| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 07/29/2004 | US20040144418 Solar cell module |
| 07/28/2004 | EP1441389A2 Electronic parts packaging structure and method of manufacturing the same |
| 07/28/2004 | EP1441232A2 Method for connecting electronic components |
| 07/28/2004 | EP0801815B1 Electrical circuit suspension system |
| 07/28/2004 | CN2629223Y 芯片模块 Chip Module |
| 07/28/2004 | CN1516927A High-frequency coposite switch module and mobile communication device using the same |
| 07/28/2004 | CN1516917A Electron tunneling device |
| 07/28/2004 | CN1516898A Semconductor device and mfg. method thereof |
| 07/28/2004 | CN1516253A Semiconductor device and its mfg. method |
| 07/28/2004 | CN1516097A Light-emitting diode matrix display and exciting circuit |
| 07/28/2004 | CN1159762C Process for preparing integrated electric and electronic module based on discrete elements |
| 07/27/2004 | US6768660 Multi-chip memory devices and modules including independent control of memory chips |
| 07/27/2004 | US6768208 Multiple chips bonded to packaging structure with low noise and multiple selectable functions |
| 07/27/2004 | US6768207 Multichip wafer-level package and method for manufacturing the same |
| 07/27/2004 | US6768195 Multi-chip semiconductor device |
| 07/27/2004 | US6768193 Heat transfer structure for a semiconductor device utilizing a bismuth glass layer |
| 07/27/2004 | US6768191 Electronic component with stacked electronic elements |
| 07/27/2004 | US6768190 Stack type flip-chip package |
| 07/27/2004 | US6768189 High power chip scale package |
| 07/27/2004 | US6768163 Nonvolatile semiconductor memory device and nonvolatile semiconductor memory system |
| 07/27/2004 | US6767815 Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methods |
| 07/27/2004 | US6767140 Ceramic optical sub-assembly for opto-electronic module utilizing LTCC (low-temperature co-fired ceramic) technology |
| 07/27/2004 | US6767112 Projection lamp with led matrix panel |
| 07/22/2004 | WO2004061962A2 Multi-layer integrated semiconductor structure |
| 07/22/2004 | WO2004061961A1 Multi-layer integrated semiconductor structure having an electrical shielding portion |
| 07/22/2004 | WO2004061954A2 Electronic unit integrated into a flexible polymer body |
| 07/22/2004 | WO2004061953A2 Method of forming a multi-layer semiconductor structure incorporating a processing handle member |
| 07/22/2004 | WO2004061952A2 Method of forming a multi-layer semiconductor structure having a seamless bonding interface |
| 07/22/2004 | WO2003003421A3 Optical chip packaging via through hole |
| 07/22/2004 | US20040142603 Attachable modular electronic systems |
| 07/22/2004 | US20040142575 Large area printing method for integrating device and circuit components |
| 07/22/2004 | US20040142574 Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument |
| 07/22/2004 | US20040142540 Wafer bonding for three-dimensional (3D) integration |
| 07/22/2004 | US20040142539 Semiconductor device and method of fabrication thereof, optical module and method of fabrication thereof, circuit board, and electronic instrument |
| 07/22/2004 | US20040142509 Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument |
| 07/22/2004 | US20040142506 Methods for designing bond pad rerouting elements for use in stacked semiconductor device assemblies and for assembling semiconductor devices |
| 07/22/2004 | US20040141298 Ball grid array package construction with raised solder ball pads |
| 07/22/2004 | US20040141296 Stress resistant land grid array (LGA) module and method of forming the same |
| 07/22/2004 | US20040140877 Microconverter and laminated magnetic-core inductor |
| 07/22/2004 | US20040140764 Light emitting diode device and method of fabricating the devices |
| 07/22/2004 | US20040140573 Semiconductor package and fabrication method thereof |
| 07/22/2004 | US20040140559 Electronic device configured as a multichip module, leadframe, panel with leadframe positions, and method for producing the electronic device |
| 07/22/2004 | US20040140555 Semiconductor device |
| 07/22/2004 | US20040140552 Semiconductor device |
| 07/22/2004 | US20040140549 Wiring structure and its manufacturing method |
| 07/22/2004 | US20040140547 Semiconductor chip and method for manufacturing the same |
| 07/22/2004 | US20040140546 [stack chip package structure] |
| 07/22/2004 | US20040140544 Semiconductor device |
| 07/22/2004 | US20040140538 Flex-based ic package construction employing a balanced lamination |
| 07/22/2004 | US20040140002 Apparatus, system, and method of mechanically coupling photovoltaic modules |
