| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 07/15/2004 | US20040135242 Stacked structure of chips |
| 07/15/2004 | US20040134681 Circuit board and its manufacturing method |
| 07/15/2004 | DE10357789A1 Leistungs-Halbleitervorrichtung Power semiconductor device |
| 07/15/2004 | DE10339213A1 Leistungsmodul Power module |
| 07/15/2004 | DE10260845A1 Electric machine, such as alternator with rectifier for supplying vehicle power supply network, has profiled air channel arranged between heat sinks for positive and negative diodes |
| 07/15/2004 | DE10259221A1 Electronic component for high performance memory chips, has stack of semiconductor chips with wiring layer between chips to connect contact surfaces |
| 07/15/2004 | DE10258570A1 Gehäuse für Leistungshalbleitermodule Housing for power semiconductor modules |
| 07/14/2004 | EP1437770A2 Press-fitting method and rectifying device having press-fitted member |
| 07/14/2004 | EP1437684A1 Module for a hybrid card |
| 07/14/2004 | EP1436838A2 Semiconductor component |
| 07/14/2004 | EP1436834A2 Stacking of multilayer modules |
| 07/14/2004 | CN2626056Y Crystal coated wafer structure for LED |
| 07/14/2004 | CN2625716Y Color-changing bulb |
| 07/14/2004 | CN1513207A Contact system |
| 07/14/2004 | CN1512601A Luminous device and lighting device |
| 07/14/2004 | CN1512600A Light emitting diode lamp |
| 07/14/2004 | CN1512580A Semiconductor device and its producing method |
| 07/14/2004 | CN1512579A 半导体模块 Semiconductor Modules |
| 07/14/2004 | CN1512578A 半导体模块 Semiconductor Modules |
| 07/14/2004 | CN1512567A Electronic substrate, power module, and motor driver |
| 07/14/2004 | CN1157790C Chip stack package structure |
| 07/14/2004 | CN1157785C Moldless semiconductor device and photovoltaic device module making use of same |
| 07/14/2004 | CN1157783C Heat sink and memory module with heat sink |
| 07/14/2004 | CN1157774C Method for producing semiconductor device and semiconductor device |
| 07/13/2004 | US6762937 Power module |
| 07/13/2004 | US6762491 Power semiconductor device |
| 07/13/2004 | US6762488 Light thin stacked package semiconductor device and process for fabrication thereof |
| 07/13/2004 | US6762487 Stack arrangements of chips and interconnecting members |
| 07/13/2004 | US6762472 Signal communication structures |
| 07/13/2004 | US6762122 Methods of forming metallurgy structures for wire and solder bonding |
| 07/13/2004 | US6762078 Semiconductor package having semiconductor chip within central aperture of substrate |
| 07/13/2004 | US6762076 Process of vertically stacking multiple wafers supporting different active integrated circuit (IC) devices |
| 07/13/2004 | US6762071 Method for fabricating a metal-oxide electron tunneling device for solar energy conversion |
| 07/13/2004 | US6760970 Method for forming modular sockets using flexible interconnects and resulting structures |
| 07/08/2004 | WO2004057677A2 Integrated circuit structure comprising an optoelectronic part which is covered with a lid through which light can pass |
| 07/08/2004 | WO2004057674A2 Electrical connection of optoelectronic devices |
| 07/08/2004 | WO2004057666A2 Rf power transistor with internal bias feed |
| 07/08/2004 | WO2004019657A3 Electronic assembly/system with reduced cost, mass, and volume and increased efficiency and power density |
| 07/08/2004 | WO2004015771A3 Semiconductor device and method of manufacturing the same |
| 07/08/2004 | WO2004008832A3 Attachable modular electronic systems |
| 07/08/2004 | WO2003083954A3 Solar cell module-mounting structure and solar cell module array |
| 07/08/2004 | WO2003075348B1 Stacked die semiconductor device |
| 07/08/2004 | US20040132303 Membrane 3D IC fabrication |
| 07/08/2004 | US20040130036 Mult-chip module |
| 07/08/2004 | US20040130021 High power silicon carbide and silicon semiconductor device package |
| 07/08/2004 | US20040130020 Semiconductor device and manufacturing method thereof |
| 07/08/2004 | US20040130017 Stacked layer type semiconductor device and its manufacturing method |
| 07/08/2004 | US20040130016 Semiconductor device and different levels of signal processing systems using the same |
| 07/08/2004 | US20040129946 Light emission apparatus |
| 07/08/2004 | US20040129944 Color mixing light emitting diode |
| 07/08/2004 | US20040129939 Stacked type semiconductor device |
