| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 07/23/2014 | CN103946962A 半导体装置及其制造方法、电子部件 Semiconductor device and manufacturing method of the electronic component |
| 07/23/2014 | CN103943785A 光学调节膜及其制造方法 Film and a method of manufacturing optical adjustment |
| 07/23/2014 | CN103943620A 半导体封装件及其制法 The semiconductor package Jiqizhifa |
| 07/23/2014 | CN103943619A 一种车用照明的大功率led cob倒装封装结构 A vehicle lighting, power led cob flip package |
| 07/23/2014 | CN103943618A 可调色温和显指的led光源模块 Adjustable color temperature and CRI led light module |
| 07/23/2014 | CN103943617A 发光装置及其制造方法 A light emitting device and manufacturing method thereof |
| 07/23/2014 | CN103943616A 一种led发光装置 One kind of led light-emitting device |
| 07/23/2014 | CN103943615A 一种dram双芯片堆叠封装结构和封装方法 One kind of two-chip stacked package structure dram and encapsulation method |
| 07/23/2014 | CN103943614A 集成无源器件扇出型晶圆级封装三维堆叠结构及制作方法 Integrated passives fan-out type wafer level package structure and method of making a three-dimensional stack |
| 07/23/2014 | CN103943613A 半导体器件和半导体器件的制造方法 The method of manufacturing a semiconductor device and a semiconductor device |
| 07/23/2014 | CN103943517A 一种采用二极管植入式温度取样的led封装方法 An encapsulation method using led diode temperature implanted samples |
| 07/23/2014 | CN103943515A 具有电绝缘壁的芯片堆叠及其形成方法 Chip stack has an electrically insulating walls and forming method |
| 07/23/2014 | CA2838641A1 Led light |
| 07/22/2014 | US8786362 Schottky diode having current leakage protection structure and current leakage protecting method of the same |
| 07/22/2014 | US8786313 Logic circuit and display device having the same |
| 07/22/2014 | US8786310 Partially programming an integrated circuit using control memory cells |
| 07/22/2014 | US8786104 Three-dimensional multichip module |
| 07/22/2014 | US8786102 Semiconductor device and method of manufacturing the same |
| 07/22/2014 | US8786069 Reconfigurable pop |
| 07/22/2014 | US8786065 Substrate, light emitting device and method for manufacturing substrate |
| 07/22/2014 | US8782880 Apparatus for assembling chip devices on wires |
| 07/18/2014 | DE202014103106U1 Leichtgewichtige LED-Keramiklampe Lightweight LED ceramic lamp |
| 07/17/2014 | WO2014109711A1 Opto-electronic modules including features to help reduce stray light and/or optical cross-talk |
| 07/17/2014 | WO2014108744A1 Electronic high frequency device and manufacturing method |
| 07/17/2014 | WO2014107848A1 Semiconductor device including independent film layer for embedding and/or spacing semiconductor die |
| 07/17/2014 | WO2014039833A4 Integrated led based illumination device |
| 07/17/2014 | US20140197547 Package on package structures and methods for forming the same |
| 07/17/2014 | US20140197541 Microelectronic assembly having a heat spreader for a plurality of die |
| 07/17/2014 | US20140197531 Compact device package |
| 07/17/2014 | US20140197529 Methods of fabricating package stack structure and method of mounting package stack structure on system board |
| 07/17/2014 | US20140197409 Multi-chip package and interposer with signal line compression |
| 07/17/2014 | DE112012004381T5 Halbleiterbauelement und Halbleiterbauelementherstellungsverfahren Semiconductor device and semiconductor device manufacturing method |
| 07/17/2014 | DE102014100309A1 Chipanordnung und verfahren zum bilden einer chipanordnung Chip assembly and method for forming a chip arrangement |
| 07/17/2014 | DE102014100278A1 Chipanordnung und verfahren zur herstellung einer chipanordnung Chip assembly and method for manufacturing a chip arrangement |
