034A1 Semiconductor device and semiconductor device manufacturing method |
| 06/23/2004 | EP1432033A1 Multi-chip module and method of forming |
| 06/23/2004 | EP1432032A2 Semiconductor chip stack and method for manufacturing the same |
| 06/23/2004 | EP1432022A2 Method for manufacturing and transferring a semiconductor film |
| 06/23/2004 | EP1430752A2 Fault tolerant led display |
| 06/23/2004 | EP1430545A2 Multi-stack surface mount light emitting diodes |
| 06/23/2004 | EP1430542A2 Solar array concentrator system and method for concentratiing solar energy |
| 06/23/2004 | EP1430524A2 Method for contacting electrical contact surfaces of a substrate and device consisting of a substrate having electrical contact surfaces |
| 06/23/2004 | CN1507076A Solar cell assembly |
| 06/23/2004 | CN1507046A High-density chip carrier and its constituent method |
| 06/23/2004 | CN1506223A Ink cartridge and ink-jet recording equipment mounted with the same cartridge |
| 06/23/2004 | CN1155097C Contrast enhancement for electronic display device |
| 06/23/2004 | CN1155086C Chip assembly and manufacture of same |
| 06/23/2004 | CN1155067C Method for producing semiconductor apparatus |
| 06/23/2004 | CN1155050C Method for producing three-D structure memory |
| 06/23/2004 | CN1154569C Ink container and ink jet recorder installed with same |
| 06/22/2004 | US6753726 Apparatus and method for an offset-correcting sense amplifier |