| 07/22/2004 | DE19806550B4 Elektronisches Bauelement, insbesondere mit akustischen Oberflächenwellen arbeitendes Bauelement - OFW-Bauelement Electronic component, in particular operating with acoustic surface waves component - SAW component |
| 07/22/2004 | DE10322021A1 Lichtsender mit einer spannungsabhängigen Widerstandsschicht Light source with a voltage-dependent resistor layer |
| 07/22/2004 | DE10308871B3 Semiconductor chip for use in semiconductor chip stack in complex electronic circuit with surface structure for alignment of stacked semiconductor chip |
| 07/22/2004 | DE10301091A1 Method for connection of semiconductor devices on common substrate e.g. for automobile applications, requires conductive flat contact stirrup between first and second semiconductor devices |
| 07/22/2004 | DE10300711A1 Halbleiterchipstapel und Verfahren zur Passivierung eines Halbleiterchipstapels Semiconductor chip stack and method for passivating a semiconductor chip stack |
| 07/22/2004 | DE10261365A1 Optoelectronic component for generating white or colored mixed light, has semiconductor chip equipped with luminance-conversion element. |
| 07/21/2004 | EP1439584A1 Light emitting device using led |
| 07/21/2004 | EP1439576A2 Through hole manufacturing method |
| 07/21/2004 | EP1439397A2 Method of performing a burn-in |
| 07/21/2004 | EP1438745A2 Multiple die interconnect system |
| 07/21/2004 | EP1438744A2 Method of forming a raised contact for a substrate |
| 07/21/2004 | EP1438741A2 Adhesive wafers for die attach application |
| 07/21/2004 | EP1438740A2 Method for packing electronic modules and multiple chip packaging |
| 07/21/2004 | EP1166361A4 Apparatus and method for an integrated circuit having high q reactive components |
| 07/21/2004 | CN2627655Y Light-emitting diode structure |
| 07/21/2004 | CN2627654Y 热电模块 Thermoelectric Modules |
| 07/21/2004 | CN2627647Y Stack apparatus of integrated circuit packaging housing |
| 07/21/2004 | CN2627354Y Electronic color bleeding lamp |
| 07/21/2004 | CN1514498A Luminuous crystal grain parallel packaging method |
| 07/21/2004 | CN1514497A Luminuous crystal grain series packaging method |
| 07/21/2004 | CN1158700C Storage assembly with self-aligning non-integrated capacitor arrangement |
| 07/20/2004 | US6765299 Semiconductor device and the method for manufacturing the same |
| 07/20/2004 | US6765292 Contact structure for semiconductor device |
| 07/20/2004 | US6765288 Stacked chip mounting without special prepackaged unit |
| 07/20/2004 | US6765287 Three-dimensional stacked semiconductor package |
| 07/20/2004 | US6765285 Power semiconductor device with high radiating efficiency |
| 07/20/2004 | US6765279 Membrane 3D IC fabrication |
| 07/20/2004 | US6765275 Two-layer electrical substrate for optical devices |
| 07/20/2004 | US6765268 Multiple transistors having a common gate pad between first group of drains and second group of drains |
| 07/20/2004 | US6765236 Optical device and method for manufacturing the same, and electronic apparatus |
| 07/20/2004 | US6765152 Multichip module having chips on two sides |
| 07/20/2004 | US6764935 Stereolithographic methods for fabricating conductive elements |
| 07/20/2004 | US6764933 Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methods |
| 07/20/2004 | US6763578 Method and apparatus for manufacturing known good semiconductor die |
| 07/15/2004 | WO2004059749A1 Light emitting diode lamp and manufacturing method thereof |
| 07/15/2004 | WO2004059720A1 Three-dimensional device fabrication method |
| 07/15/2004 | WO2004049424A3 Microelectronic packaging and components |
| 07/15/2004 | WO2003061005A3 Lower profile package for an integrated circuit with power supply in package |
| 07/15/2004 | US20040137664 Advanced packaging shell for pocketable consumer electronic devices |
| 07/15/2004 | US20040137662 Device transfer method and panel |
| 07/15/2004 | US20040137661 Semiconductor device manufacturing method |
| 07/15/2004 | US20040137660 Method for manufacturing semiconductor device and semiconductor device |
| 07/15/2004 | US20040136259 Memory structure, a system, and an electronic device, as well as a method in connection with a memory circuit |
| 07/15/2004 | US20040136197 Vehicular headlamp employing semiconductor light source |
| 07/15/2004 | US20040135645 Piezoelectric oscillator manufacturing method thereof, and electronic device |
| 07/15/2004 | US20040135262 Semiconductor device and a method of manufacturing the same |
| 07/15/2004 | US20040135250 MCM package with bridge connection |
| 07/15/2004 | US20040135248 Semiconductor device |
| 07/15/2004 | US20040135245 Wafer with semiconductor chips mounted thereon |
| 07/15/2004 | US20040135243 Semiconductor device, its manufacturing method and electronic device |