| 07/17/2014 | DE102014100236A1 Verfahren zum Herstellen eines Halbleiter-Chippanels A method of manufacturing a semiconductor chip Panels |
| 07/17/2014 | DE102013100388A1 Bauelement mit einer MEMS Komponente und Verfahren zur Herstellung Device having a MEMS component and methods for making |
| 07/17/2014 | DE102011080929B4 Verfahren zur Herstellung eines Verbundes und eines Leistungshalbleitermoduls A process for the production of a composite and a power semiconductor module |
| 07/17/2014 | DE102009033321B4 Leistungshalbleitervorrichtung Power semiconductor device |
| 07/16/2014 | EP2755401A1 Semiconductor device and microphone |
| 07/16/2014 | CN203721721U 贴片型平面共晶封装光源 SMD package light plane eutectic |
| 07/16/2014 | CN203721720U 一种双二极管串联连接的器件 A dual diode devices connected in series |
| 07/16/2014 | CN203721719U 一种to220封装mosfet多管并联模块 One kind to220 package mosfet multi-tube parallel modules |
| 07/16/2014 | CN203721718U 百万组编码发射芯片的封装结构 Millions package coded transmitter chip set |
| 07/16/2014 | CN103930991A 半导体器件及半导体器件制造方法 The semiconductor device manufacturing method and semiconductor device |
| 07/16/2014 | CN103930990A 半导体装置以及半导体装置的制造方法 The method of manufacturing a semiconductor device and a semiconductor device |
| 07/16/2014 | CN103930989A 射频层叠封装电路 RF-package circuit |
| 07/16/2014 | CN103930986A 功率转换装置 Power conversion means |
| 07/16/2014 | CN103930981A 半导体模块 Semiconductor Modules |
| 07/16/2014 | CN103930713A 用于使用具有集成发光二极管的光活性片材的照明设备的系统、具有照明设备的车窗或窗户、具有照明设备的运输工具和提供照明设备的方法 A method for using the system with an integrated lighting device of active light-emitting diodes of the sheet, the lighting apparatus having a window, or windows, with a transport device and a lighting device providing illumination |
| 07/16/2014 | CN103928591A 一种荧光条及使用荧光条的led封装模组 A fluorescent strip and using a fluorescent strip led package module |
| 07/16/2014 | CN103928590A 用于汽车前照灯led4×1芯片cob封装结构 For automotive headlamp led4 × 1 chip cob package structure |
| 07/16/2014 | CN103928452A 新型太阳能光电玻璃 The new solar glass |
| 07/16/2014 | CN103928451A 一种基于紫光芯片的低光衰、高显指白光led光源模组 Based violet chip low-light failure, high CRI white led light module |
| 07/16/2014 | CN103928450A 一种光色均匀的led封装产品及其制造方法 A light color uniform led package of products and its manufacturing method |
| 07/16/2014 | CN103928449A 蓝白双晶大功率led Blue Baishuang Jing power led |
| 07/16/2014 | CN103928448A 芯片装置和用于制造芯片装置的方法 Chip device and a method for producing chip device |
| 07/16/2014 | CN103928447A 一种大功率全气密半导体模块封装结构 One kind of high-power semiconductor module package structure airtight |
| 07/16/2014 | CN103928430A 一种基于冲压框架带有通孔的扁平多芯片封装件 A flat multi-chip package with a hole punched framework based |
| 07/16/2014 | CN103928416A 具有无源器件的半导体封装件及其堆叠方法 The semiconductor package having a passive device and stacking method |
| 07/16/2014 | CN103928411A 芯片装置及其制造方法、集成电路及其制造方法 Chip device and its manufacturing method, an integrated circuit and its manufacturing method |
| 07/16/2014 | CN103928352A 用于制作半导体芯片面板的方法 The method for fabricating a semiconductor chip panel |
| 07/16/2014 | CN102832189B 一种多芯片封装结构及其封装方法 A multi-chip package and packaging method |
| 07/16/2014 | CN102280478B 可堆栈式功率mosfet、功率mosfet堆栈及其制备工艺 Stackable power mosfet, power mosfet stack and its preparation process |
| 07/16/2014 | CN101960585B 包括导线元件和带槽的微电子芯片并包括保持该导线元件的至少一个凸块的组件 And the wire element comprises a slotted and microelectronic chip comprising at least one component of the wire holding lug member |
| 07/16/2014 | CN101866907B 用于具有可变复阻抗的连接体的接收电路 A circuit for receiving a variable complex impedance of the connecting body |