| 07/08/2004 | DE19639247B4 Halbleiteranordnung mit einem Verdrahtungssubstrat A semiconductor device comprising a wiring substrate |
| 07/08/2004 | DE10260646A1 Housing for semiconducting components has base surface essentially in form of triangle and housing essentially in form of triangular prism; all lateral surfaces can have connecting elements |
| 07/08/2004 | DE10054962B4 Leistungsmodul Power module |
| 07/07/2004 | EP1435113A2 Semiconductor module having multiple semiconductor chips |
| 07/07/2004 | EP1435112A2 Method of manufacturing a semiconductor device and semiconductor device |
| 07/07/2004 | CN2624408Y 一种led点阵模块 One kind of led dot matrix module |
| 07/07/2004 | CN1510750A 电路装置及其制造方法 Circuit device and manufacturing method thereof |
| 07/07/2004 | CN1510744A 功率模块 Power Modules |
| 07/07/2004 | CN1510728A Manufacturing method for semiconductor device, semiconductor device, circuit substrate and apparatus |
| 07/07/2004 | CN1157105C Built-in circuit device assembly and its manufacturing method |
| 07/07/2004 | CN1156909C Method and device for inteconnect radio frequency power SiC field effect transistors |
| 07/06/2004 | US6760224 Heat sink with alignment and retaining features |
| 07/06/2004 | US6759925 Radio-frequency hybrid switch module |
| 07/06/2004 | US6759804 Illumination device with at least one LED as light source |
| 07/06/2004 | US6759754 Semiconductor device and its manufacturing method |
| 07/06/2004 | US6759745 Further miniaturize the semiconductor package by limiting the amount of the fillet spread out around the semiconductor chip |
| 07/06/2004 | US6759743 Thick film millimeter wave transceiver module |
| 07/06/2004 | US6759741 Matched set of integrated circuit chips selected from a multi wafer-interposer |
| 07/06/2004 | US6759737 Semiconductor package including stacked chips with aligned input/output pads |
| 07/06/2004 | US6759723 Light emitting semiconductor package |
| 07/06/2004 | US6759713 Electronic device structures including interconnecting microfluidic channels |
| 07/06/2004 | US6759657 Infrared sensor |
| 07/06/2004 | US6759307 Method to prevent die attach adhesive contamination in stacked chips |
| 07/06/2004 | US6759272 Semiconductor device and manufacturing method thereof |
| 07/06/2004 | US6759270 Semiconductor chip module and method of manufacture of same |
| 07/06/2004 | US6759268 Semiconductor device and manufacturing method therefor |
| 07/06/2004 | US6758696 Method and apparatus for forming modular sockets using flexible interconnects and resulting structures |
| 07/06/2004 | US6757969 Welding onto ready cut printed circuit; burying in framed gutter; exposing portions for injecting polyacrylic resin; setting into mold cavity; concurrent insertin of copper stick |
| 07/06/2004 | US6757967 Method of forming a chip assembly |
| 07/01/2004 | WO2004055979A1 Single package multi-chip rf power amplifier |
| 07/01/2004 | WO2004055911A1 Led illuminating system |
| 07/01/2004 | WO2004055895A1 Integrated circuit assembly |
| 07/01/2004 | WO2004055891A1 Semiconductor device and stacked semiconductor device |
| 07/01/2004 | WO2004055890A1 Method and apparatus for electrostatically aligning integrated circuits |
| 07/01/2004 | WO2003083943A3 Light-emitting diode emitting homogeneous parallel light |
| 07/01/2004 | US20040127011 [method of assembling passive component] |
| 07/01/2004 | US20040126994 Method of forming a multi-layer semiconductor structure having a seamless bonding interface |
| 07/01/2004 | US20040126927 Method of assembling chips |
| 07/01/2004 | US20040126926 Semiconductor device and method for fabricating the same |
| 07/01/2004 | US20040126913 Composite leadframe LED package and method of making the same |
| 07/01/2004 | US20040126910 Method for manufacturing a stack arrangement of a memory module |
| 07/01/2004 | US20040125838 Light emitter with a voltage dependent resistor layer |
| 07/01/2004 | US20040125674 Semiconductor integrated circuit device |
| 07/01/2004 | US20040125582 Device for controlling a vehicle |
| 07/01/2004 | US20040125579 Semiconductor module |
| 07/01/2004 | US20040125578 Semiconductor module |
| 07/01/2004 | US20040125574 Multi-chip semiconductor package and method for manufacturing the same |
| 07/01/2004 | US20040125529 Power module |
| 07/01/2004 | US20040125515 Electronic assembly/system with reduced cost, mass, and volume and increased efficiency and power density |