| 07/15/2014 | US8780573 Printed circuit board |
| 07/15/2014 | US8779849 Apparatuses and methods for providing capacitance in a multi-chip module |
| 07/15/2014 | US8779586 Die bond film, dicing die bond film, and semiconductor device |
| 07/15/2014 | US8779583 Semiconductor device and manufacturing method |
| 07/15/2014 | US8779566 Flexible routing for high current module application |
| 07/15/2014 | US8779562 Integrated circuit packaging system with interposer shield and method of manufacture thereof |
| 07/15/2014 | US8779460 Light source unit |
| 07/15/2014 | US8778704 Solar powered IC chip |
| 07/15/2014 | DE202014103029U1 LED-Modul zur Abgabe von Weißlicht LED module for delivery of white light |
| 07/15/2014 | CA2609646C Lead free solar cell contacts |
| 07/10/2014 | WO2014107563A1 Detecting tsv defects in 3d packaging |
| 07/10/2014 | WO2014107534A1 Color tuning of a multi-color led based illumination device |
| 07/10/2014 | WO2014107301A1 Structure for microelectronic packaging with encapsulated bond elements |
| 07/10/2014 | US20140191419 3d integrated circuit package with window interposer |
| 07/10/2014 | US20140191337 Stacked Half-Bridge Package |
| 07/10/2014 | US20140191258 Semiconductor light emitting device and method for manufacturing same |
| 07/10/2014 | US20140191253 Optoelectronic device and method for producing optoelectronic devices |
| 07/10/2014 | US20140191234 Three Dimensional Stacked Structure for Chips |
| 07/10/2014 | DE112012004162T5 Bindungsverfahren für Wafer und Struktur der Bindungsstelle For wafer bonding method and structure of the binding site |
| 07/10/2014 | DE10346474B4 Sensorbauteil mit einem Sensorchip, Sensorstapel und Verfahren zum Prüfen einer biochemischen Probe Sensor device having a sensor chip, the sensor stack and method of testing a biochemical sample |
| 07/10/2014 | DE102013100121A1 Optoelektronisches Halbleiterbauteil An optoelectronic semiconductor device |
| 07/10/2014 | DE102013000169A1 Anordnung mit einer flexiblen Leiterplatte Arrangement with a flexible printed circuit board |
| 07/10/2014 | DE102012223945A1 LED-Modul mit LED-Chip Gruppen LED module with LED chip groups |
| 07/10/2014 | DE102011076235B4 Leistungshalbleitervorrichtung Power semiconductor device |
| 07/10/2014 | DE102011010362B4 Halbleiterbauelement mit Durchkontaktierung und Herstellungsverfahren A semiconductor device having through-hole plating and manufacturing processes |
| 07/10/2014 | DE102006062804B4 Isolierender Flächenkörper und Verfahren zu seiner Herstellung und den isolierenden Flächenkörper aufweisendes Leistungsmodul Insulating sheet and method for its preparation and the insulating sheet exhibiting power module |
| 07/09/2014 | EP2752873A2 Semiconductor module |
| 07/09/2014 | DE202013101431U1 Leuchtvorrichtung zur Erzeugung von Weißlicht A lighting device for the generation of white light |
| 07/09/2014 | CN203707186U Led封装结构 Led package structure |
| 07/09/2014 | CN203707173U 一种cob面光源 One kind cob surface light source |
| 07/09/2014 | CN203707167U 一种采用内槽和微槽错位设计的led平面封装装置 A dislocation of the slot and micro-groove design led flat pack device uses |
| 07/09/2014 | CN203707129U 一种二极管组件的底板排布结构 Backplane arrangement structure for a diode assembly |
| 07/09/2014 | CN203707128U 一种组合式的cob封装结构 Cob a combined package of |
| 07/09/2014 | CN203707127U 一种低热阻高光效的cob封装结构 A low thermal resistance package structure cob high light efficiency |
| 07/09/2014 | CN203707126U 一种新型陶瓷cob封装结构 A new ceramic cob package |